KR-102963653-B1 - BOTTOM AND MIDDLE EDGE RINGS

Abstract

A bottom ring is configured to support a movable edge ring. The edge ring is configured to rise and fall relative to a substrate support. The bottom ring includes a stepped upper surface, an annular inner diameter, an annular outer diameter, a lower surface, and a plurality of vertical guide channels provided penetrating the bottom ring from the lower surface to the upper surface of the bottom ring. Each of the guide channels includes a first region having a diameter smaller than that of the guide channel, and the guide channels are configured to receive respective lift pins to raise and lower the edge ring.

Inventors

• 라쓰나신게, 히란 라지따
• 토카이린, 숀 이 에스
• 맥체스니, 존

Assignees

• 램 리써치 코포레이션

Dates

Publication Date

20260511

Application Date

20171121

Claims (14)

1. In a lower ring configured to support a movable edge ring, the movable edge ring is configured to rise and fall relative to a substrate support during the processing of a substrate, and the lower ring is, Stepped upper surface; annular inner diameter; annular outer diameter; Lower surface; A plurality of vertical guide channels provided penetrating the lower ring from the lower surface to the upper surface of the lower ring, wherein each of the guide channels comprises a first region having a smaller diameter than other parts of the guide channel, and the guide channels are configured to accommodate respective lift pins to raise and lower the movable edge ring; A guide feature extending upward from the lower ring, wherein the guide feature has an annular inner diameter larger than the annular inner diameter of the lower ring and an annular outer diameter smaller than the annular outer diameter of the lower ring, and the guide channels pass through the guide feature; and An inner annular rim extending upward from the lower ring and positioned radially inward with respect to the guide feature, wherein the guide feature and the inner annular rim form an annular groove along the upper surface, and The upper surface comprises at least five alternating vertical surfaces and horizontal surfaces, and The lower ring above is a lower ring formed integrally.
2. In Article 1, A lower ring, the diameter of the other parts of the guide channel is 0.063" to 0.067".
3. In Article 1, Each of the above guide channels includes a cavity on the lower surface of the lower ring, and the cavities have a larger diameter than the other parts of the guide channels, the lower ring.
4. In Paragraph 3, The transition sections between the guide channels and the cavities are chamfered, lower ring.
5. In Article 4, The above chamfered transitions are a bottom ring having a height and width of 0.020" to 0.035" and an angle of 40° to 50°.
6. In Article 1, A lower ring having an inner diameter of at least 13.0" for the stepped portion within the upper surface.
7. In Article 1, The above guide feature is a lower ring comprising the first regions of the above guide channels.
8. In Article 1, The height of the above guide feature is smaller than the height of the above inner annular rim, the lower ring.
9. In Article 1, A lower ring in which at least one of the first upper corner portion and the second upper corner portion of the above guide feature is chamfered.
10. In Article 1, The vertical surfaces are parallel to the direction of movement in which the movable edge ring rises and falls, and the horizontal surfaces are perpendicular to the vertical surfaces, forming a bottom ring.
11. In Article 1, The upper surface comprises at least 5 directional changes, a lower ring.
12. In Article 1, The inner annular rim is a lower ring having an annular inner diameter equal to the annular inner diameter of the lower ring.
13. In Article 1, A lower ring further comprising a vertical downward portion extending downward from the lower ring, wherein the vertical downward portion has an annular inner diameter larger than the annular inner diameter of the guide feature and an annular outer diameter smaller than the annular outer diameter of the guide feature.
14. In Article 13, The above vertical downward portion is a lower ring having an annular outer diameter equal to the annular outer diameter of the above lower ring.

Description

Bottom Ring and Middle Edge Rings Cross-reference regarding related applications This specification relates to the subject matter of International Patent Application No. PCT/US2017/043527 filed July 24, 2017. The full specification of the referenced application is incorporated herein by reference. This specification relates to movable edge rings of substrate processing systems. The description of the background technology provided in this specification is generally intended to provide context for this specification. Achievements of the inventors to the extent described in this background technology section, and aspects of the technology that may not have been recognized as prior art at the time of filing, are not explicitly or implicitly recognized as prior art with respect to this specification. Substrate processing systems may be used to process substrates such as semiconductor wafers. Exemplary processes that may be performed on a substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), conductor etching, and/or other etching, deposition, or cleaning processes. The substrate may be placed on a substrate support such as a pedestal, an electrostatic chuck (ESC), etc., of the processing chamber of the substrate processing system. During etching, a gas mixture containing one or more precursors may be introduced into the processing chamber, and a plasma may be used to specify chemical reactions. The substrate support may include a ceramic layer configured to support a wafer. For example, the wafer may be clamped to the ceramic layer during processing. The substrate support may include an edge ring disposed around the perimeter of the outer portion of the substrate support (e.g., adjacent to the outer and/or periphery). The edge ring may be provided to confine the plasma to a volume on the substrate, protect the substrate support from corrosion caused by the plasma, etc. A bottom ring is configured to support a movable edge ring. The edge ring is configured to rise and fall relative to a substrate support. The bottom ring includes a stepped upper surface, an annular inner diameter, an annular outer diameter, a lower surface, and a plurality of vertical guide channels provided from the lower surface of the bottom ring through the bottom ring to the upper surface. Each of the guide channels includes a first region having a diameter smaller than the guide channel, and the guide channels are configured to receive respective lift pins to raise and lower the edge ring. In other features, the diameter of the guide channels is 0.063" to 0.067". Each of the guide channels includes a cavity on the lower surface of the bottom ring, and the cavities have a larger diameter than the guide channels. The transitions between the guide channels and the cavities are chamfered. The chamfered transitions have a height and width of 0.020" to 0.035" and an angle of 40° to 50°. The inner diameter of the step within the upper surface is at least 13.0". In other features, it includes a guide feature extending upward from the upper surface of the lower ring. Guide channels pass through the guide feature. The guide feature includes first regions of the guide channels. The upper surface includes an inner annular rim, and the guide feature and the inner annular rim form a groove. The height of the guide feature is higher than the height of the inner annular rim. At least one of the first upper corner and the second upper corner of the guide feature is chamfered. The upper surface includes an inner annular rim and an outer annular rim, and the guide feature and the inner annular rim form a first groove, and the guide feature and the outer annular rim form a second groove. In other features, the upper surface includes at least two changes in direction. The upper surface includes at least five changes in direction. The upper surface includes at least five alternating vertical and horizontal paths. The lower ring has a first outer diameter and a second outer diameter larger than the first outer diameter. The lower ring includes an annular lip extending radially outward from the outer diameter of the lower ring. The lower surface includes a plurality of cavities configured to be aligned with the bolt holes of the base plate of the substrate support. An intermediate ring is positioned on a lower ring and configured to support a movable edge ring. The edge ring is configured to rise and fall relative to a substrate support. The intermediate ring includes a stepped upper surface, an annular inner diameter, an annular outer diameter, a lower surface, a guide feature forming the annular outer diameter, an inner annular rim forming the annular inner diameter, and a groove formed between the guide feature and the inner annular rim. In other features, at least one of the first upper corner and the second upper corner of the guide feature is chamfered. The intermediate ring is "U" shaped. The upper surfa