Search

KR-102963995-B1 - APPARATUS FOR PROCESSING SUBSTRATE AND METHOD FOR PROCESSING SUBSTRATE

KR102963995B1KR 102963995 B1KR102963995 B1KR 102963995B1KR-102963995-B1

Abstract

A substrate processing device may include a rotary chuck, a chemical liquid discharge unit, a bowl, a first spraying unit, and a second spraying unit. The rotary chuck may be configured to allow a substrate to be placed thereon and to rotate. The chemical liquid discharge unit may be configured to discharge a chemical liquid onto a substrate placed on the rotary chuck. The bowl may be configured to have a cup shape with an open top, surrounding the rotary chuck to provide a processing space for discharging the chemical liquid and to recover the chemical liquid discharged onto the substrate and the chemical liquid scattered due to the rotation of the substrate. Furthermore, the first spraying unit may be configured to spray a cleaning liquid onto the adsorbed material so as to remove and process the adsorbed material generated by the adsorbed chemical liquid adsorbing onto the bowl, and the second spraying unit may be configured to spray a cleaning liquid onto the fume so as to remove and process the fume generated by the vapor produced by the adsorbed chemical liquid adsorbing onto the bowl.

Inventors

  • 임경택
  • 윤영운
  • 김남규
  • 윤두섭
  • 이휘재

Assignees

  • 세메스 주식회사

Dates

Publication Date
20260512
Application Date
20231214

Claims (10)

  1. A rotating chuck on which a substrate is placed and which is provided to be rotatable; A liquid dispensing unit configured to dispense a liquid onto a substrate placed on the above-mentioned rotating chuck; A bowl provided with a cup shape having an open top, surrounding the rotating chuck to provide a processing space for discharging the above liquid medicine and to recover the liquid medicine discharged onto the substrate and the liquid medicine scattered due to the rotation of the substrate; A first spray unit configured to spray a cleaning solution onto the adsorbent so as to remove and treat the adsorbent generated by adsorption on the bowl due to the above-mentioned scattered chemical solution; and It includes a second spray unit configured to spray a cleaning solution onto the fume so as to remove and treat the fume generated by adsorption on the bowl due to the vapor generated by the above-mentioned scattered chemical liquid, A substrate processing apparatus characterized by the first injection unit and the second injection unit being configured to have a structure branching from the same line, and each of the branching structures being connected by a flexible line.
  2. In Article 1, A substrate processing apparatus characterized in that the adsorbed material and the fume can be intensively adsorbed along the circumferential direction of the bowl, and the first spraying unit and the second spraying unit are configured to spray the cleaning liquid along the circumferential direction of the bowl.
  3. In Article 1, A substrate processing device characterized in that the first injection unit and the second injection unit are identical members.
  4. delete
  5. In Article 1, A sensing unit for sensing exhaust pressure, flow velocity, or exhaust pressure and flow velocity in the above-mentioned bowl; and A substrate processing device characterized by further including a control unit that controls the operation of the first injection unit, the second injection unit, or the first injection unit and the second injection unit based on the sensing result from the sensing unit.
  6. Step of discharging a liquid medicine onto a substrate that rotates by a rotary chuck; A step of recovering the liquid medicine discharged onto the substrate and the liquid medicine scattered due to the rotation of the substrate using a bowl having a cup shape that surrounds the rotating chuck and has an open top; A step of spraying a cleaning solution onto the adsorbent so as to remove and treat the adsorbent generated by adsorption on the bowl due to the above-mentioned scattered chemical solution; and The method includes the step of spraying a cleaning solution onto the fumes so as to remove and treat the fumes generated by adsorption on the bowl due to the vapor produced by the above-mentioned scattered chemical solution, A substrate processing method characterized by using a member that connects a flexible line while branching from the same line to the cleaning solution for the adsorbent and the cleaning solution for the fume.
  7. In Article 6, A substrate treatment method characterized in that the adsorbent and the fume can be intensively adsorbed along the circumferential direction of the bowl, and the cleaning solution is sprayed along the circumferential direction of the bowl.
  8. In Article 6, A substrate processing method characterized by using the same material for the cleaning solution for the adsorbent and the cleaning solution for the fume.
  9. delete
  10. In Article 6, A step of sensing the exhaust pressure, flow velocity, or exhaust pressure and flow velocity in the above-mentioned bowl; and A substrate processing method characterized by further including the step of controlling whether to spray a cleaning solution onto the adsorbent and spray a cleaning solution onto the fume based on the above sensing result.

Description

Apparatus for Processing Substrate and Method for Processing Substrate The present invention relates to a substrate processing apparatus and a substrate processing method. More specifically, the present invention relates to a substrate processing apparatus comprising a bowl having a cup shape that surrounds a rotating chuck and is open at the top, and a substrate processing method using the said substrate processing apparatus. In the manufacture of integrated circuit devices such as semiconductor devices, a substrate processing process is frequently performed to discharge a chemical solution, such as photoresist, onto a substrate. The above substrate processing process can be carried out by using a substrate processing device that includes a rotary chuck, a chemical solution discharge unit that discharges the chemical solution onto a substrate placed on the rotary chuck, and a cup-shaped bowl that surrounds the rotary chuck and has an open top, which provides a processing space for discharging the chemical solution and allows for the recovery of the chemical solution discharged onto the substrate and the chemical solution scattered due to the rotation of the substrate. In addition, during the performance of the above substrate processing process, the chemical solution discharged onto the substrate may be scattered due to the rotation of the substrate. The scattered chemical solution may be adsorbed onto the bowl and formed as an adsorbent, and furthermore, the vapor generated by the scattered chemical solution may also be adsorbed onto the bowl and formed as a fume. However, in the past, the removal and treatment of the fume formed by the vapor has rarely been carried out. FIG. 1 is a schematic diagram for explaining the overall configuration of a substrate processing apparatus according to exemplary embodiments of the present invention. FIG. 2 is a schematic diagram for explaining a detailed substrate processing apparatus according to exemplary embodiments of the present invention. FIG. 3 is a schematic diagram for explaining the first cleaning section and the second cleaning section in FIG. 2. FIG. 4 is a schematic diagram for explaining the cleaning area using the first cleaning section and the second cleaning section in FIG. 2. The present invention is susceptible to various modifications and may take various forms, and embodiments are to be described in detail in the text. However, this is not intended to limit the invention to the specific disclosed forms, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Similar reference numerals have been used for similar components in the description of each figure. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. The terms used in this application are used only to describe specific embodiments and are not intended to limit the invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "consisting of" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. Furthermore, exemplary embodiments will be described in more detail with reference to the attached drawings. Identical components in the drawings are given the same reference numerals, and redundant descriptions of identical components are omitted. FIG. 1 is a schematic diagram for explaining the overall configuration of a substrate processing apparatus according to exemplary embodiments of the present invention. Referring to FIG. 1, a substrate processing device (100) according to exemplary embodiments of the present invention may be configured to perform a processing process for supplying and processing a chemical solution onto a substrate, for example, a processing process for discharging and processing a photosensitive solution onto a substrate, a processing process for discharging and processing a cleaning solution onto a substrate, and may have a structure including a loading/