KR-102963989-B1 - Substrate processing apparatus

KR102963989B1KR 102963989 B1KR102963989 B1KR 102963989B1KR-102963989-B1

Abstract

The present invention relates to a substrate processing device, and more specifically, to a substrate processing device capable of adjusting the distance between a substrate and an upper shower head or between a substrate and a lower shower head, and further capable of tilting the substrate relative to the upper shower head or tilting the lower shower head relative to the substrate.

Inventors

장경호
강민욱
윤병호
홍준호

Assignees

주식회사 테스

Dates

Publication Date: 20260512
Application Date: 20231218

Claims (14)

A chamber providing a processing space for a substrate; An upper shower head provided at the upper part inside the chamber; A substrate support member provided inside the chamber to support the substrate; A lower shower head assembly having a drive bar extended downward and supplied with process gas toward the lower surface of the substrate, provided on the inner side of the substrate support member; A first lifting/lowering unit having a first lifting/lowering plate and a first vertical connecting bar connected to the above driving bar to raise/lower the lower shower head assembly and adjust the gap between the substrate and the lower shower head assembly; A first tilting unit having a first tilting plate connected to the first vertical connecting bar to tilt the lower shower head assembly relative to the substrate; A second lifting/lowering unit having a second lifting/lowering plate and a second vertical connecting bar connected to the substrate support to raise and lower the substrate support and the lower shower head assembly to adjust the gap between the substrate and the upper shower head; and It includes a second tilting unit having a second tilting plate connected to the second vertical connecting bar to tilt the substrate support and the lower shower head assembly, thereby tilting the substrate relative to the upper shower head. The first tilting plate is connected to the second lifting/lowering plate, so that when the second lifting/lowering unit is driven, the substrate support and the lower shower head assembly move up and down as a single unit and adjust the upper gap with the upper shower head, and The first lifting/lowering unit individually lifts/lowers only the lower shower head assembly independently of the operation of the second lifting/lowering unit to adjust the lower gap with the substrate, and A substrate processing device characterized in that the first vertical connecting bar and the second vertical connecting bar are arranged symmetrically with respect to the driving bar.
In paragraph 1, The above-mentioned first lifting/lowering unit is A substrate processing device characterized by further comprising a first lifting/lowering drive unit for lifting/lowering the first lifting/lowering plate.
In paragraph 2, The first lifting/lowering drive unit is connected to the first vertical connecting bar, and A substrate processing device characterized in that the first lifting/lowering plate moves up and down along the first vertical connecting bar.
In paragraph 1, The above-mentioned first tilting unit is The first tilting plate connected to the drive bar and the first vertical connecting bar of the lower shower head assembly, and A substrate processing device characterized by having a first tilting drive unit for tilting the first tilting plate.
In paragraph 4, A substrate processing device characterized by the first lifting/lowering plate, which is connected to the drive bar of the lower shower head assembly, being connected to the first vertical connecting bar.
In paragraph 4, The second lifting/lowering plate connected to the lower end of the substrate support portion is provided, A substrate processing device characterized in that the first tilting drive unit is connected to the second lifting/lowering plate.
In paragraph 6, A substrate processing device characterized in that the drive bar of the lower shower head assembly is positioned to penetrate the second lifting/lowering plate.
In paragraph 1, The above second lifting/lowering unit is The second lifting/lowering plate connected to the lower end of the substrate support and the drive bar of the lower shower head assembly, and A substrate processing device characterized by having a second lifting/lowering drive unit for lifting and lowering the second lifting/lowering plate.
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In paragraph 8, The second lifting/lowering drive unit is connected to the second vertical connecting bar, and A substrate processing device characterized in that the second lifting/lowering plate moves up and down along the second vertical connecting bar.
In paragraph 1, The above second tilting unit is A second tilting plate connected to the lower end of the substrate support and the drive bar of the lower shower head assembly, and A substrate processing device characterized by having a second tilting drive unit that tilts the second tilting plate.
In Paragraph 11, The second lifting/lowering plate connected to the lower end of the substrate support is connected to the second vertical connecting bar so as to be able to move up and down along the second vertical connecting bar, and A substrate processing device characterized in that the first lifting/lowering plate is connected to the first vertical connecting bar.
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In Paragraph 11, Further comprising a second tilting housing connected to the lower part of the chamber, A substrate processing device characterized in that the second tilting drive unit and the second tilting plate are connected to the tilting housing.

Description

Substrate processing apparatus The present invention relates to a substrate processing device, and more specifically, to a substrate processing device capable of adjusting the distance between a substrate and an upper shower head or between a substrate and a lower shower head, and further capable of tilting the substrate relative to the upper shower head or tilting the lower shower head relative to the substrate. A general substrate processing device deposits a thin film of a predetermined thickness on one side of a substrate, for example, on the upper surface of the substrate. In this case, when the thin film is deposited in an overlapping manner on the upper surface of the substrate, the substrate can be bowed by the stress of the thin film. When the substrate bows in this manner, it becomes difficult to position the substrate correctly during subsequent various substrate processing steps. In particular, as the precision of substrate processing steps increases day by day, this bowing phenomenon reduces the precision of the processing steps. Therefore, to prevent the aforementioned bowing phenomenon of the substrate, a thin film of a predetermined thickness is deposited on the lower surface of the substrate to prevent the bowing phenomenon. A substrate processing device according to such prior art is equipped with an upper shower head that supplies purge gas, etc. to the upper part of the substrate, and furthermore, is equipped with a lower shower head that supplies process gas to the lower part of the substrate. Meanwhile, in the case of a device that supplies process gas toward the lower surface of a substrate, such as the substrate processing device described above, the distance between the substrate and the upper shower head and the distance between the substrate and the lower shower head are important. This is because, when plasma is used during the process on the substrate, it is necessary to adjust the gap between the substrate and the upper shower head so that plasma is not generated between the substrate and the upper shower head. In addition, when supplying process gas toward the lower surface of a substrate, the gap between the substrate and the lower shower head also becomes important. Furthermore, due to various factors, the substrate and the upper shower head, and the substrate and the lower shower head, may not be arranged parallel to each other, so it may be necessary to align them parallel. On the other hand, during the process on the substrate, it may be necessary to intentionally arrange the substrate and the upper shower head, and the substrate and the lower shower head, so that they are not parallel. In this case, it is necessary to tilt the substrate relative to the upper shower head or tilt the lower shower head relative to the substrate. FIG. 1 is a side cross-sectional view of a substrate processing apparatus according to one embodiment of the present invention, FIG. 2 is a side view illustrating the case where the lower shower head assembly is raised by the first lifting/lowering unit, FIG. 3 is a side view illustrating a state in which the lower shower head assembly is tilted in one direction relative to the substrate by the first tilting unit, FIG. 4 is a side view showing the state in which both the substrate support and the lower shower head assembly are raised by the second lifting/lowering unit. FIG. 5 is a side view showing the state in which the substrate support and the lower shower head assembly are tilted by the second tilting unit. FIG. 6 is a perspective view of the second tilting drive unit of the substrate processing device, FIG. 7 is a cross-sectional view along the line 'VII-VII' of FIG. 6, FIG. 8 is a plan view of the first tilting plate and the second tilting plate. Hereinafter, the structure of a substrate processing apparatus according to an embodiment of the present invention will be examined in detail with reference to the drawings. FIG. 1 is a side cross-sectional view of a substrate processing device (1000) according to one embodiment of the present invention. Referring to FIG. 1, the substrate processing device (1000) may include a chamber (300) that provides a processing space (310) in which a processing process is performed on a substrate, an upper shower head (200) that is provided on the upper inner side of the chamber (300) and supplies purge gas, a substrate support member (400) that is provided on the lower inner side of the chamber (300) and supports the substrate (S), and a lower shower head assembly (420) that is provided on the inner side of the substrate support member (400) and supplies process gas toward the lower surface of the substrate (S). Specifically, the chamber (300) can provide a processing space (310) inside which various components required for processing the substrate (S), etc., are accommodated. One side of the chamber (300) may be provided with an opening (not shown) through which the substrate (S) is loaded into or unloaded fr