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KR-102963994-B1 - APPARATUS FOR PROCESSING SUBSTRATE AND METHOD FOR PROCESSING SUBSTRATE

KR102963994B1KR 102963994 B1KR102963994 B1KR 102963994B1KR-102963994-B1

Abstract

A substrate processing device may include a rotary chuck, a processing container, a lifting/lowering unit, and a position adjustment unit. The rotary chuck may be provided to support a substrate and to rotate the substrate. The processing container may be provided with an opening at its upper portion sized to expose the substrate placed on the rotary chuck, and may also be provided to provide a space for accommodating the rotary chuck to recover the chemical solution supplied to the substrate during the processing process of the substrate. The lifting/lowering unit may be provided to raise the processing container to the back surface of the end portion of the substrate placed on the rotary chuck and to lower it downward from the back surface of the end portion of the substrate. The position adjustment unit may be provided at least two locations in the opening portion to adjust the position of the substrate so that the center of the substrate is aligned with the center of the rotary chuck by making contact with the end portion of the substrate when the processing container is raised.

Inventors

  • 김동겸
  • 김남규
  • 김학준

Assignees

  • 세메스 주식회사

Dates

Publication Date
20260512
Application Date
20201224

Claims (9)

  1. A rotating chuck that supports a substrate and is configured to rotate the substrate; A processing container having an upper portion configured to have an opening sized to expose a substrate placed on the rotating chuck, and configured to provide a space for accommodating the rotating chuck so as to recover the chemical solution supplied to the substrate during the processing of the substrate; A lifting/lowering unit configured to raise the processing container to the back surface of the end of the substrate placed on the rotating chuck, and to lower it downward from the back surface of the end of the substrate; and It includes position adjustment members provided at least two times in the opening to adjust the position of the substrate so that the center of the substrate is aligned with the center of the rotating chuck by contacting the end of the substrate when the processing vessel rises, The above lifting and lowering unit is configured to adjust the lowering of the processing container to a height such that, after the center of the substrate is adjusted by the position adjustment unit so as to be aligned with the center of the rotating chuck, the contact between the position adjustment unit and the substrate is released, and also such that the lowering of the processing container is configured to a height that does not impede the recovery of the chemical solution during the performance of the substrate processing process, and A substrate processing device characterized in that the position adjustment unit is configured to rise and fall together with the processing vessel, and is configured to contact the back end of the substrate when the processing vessel rises.
  2. In Article 1, A substrate processing device characterized in that the above position adjustment part comprises a back contact part configured to contact the back end of the substrate, and a side contact part configured to extend from the back contact part to contact the side end of the substrate.
  3. In Article 2, A substrate processing device characterized by the above-mentioned side contact portion being provided with an inclined structure so that the substrate can slide toward the back contact portion when the substrate is in contact.
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  5. In Article 1, A sensing unit configured to sense the position of the substrate placed on the rotating chuck; and A substrate processing device characterized by further including a control unit configured to control the lifting and lowering of the processing vessel so that the position adjustment unit can re-contact the end of the substrate when a sensing signal is received from the sensing unit indicating that the center of the substrate is not located on the same line as the center of the rotating chuck.
  6. In Article 1, A substrate processing device characterized in that the above-mentioned rotary chuck is provided to have a size smaller than that of the substrate.
  7. The upper part is a step of placing a substrate on a rotary chuck that is accommodated in a processing container having an opening sized to expose the substrate; A step of raising the processing container to the back side of the end of the substrate placed on the rotary chuck; A step of adjusting the position of the substrate so that the center of the substrate is aligned with the center of the rotating chuck by making contact with the end of the substrate when the processing container rises; and The method includes the step of adjusting the lowering of the processing container so that, after adjusting the center of the substrate to be aligned with the center of the rotating chuck, the contact with the substrate is released at a height, and at the same time, the recovery of the chemical solution is not hindered during the performance of the processing process of the substrate. A substrate processing method characterized by the position adjustment of the substrate being achieved by using a position adjustment unit that rises and falls together with the processing vessel, wherein the position adjustment unit is brought into contact with the back end of the substrate when the processing vessel rises.
  8. delete
  9. In Article 7, A step of sensing the position of the substrate placed on the rotary chuck; and A substrate processing method characterized by further including a step of controlling the lifting and lowering of the processing vessel to enable re-contact with the end of the substrate when the center of the substrate is not positioned on the same line as the center of the rotating chuck by the above sensing.

Description

Apparatus for Processing Substrate and Method for Processing Substrate The present invention relates to a substrate processing apparatus and a substrate processing method. More specifically, the present invention relates to a substrate processing apparatus equipped with a rotating chuck for rotating a substrate and a processing vessel providing a cup-structured space for accommodating the rotating chuck, and a substrate processing method using the same. In the manufacture of integrated circuit devices such as semiconductor devices, a substrate processing process can be performed by supplying a chemical solution onto a substrate that is rotated. Examples of the aforementioned substrate processing processes include a coating process in which a chemical solution, such as photoresist, is applied onto a substrate, and a removal process in which photoresist applied to the edge region of the substrate is selectively removed. However, in the aforementioned substrate processing process, if the center of the substrate and the center of the rotation axis on which the substrate is placed are not aligned, eccentricity may occur during the rotation of the substrate, which could consequently act as a defect factor during the execution of the substrate processing process. FIGS. 1 and FIGS. 2 are schematic drawings for illustrating a substrate processing apparatus according to exemplary embodiments of the present invention. FIG. 3 is a schematic diagram illustrating a position adjustment unit in the substrate processing apparatus of FIG. 1 and FIG. 2. FIGS. 4 and 5 are schematic drawings for illustrating examples of use of a substrate processing apparatus according to exemplary embodiments of the present invention. The present invention is susceptible to various modifications and may take various forms, and embodiments are to be described in detail in the text. However, this is not intended to limit the invention to the specific disclosed forms, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Similar reference numerals have been used for similar components in the description of each figure. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. The terms used in this application are used only to describe specific embodiments and are not intended to limit the invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "consisting of" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. Furthermore, exemplary embodiments will be described in more detail with reference to the attached drawings. Identical components in the drawings are given the same reference numerals, and redundant descriptions of identical components are omitted. FIGS. 1 and 2 are schematic drawings for explaining a substrate processing apparatus according to exemplary embodiments of the present invention, and FIG. 3 is a schematic drawing for explaining a position adjustment unit in the substrate processing apparatus of FIGS. 1 and 2. Referring to FIGS. 1 to 3, the substrate processing apparatus (100) according to exemplary embodiments of the present invention can be used for integrated circuit devices such as semiconductor devices, for example, in a coating process in which a chemical solution such as photoresist is applied to a substrate (10), or in a removal process in which photoresist applied to an edge region of the substrate (10) is selectively removed. In particular, the coating process, removal process, etc., using the substrate processing device (100) according to an exemplary embodiment of the present invention may be applied to a substrate (10) that is rotated. Accordingly, the substrate processing device (100) according to exemplary embodiments of the present invention may be equipped with a rotating chuck (11), a processing container (13), a lifting/lowering unit (15), a position adjustment unit (17), a sensing unit