KR-102963701-B1 - Method for manufacturing silicon workpieces using a kit for manufacturing silicon workpieces with applied patterns

Abstract

The present invention relates to a kit for producing a silicone processed product with a pattern and a method for manufacturing a silicone processed product using the same, comprising: a first step of preparing a mold of a certain shape (plastic, iron, stainless steel, etc.) by placing it on a pattern paper with a pattern; a second step of injecting liquid silicone for injection into the inner space of the mold so that it spreads to a predetermined thickness on the inner side of the mold; a third step of covering the liquid silicone with a sealing sheet; a fourth step of applying pressure with a weight plate to the upper surface of the sealing sheet so that the liquid silicone for injection is compressed to a predetermined thickness to form a plate-shaped silicone pad, and then leaving it for a predetermined time to cure; a fifth step of separating the weight plate from the sealing sheet and then separating the silicone pad attached to the sealing sheet together with the sealing sheet from the mold and the pattern paper; and a sixth step of removing the sealing sheet from the silicone pad separated in the fifth step to obtain a finished silicone pad product.

Inventors

• 이영희
• 김용환

Assignees

• (주) 디와이실리콘

Dates

Publication Date

20260512

Application Date

20250612

Claims (3)

1. Process 1: Preparing by placing a frame of a specific shape on pattern paper; A second process of injecting liquid silicone for injection into the inner space of the above mold to spread it to a predetermined thickness on the inner side of the mold; 3rd process of covering the top of the liquid silicone with a sealing sheet; A fourth process of applying pressure with a weight plate to the upper surface of the above-mentioned sealing sheet so that the liquid silicone for injection molding is compressed to a predetermined thickness to form a plate-shaped silicone pad, and then leaving it for a predetermined time to cure; Step 5, separating the above weight plate from the sealing sheet, and then separating the silicone pad attached to the sealing sheet together with the sealing sheet from the frame and the pattern sheet; A 6th process of removing a sealing sheet from the silicone pad separated in the above 5th process to obtain a finished silicone pad product; comprising The above 2nd process involves placing the liquid silicone for injection molding into a mixer, mixing it to ensure uniform dispersion, mixing at 20 to 30 rpm to prevent heat generation, and removing bubbles through vacuum degassing to prevent bubbles from forming during mixing. The above vacuum degassing involves placing the mixed silicone composition into a vacuum chamber to remove air, causing bubbles to expand under vacuum conditions, rise to the surface, and burst. A degassing agent is added to the above-mentioned mixed silicone composition, and The above silicone liquid for injection molding is It is a mixture of vinyl-terminated polysiloxane, fumed silica, methyl-terminated polysiloxane, platinum-1,3-divinyl-1,1,3,3-tetramethyl-disiloxane-complex, methylhydrosiloxane-dimethylsiloxane copolymers, and hydride-terminated polydimethylsiloxane. The above-mentioned mixed silicone liquid for injection is placed into an injector, and the injector is injected into the mold of the pattern paper so that it is spread evenly to a predetermined thickness on the inside of the mold, and The above-described injector comprises rail members mounted on both outer sides of a pattern sheet, a transverse bar connected to both rail members and moving along the rail members and spaced apart from the pattern sheet at a predetermined distance, a tank coupled to the transverse bar and moving along the transverse bar and filled with liquid silicone for injection, a discharge nozzle formed at the bottom of the tank, a piston coupled to the inside of the tank, and a cylinder unit mounted on the outside of the tank to pressurize the piston. A method for manufacturing a silicone workpiece using a kit for producing a silicone workpiece with a pattern applied, characterized in that the above-mentioned discharge nozzle is formed to inject liquid silicone for injection into the interior of a mold or spray it, and a scraper is formed around a nozzle hole formed at the end of the discharge nozzle to spread the sprayed liquid silicone for injection evenly.
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Description

Method for manufacturing silicon workpieces using a kit for manufacturing silicon workpieces with applied patterns The present invention relates to a method for manufacturing a silicon workpiece using a kit for producing a silicon workpiece with an applied pattern. Generally, silicone compositions are used in a wide range of industrial fields because they form cured products with excellent heat resistance, cold resistance, electrical insulation, weather resistance, water repellency, and transparency. Since these silicon compositions are resistant to discoloration and exhibit minimal degradation of physical properties compared to other organic materials, they are also suitable as encapsulators for optical materials and semiconductor devices. In addition, silicone rubber is widely used in various fields by utilizing its excellent heat resistance, cold resistance, and electrical properties. In addition, silicone rubber has been used as a mold-forming material because of its good release properties. In fields such as electronic devices, office equipment, home appliances, and automotive parts, it was observed that sample molding, used during the product development stage or sample manufacturing, is effective in reducing costs and time; consequently, addition reaction curing type liquid silicone rubber compositions have been widely used from the perspective of workability. These silicone rubber compositions are generally supplied in the form of compositions containing organopolysiloxane with a high degree of polymerization and reinforcing fillers. The composition is manufactured by mixing reinforcing fillers or various dispersants into the raw polymer using a mixing device such as a universal mixer or a kneader. Reinforcing fillers such as organopolysiloxane or silica are electrical insulating materials, and the silicone rubber composition obtained by incorporating them, as well as the cured silicone rubber product, become charged upon contact with various substances, generating static electricity. Furthermore, they adsorb dust in the air, protrusions of molding resins such as polyurethane resin and epoxy resin, and destructive materials, resulting in a disadvantage of very poor workability. Conventionally, to manufacture thin plate-shaped silicone products, a method of injection molding was used in which a silicone composition was injected into a mold, but there was a disadvantage that the shape was damaged or partial damage occurred during the demolding process because the thickness of the product was thin. FIG. 1 is a process flow diagram showing a method for manufacturing a silicon workpiece using a kit for manufacturing a silicon workpiece with a pattern applied according to the present invention. FIG. 2 is a perspective view showing a ‘frame (100)’ according to the present invention, FIG. 3 is a cross-sectional view of the ‘frame (100)’ in FIG. 2 above, FIG. 4 is an enlarged view of the 'frame (100)' in FIG. 2 above. FIG. 5 is a drawing showing the process of injecting a liquid silicone into the inner space of a mold (100) in the present invention. FIG. 6 is a drawing showing an 'injector' that injects liquid silicone into the inner space of a mold (100) in the present invention. FIG. 7 is a drawing showing the 'nozzle of the injector' in FIG. 6 above. FIG. 8 is a drawing showing the process of separating the upper plate and the silicone workpiece from the mold (100) in the present invention. FIG. 9 is a diagram showing the 6th process of obtaining a finished silicone pad product by removing the sealing paper in the present invention. FIG. 10 is a photograph serving as a drawing showing a finished silicone pad product according to the present invention. Hereinafter, embodiments are described in detail with reference to the attached drawings. However, various modifications may be made to the embodiments, and thus the scope of the patent application is not limited or restricted by these embodiments. It should be understood that all modifications, equivalents, and substitutions to the embodiments are included within the scope of the rights. Specific structural or functional descriptions of the embodiments are disclosed for illustrative purposes only and may be modified and implemented in various forms. Accordingly, the embodiments are not limited to the specific disclosed forms, and the scope of this specification includes modifications, equivalents, or substitutions that fall within the technical concept. Terms such as "first" or "second" may be used to describe various components, but these terms should be interpreted solely for the purpose of distinguishing one component from another. For example, the first component may be named the second component, and similarly, the second component may be named the first component. When it is stated that a component is "connected" to another component, it should be understood that it may be directly connected to or coupled with that other component, or that there may b