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KR-102963664-B1 - SUBSTRATE PROCESSING SYSTEM

KR102963664B1KR 102963664 B1KR102963664 B1KR 102963664B1KR-102963664-B1

Abstract

The present invention relates to a substrate processing system, and provides a substrate processing system that transfers a substrate supplied from a loader unit in an inline manner, cleans it by a cleaning unit, inspects the cleaning state of the substrate cleaned by the cleaning unit by an inspection unit, and then transfers it to the next process.

Inventors

  • 최우철
  • 이주성
  • 박종수
  • 윤철남

Assignees

  • 주식회사 케이씨텍

Dates

Publication Date
20260513
Application Date
20200630

Claims (20)

  1. A loader unit that supplies a substrate formed of a glass material that is folded in a folding area; An inline cleaning unit that cleans a substrate supplied from a loader unit while transporting it inline; An inspection unit for inspecting the cleaning status of a substrate cleaned in the above cleaning unit; An unloading unit that returns the substrate inspected by the above inspection unit to the next process; A substrate processing system configured to include, wherein the substrate is cleaned while being transported in a state in which it is seated on a tray having a stepped recess that prevents contact with a mounting plate that mounts the substrate on the lower side of the folding area.
  2. In claim 1, the inline cleaning unit is, A first conveyor belt that transports the above substrate in a mounted state with its front surface facing upward; A first cleaning solution spraying unit that sprays a cleaning solution toward the front surface of the substrate being transported on the first conveyor belt; A second conveyor belt that transports the above substrate in a mounted state with its rear side facing upward; An inversion conveyor that flips the substrate being conveyed on the first conveyor belt 180 degrees and conveys it to the second conveyor belt; A second cleaning solution spraying unit that sprays a cleaning solution toward the rear surface of the substrate being transported on the second conveyor belt; A substrate processing system characterized by including
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  4. A loader unit that supplies a substrate; An inline cleaning unit comprising: a first conveyor belt formed with a width smaller than the width of the substrate, passing through a first cleaning liquid spraying unit that cleans the front surface of the substrate supplied by the loader unit while mounted so that the front surface of the substrate faces upward; a second conveyor belt that passes through a second cleaning liquid spraying unit that cleans the rear surface of the substrate while mounted so that the rear surface of the substrate faces upward; and an inversion conveyor that flips the substrate on the first conveyor belt 180 degrees and mounts it on the second conveyor belt by providing a fork that supports the rear surface of the substrate exposed outside the width direction of the first conveyor belt; An inspection unit for inspecting the cleaning status of a substrate cleaned in the above cleaning unit; An unloading unit that returns the substrate inspected by the above inspection unit to the next process; A substrate processing system characterized by being composed including
  5. In Paragraph 4, A substrate processing system characterized by having a suction hole formed in the fork to apply suction pressure to the substrate.
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  10. In Article 1, A dry cleaning unit that cleans a substrate by spraying CO2 onto a substrate received between the inspection unit and the unloading unit; A re-inspection unit for inspecting the cleaning state cleaned by the above dry cleaning unit; A substrate processing system characterized by including additional features.
  11. In Article 10, A substrate processing system characterized by the fact that substrate cleaning in the above dry cleaning unit is performed only when the foreign substance inspection result for the substrate in the above inspection unit exceeds the allowable limit.
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  13. In Article 1, A substrate processing system characterized in that the tray above has a mounting plate formed of a porous material for mounting the substrate, and suction pressure is applied to the substrate on the mounting plate to fix the position of the substrate.
  14. In Paragraph 13, A substrate processing system characterized in that the above mounting plate is formed of either ceramic or metal.
  15. In Paragraph 13, A substrate processing system characterized in that the mounting plate above is subjected to a surface treatment that prevents static electricity.
  16. In Paragraph 15, A substrate processing system characterized in that the upper surface of the mounting plate is surface-treated by Teflon coating or ion treatment.
  17. In Paragraph 15, A substrate processing system characterized by having a porous film coated on the upper surface of the mounting plate.
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  19. In claim 1, the inspection unit is, The apparatus includes a fixing block for fixing a substrate with one end of the substrate supported, a tensioning block for fixing the substrate with the other end supported, a driving unit for moving the tensioning block away from the fixing block to impart a displacement in the tensioning direction to the substrate, and a load sensor installed between the driving unit and the tensioning block to measure the tensioning force applied to the substrate, and inspects the cleaning state of the substrate cleaned in the cleaning unit; A substrate processing system characterized in that the above tension block and the above fixing block suck and fix the end of the substrate, and when the value measured by the load sensor reaches a predetermined value, no further displacement in the tension direction by the driving unit is generated.
  20. In Paragraph 19, A substrate processing system characterized by the above inspection unit photographing and inspecting the upper and lower surfaces of the substrate while the substrate is unfolded without sagging.

Description

Substrate Processing System The present invention relates to a substrate processing system, and more specifically, to a substrate processing system that performs a cleaning process to remove foreign substances remaining on the surface of a foldable ultra-thin glass substrate (UTG) with a thickness of several micrometers to tens of micrometers in a shorter time without reducing the durability of the glass substrate or causing damage. Recently, glass substrates used in portable devices are becoming increasingly thinner, and there is a growing need for cleaning methods to use thin substrates in portable devices without errors. Conventionally, a cleaning process was performed on one surface of a substrate (G) using a cleaning solution according to the configuration shown in FIG. 1 and FIG. 2. That is, as shown in FIG. 1, a substrate is supplied to a substrate loader (10), and when the supplied substrate is supplied to a substrate cleaning unit (20), the substrate (G) is mounted on a stand (22) in the substrate cleaning unit (20) shown in FIG. 2. Then, a cleaning solution (25a) is supplied from the cleaning solution supply unit (28) to the cleaning solution spray nozzle (25) and applied to the surface of the substrate (G) to clean the surface of the substrate (G). Then, the cleaned substrate (G) is discharged by the substrate unloader (30) and transferred to the next process. However, the existing substrate processing system (9) described above had a problem in that it caused defects when applied to a portable device when the back surface of the substrate (G) was contaminated, as it only cleaned one surface of the substrate (G). Meanwhile, although a method for cleaning both sides of a substrate (G) using a conventional substrate processing system (9) has been proposed, in the case of a glass substrate (G) used in a flexible display device with a thickness of 100 μm or less, the process of gripping the substrate (G) and flipping it 180 degrees causes a very difficult problem. Therefore, there is an urgent need for a method to perform cleaning on both sides of a glass substrate with a thickness of 100 μm or less without damaging the substrate and while reducing the cleaning time. At the same time, when the entire surface of the substrate (G) is used as an active area, there is no dead zone; therefore, gripping a part of the substrate (G) in a gripping manner is undesirable because there is a high possibility that the active area will be damaged. Accordingly, a method for gripping without damaging the substrate is required when the entire surface of the substrate is an active area. In particular, as glass substrates for displays used in portable devices are recently being applied in a foldable form, there is an urgent need to ensure that the bending strength at the folding portion of the glass substrate does not decrease during the cleaning process. That is, when a tray is used to fix the position of the substrate (G) during the cleaning process of the substrate (G), the process of placing the substrate (G) on multiple trays and then moving it to another tray is repeated, and in this process, the bending strength in the folding area of the substrate (G) is reduced, and a problem of reduced durability occurs when applied as a flexible display device capable of bending. FIG. 1 is a block diagram illustrating the configuration of a conventional substrate processing system, FIG. 2 is a drawing illustrating the configuration of the substrate cleaning unit of FIG. 1. FIG. 3 is a block diagram illustrating the configuration of a substrate processing system according to an embodiment of the present invention, FIG. 4a is a drawing illustrating the configuration of the inline liquid cleaning unit of FIG. 3. FIG. 4b is a plan view illustrating a configuration in which a substrate is transported by the first inline transport unit of FIG. 4a. FIGS. 5a to 5c are drawings illustrating the configuration of an inspection unit for inspecting a substrate cleaned in the inline liquid cleaning unit of FIG. 4a. FIG. 6 is a diagram showing the distribution of foreign substances on a substrate inspected in an inspection unit. FIG. 7 is a diagram illustrating the configuration of a dry cleaning unit in which a dry cleaning process of a substrate is performed. FIG. 8a is a cross-sectional view illustrating the configuration of a substrate tray used in an inspection unit, FIG. 8b is a plan view illustrating a different form of a substrate tray used in an inspection unit, FIG. 9 is a drawing illustrating a cleaning process by a first CO2 cleaning nozzle in the first cleaning area of FIG. 7. FIGS. 10a to 10c are drawings illustrating the configuration of an inverter for inverting a substrate in which cleaning of one side is completed in the first cleaning area of FIG. 7. FIG. 11 is a drawing illustrating a cleaning process by a second CO2 cleaning nozzle in the second cleaning area of FIG. 7. FIG. 12 is a diagram illustrating the configuratio