KR-102963712-B1 - Component mounting apparatus

KR102963712B1KR 102963712 B1KR102963712 B1KR 102963712B1KR-102963712-B1

Abstract

The present invention relates to a component mounting device, wherein the device sets an offset that minimizes the distance between the center of a lead formed on a component and the center of a mounting point formed on a substrate, and mounts a component on a substrate according to the set offset. A component mounting device according to an embodiment of the present invention includes a head having at least one nozzle for transporting a component, and a control unit for controlling the head such that a pre-selected lead among a plurality of leads provided on the component aligns with a mounting point on the substrate.

Inventors

이수한
신대건
박영민

Assignees

한화세미텍 주식회사

Dates

Publication Date: 20260511
Application Date: 20211129

Claims (6)

A head for transporting parts equipped with at least one nozzle; and A control unit that controls the head so that a pre-selected lead among a plurality of leads provided in the above component aligns with a mounting point on the substrate, The above control unit is, Among a plurality of leads provided in the above-mentioned part, a lead is selected such that the sum of the distances between the lead selected above the horizontal line crossing the center of the part and the center of the part is included within a pre-set threshold error with respect to the sum of the distances between the lead selected below the horizontal line and the center of the part, and A component mounting device for selecting leads such that, among a plurality of leads provided in the component, the sum of the distances between a lead selected from the left side of a vertical line crossing the center of the component and the center of the component is included within a pre-set threshold error with respect to the sum of the distances between a lead selected from the right side of the vertical line and the center of the component.
In Article 1, The above control unit is, A component mounting device that controls the head so that among a plurality of leads provided in the component, the lead furthest from the horizontal line crossing the center of the component and closest to both sides of the vertical line crossing the center of the component, and the lead furthest from the vertical line and closest to both sides of the horizontal line, align with the mounting point of the substrate.
In Article 1, The above control unit is a component mounting device that controls the head so that a lead selected by a user among a plurality of leads provided in the component matches the mounting point of the substrate.
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In Article 1, The above control unit is, Expand the number of leads selected from the upper or lower side of the horizontal line so that the sum of the distances between the lead selected from the upper side of the horizontal line and the center of the component is included within a pre-set threshold error with respect to the sum of the distances between the lead selected from the lower side of the horizontal line and the center of the component, and A component mounting device that expands the number of leads selected on the left or right side of a vertical line such that the sum of the distances between a lead selected on the left side of the vertical line and the center of the component is included within a pre-set threshold error for the sum of the distances between a lead selected on the right side of the vertical line and the center of the component.
In Article 1, A component mounting device in which the control unit determines the position of the component on the substrate such that the distance between the center of the selected lead and the center of the mounting point is uniformly formed with respect to the center of the component.

Description

Component mounting apparatus The present invention relates to a component mounting device, and more specifically, to a component mounting device that sets an offset to minimize the distance between the center of a lead formed on a component and the center of a mounting point formed on a substrate, and mounts a component on a substrate according to the set offset. Surface Mounting Technology (SMT) is a general term for the technology of attaching components that can be mounted on the surface of a Printed Circuit Board (PCB). Specifically, the SMT process refers to a technology that prints solder paste onto a printed circuit board (PCB), mounts various surface mounting devices (SMDs) onto the printed circuit board using a mounter, and then passes the PCB through a reflow oven to bond the leads of the surface mounting devices to the PCB. An SMT line can be described as a technology that produces completed PCBs through the organic combination of multiple pieces of equipment, and depending on the working environment, at least one SMT line including multiple pieces of equipment may be provided. An SMT equipment for mounting components on a printed circuit board may include a head that transports components. The user can determine the position of the printed circuit board for mounting components by adjusting the position of the head. On the other hand, when the positioning of components on a printed circuit board is determined by the user, mounting results of varying quality may be produced depending on the user's skill level. Furthermore, due to the trend of component miniaturization, there may be limitations to the user determining the positioning of components on the printed circuit board. Therefore, there is a need for an invention that corrects the position of the head so that components are accurately mounted at the target location on the printed circuit board, regardless of the user's skill level. FIG. 1 is a drawing showing a component mounting device according to an embodiment of the present invention. Figure 2 is a diagram showing a substrate being transported by a conveyor. Figure 3 is a drawing showing the parts. Figure 4 is a drawing showing a substrate. Figure 5 is a diagram showing components attached to a substrate. Figure 6 is a drawing to explain that a lead placed at the edge of a part is selected. Figure 7 is a diagram illustrating how a lead is selected by a user. FIG. 8 is a drawing to explain that the upper and lower leads of the horizontal line of a part are selected based on the distance from the center of the part. Figure 9 is a drawing to explain that the left and right leads of a vertical line of a part are selected based on the distance from the center of the part. Figure 10 is a diagram illustrating how the number of leads is expanded based on the distance from the center of the part. FIG. 11 is a drawing illustrating the distance between a mounting point and a lead that is elongated on one side. Figure 12 is a diagram illustrating the distance between a mounting point and a lead having a radially uniform length. FIG. 13 is a diagram illustrating how the placement of components on a substrate is determined by the distance between the center of the mounting point and the center of the lead. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components. Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in a meaning that is commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise. FIG. 1 is a drawing showing a component mounting device according to an embodiment of the present invention, and FIG. 2 is a drawing showing a substrate being transported by a conveyor. Referring to FIG. 1, a component mounting device (10) according to an embodiment of the present invention comprises a conveyor (100), a component supply unit (200), a head (300), a correction camera (400), and a control unit (500). A conveyor (100) can move a substrate (30). In the present invention, the substrate (30) may be a printed circ