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KR-102963850-B1 - Liquid spray device

KR102963850B1KR 102963850 B1KR102963850 B1KR 102963850B1KR-102963850-B1

Abstract

A cleaning device (liquid spraying device) (10) comprises a nozzle (11A) for spraying a cleaning liquid (liquid), a pump (12) connected to the nozzle (11A) and pressurizing the cleaning liquid to supply it to the nozzle (11A), a valve (17) installed between the nozzle (11A) and the pump (12) to control the flow of the cleaning liquid by opening and closing, a valve control unit (21) for controlling the opening and closing of the valve (17) and outputting a frequency switching signal (signal) when the valve (17) is closed, and a pump control unit (20) for controlling the operation of the pump (12) and controlling the operation of the pump (12) to reduce the degree of pressurization to the cleaning liquid based on the frequency switching signal.

Inventors

  • 나카모리 켄타
  • 나가세 마사노리

Assignees

  • 아사히 슈낙 가부시키 가이샤

Dates

Publication Date
20260513
Application Date
20211111

Claims (13)

  1. A nozzle that sprays liquid, and A pump connected to the above nozzle and pressurizing the liquid to supply it to the nozzle, and A valve installed between the nozzle and the pump to control the flow of the liquid by opening and closing, and A valve control unit for controlling the opening and closing of the above valve, comprising at least a valve control unit that outputs a signal when the above valve is closed, and A pump control unit for controlling the operation of the above pump, comprising a pump control unit that controls the operation of the pump to alleviate the degree of pressurization to the liquid based on the above signal, and An electric motor that drives the above pump, and It is equipped with an inverter that rotates and drives the above electric motor, and The above pump has at least a plunger that pressurizes the liquid according to the rotational state of the electric motor, and The pump control unit above controls the rotational state of the electric motor by adjusting the driving frequency of the inverter, and The valve control unit closes the valve later than the timing at which the driving frequency of the inverter begins to be adjusted by the pump control unit based on the signal, and The above nozzle and the above valve are each provided in multiple numbers, A liquid injection device characterized in that the valve control unit increases the time difference between the timing of closing the valve and the timing at which the driving frequency of the inverter begins to be adjusted by the pump control unit as the number of nozzles at which the liquid injection stops due to the closing of the valve increases.
  2. A liquid injection device according to claim 1, wherein the valve control unit closes the valve at a timing before the pressure of the liquid, which is lowered as the driving frequency of the inverter is adjusted based on the signal, becomes zero.
  3. A nozzle that sprays liquid, and A pump connected to the above nozzle and pressurizing the liquid to supply it to the nozzle, and A valve installed between the nozzle and the pump to control the flow of the liquid by opening and closing, and A valve control unit for controlling the opening and closing of the above valve, comprising at least a valve control unit that outputs a signal when the above valve is closed, and A pump control unit for controlling the operation of the above pump, comprising a pump control unit that controls the operation of the pump to alleviate the degree of pressurization to the liquid based on the above signal, and An electric motor that drives the above pump, and It is equipped with an inverter that rotates and drives the above electric motor, and The above pump has at least a plunger that pressurizes the liquid according to the rotational state of the electric motor, and The pump control unit above controls the rotational state of the electric motor by adjusting the driving frequency of the inverter, and The valve control unit closes the valve later than the timing at which the driving frequency of the inverter begins to be adjusted by the pump control unit based on the signal, and The above valve control unit closes the valve when the driving frequency, the number of rotations per unit time of the electric motor, or the elapsed time reaches a threshold after the driving frequency begins to be adjusted by the pump control unit, and A liquid injection device characterized by having a calculation unit that calculates the threshold based on operating conditions related to the operation of at least one of the valve, the electric motor, and the inverter.
  4. A liquid injection device according to paragraph 3, wherein the valve control unit closes the valve when the driving frequency or the rotational speed reaches the threshold after the driving frequency begins to be adjusted by the pump control unit.
  5. In paragraph 3 or 4, the nozzle and the valve are provided in multiple numbers, and A liquid injection device characterized by the above-described calculation unit calculating the threshold based on the number of valves closed by the valve control unit, and as the number of valves closed by the valve control unit increases, the threshold related to the driving frequency or the rotational speed is reduced, and the threshold related to the elapsed time is increased.
  6. A liquid injection device according to claim 3 or 4, wherein the calculation unit calculates a first flow rate, which is the flow rate per unit time of the liquid supplied from the pump to the nozzle after the adjustment of the driving frequency by the pump control unit is completed, and calculates the value of the driving frequency, the rotational speed, or the elapsed time as the threshold at the timing when the second flow rate, which is the flow rate that changes as the driving frequency is adjusted by the pump control unit, matches the first flow rate.
  7. A liquid injection device according to claim 6, wherein the calculation unit calculates the value of the elapsed time at the timing when the second flow rate matches the first flow rate as the threshold, and calculates the threshold of the rotational speed based on the calculated threshold of the elapsed time and the rate of change of the rotational speed, which is the rotational speed per unit time that changes as the driving frequency is adjusted by the pump control unit.
  8. In claim 7, the device is equipped with a memory unit that stores a plurality of rotational speed change rates, which differ according to an initial value of the rotational speed before the driving frequency begins to be adjusted by the pump control unit, in a manner that connects the initial value of the rotational speed. A liquid injection device characterized by the above-described operation unit extracting a specific rate of change in rotational speed from a plurality of rates of change in rotational speed stored in the memory unit based on the initial value of the rotational speed, and calculating the threshold of the rotational speed based on the extracted rate of change in rotational speed.
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Description

Liquid spray device The technology disclosed in this specification relates to a liquid injection device. It is known that there is a system for compensating for pressure rise that may occur within various sealed spaces of a pump device, as described in Patent Document 1 below. The pump system described in Patent Document 1 makes it possible to compensate for a pressure rise within the chamber of a pump device by operating the pump means of the pump device to compensate for a pressure rise within the chamber by adjusting the capacity of the chamber. More specifically, in one embodiment, in order to compensate for an unnecessary pressure rise in the fluid within the distribution chamber, the distribution motor is rotated in reverse to return the piston, thereby making it possible to compensate for all pressure rises within the distribution chamber. FIG. 1 is a diagram showing the configuration of the supply path of the cleaning liquid in a cleaning device according to Embodiment 1. Figure 2 is a block diagram showing the electrical configuration of the pump and valve equipped in the cleaning device. Figure 3 is a graph showing the change over time regarding the driving frequency of the inverter and the flow rate of the cleaning solution in the individual cleaning solution supply path. Figure 4 is a graph showing the change over time regarding the pressure of the cleaning solution in the individual cleaning solution supply path. FIG. 5 is a block diagram showing the electrical configuration of a pump and a valve equipped in a cleaning device according to embodiment 2. Figure 6 is a graph showing the change over time regarding the pressure of the cleaning fluid and the simulation results with five timings for closing the valve. Figure 7 is a graph showing the changes over time regarding the pressure of the cleaning solution, the flow rate of the cleaning solution, the rotational speed of the electric motor, and the driving frequency of the inverter when the elapsed time in the simulation of Figure 6 is 1.8 sec. Figure 8 is a graph showing the change over time regarding the rotational speed of an electric motor. <Embodiment 1> Embodiment 1 is explained with reference to FIGS. 1 to 4. In this embodiment, a cleaning device (liquid spraying device) (10) that cleans an object to be cleaned by spraying a cleaning liquid as a liquid is exemplified. FIG. 1 is a diagram showing the configuration of the supply path of the cleaning solution in the cleaning device (10). As shown in FIG. 1, the cleaning device (10) according to the present embodiment is used in combination with a polishing device (PD) that polishes a semiconductor wafer, and the object to be cleaned is a polishing pad (PA) that polishes the semiconductor wafer. The polishing pads (PA) equipped in the polishing device (PD) combined with the cleaning device (10) according to the present embodiment are arranged in pairs in a manner that inserts the semiconductor wafer to be polished from the top and bottom, and each is supported in a form that allows for high-speed rotation by a platen placed on the side opposite to the semiconductor wafer side. Therefore, by using this polishing device (PD), both the front and back sides of the semiconductor wafer can be polished simultaneously. As described above, a set of polishing pads (PA) in pairs and a pair of platens supporting them constitute the polishing part (PO) that polishes the semiconductor wafer in the polishing device (PD). This polishing device (PD) is equipped with two polishing sections (PO) so that two semiconductor wafers can be polished at once. A cleaning device (10) combined with a polishing device (PD) of the same configuration, as shown in FIG. 1, has at least a nozzle head (11) having a plurality of nozzles (11A) for spraying a cleaning liquid for high-pressure cleaning of a polishing pad (PA), a pump (12) that pressurizes and supplies a cleaning liquid supplied from a cleaning liquid supply source to the nozzles (11A), a cleaning liquid supply path (13) piped from the cleaning liquid supply source to the nozzle head (11) via the pump (12), a filter (14) disposed in the middle of the cleaning liquid supply path (13), a pressure sensor (15) disposed in the middle of the cleaning liquid supply path (13), a branching part (16) disposed in the middle of the cleaning liquid supply path (13), and a valve (17) disposed in the middle of the cleaning liquid supply path (13). Among these, a total of four nozzle heads (11) are installed, one pair for each of the two polishing sections (PO) equipped in the polishing device (PD). Specifically, four nozzle heads (11) are provided to correspond individually to the four polishing pads (PA) equipped in each polishing section (PO), and each is positioned to face the opposite side of the polishing pad (PA) relative to each polishing pad (PA). Each nozzle head (11) has multiple nozzles (11A) that spray cleaning liquid (e.g., six). Multiple nozzles (11A) are arranged i