KR-102964010-B1 - Wafer grip device

KR102964010B1KR 102964010 B1KR102964010 B1KR 102964010B1KR-102964010-B1

Abstract

According to one aspect of the present invention, a wafer gripping device is provided that includes a gripping part for gripping a wafer, a support part for supporting the gripping part, and a moving part for moving the gripping part. The gripping part includes a frame part connected to the support part, a gripping driving part installed on the frame part, and an upper plate and a lower plate that move closer to or further apart from each other by driving the gripping driving part. The upper plate includes a first upper plate gripping part and a second upper plate gripping part spaced apart from the first upper plate gripping part, and the lower plate includes a first lower plate gripping part and a second lower plate gripping part spaced apart from the first lower plate gripping part. The first upper plate gripping part and the first lower plate gripping part can form a pair to grip the wafer, and the second upper plate gripping part and the second lower plate gripping part can form a pair to grip the wafer, thereby providing a wafer gripping device in which the gripping part can grip in both directions.

Inventors

이중한

Assignees

한화세미텍 주식회사

Dates

Publication Date: 20260511
Application Date: 20240322

Claims (6)

A gripping part for gripping a wafer; A support member supporting the above-mentioned gripping member; and It includes a moving part that moves the above-mentioned gripping part, and The above-mentioned gripping part is, A frame part connected to the above support part; A single gripping drive unit installed on the above frame portion; and It includes an upper plate and a lower plate that move closer to or further apart from each other by the driving of the above-mentioned gripping driving unit, The above top plate includes a first top plate grip portion and a second top plate grip portion spaced apart at the same height as the first top plate grip portion, and The above lower plate includes a first lower plate grip portion and a second lower plate grip portion spaced apart at the same height as the first lower plate grip portion, and The first upper plate grip portion and the first lower plate grip portion form a pair to grip the wafer, and the second upper plate grip portion and the second lower plate grip portion form a pair to grip the wafer, so that the gripping portion can grip in both directions. The height at which the first upper plate gripping part and the first lower plate gripping part grip the wafer is the same as the height at which the second upper plate gripping part and the second lower plate gripping part grip the wafer, and A wafer gripping device in which the first upper plate gripping part and the first lower plate gripping part form a pair to grip the wafer, and the second upper plate gripping part and the second lower plate gripping part form a pair to grip the wafer, are performed by the single gripping drive part.
In paragraph 1, The above-mentioned gripping drive unit is a wafer gripping device driven by pneumatic pressure.
In paragraph 1, A wafer gripping device in which the upper plate is moved by the gripping drive unit and the lower plate is fixed to the frame unit.
In paragraph 1, A wafer gripping device in which the lower plate is moved by the gripping drive unit and the upper plate is fixed to the frame unit.
In paragraph 1, A wafer gripping device having a grip groove formed on at least one of the upper plate and the lower plate facing each other.
In paragraph 1, A wafer gripping device comprising a control unit that controls the moving unit and the gripping driving unit.

Description

Wafer grip device The present invention relates to a wafer gripping device. The semiconductor manufacturing process can generally be broadly classified into a process of forming chips on a wafer, a packaging process of packaging the chips onto a substrate or lead frame, and an inspection process of inspecting the characteristics and lifespan of the finished packages. Therefore, in the semiconductor manufacturing process, there exists a process for preparing and processing wafers, and this process requires a wafer gripping and transport device capable of grasping the wafer and transporting it to a desired location. Conventional wafer gripping and transport devices are equipped with a gripping device on only one side, so they grip and transport wafers from only one side. This results in reduced degrees of freedom, and if there are obstacles in the transport path, the movement and control processes required to avoid interference become complex. For example, as a prior art, Registered Patent Publication No. 10-0848595 discloses a wafer frame gripping device that grips a wafer frame on one side. FIG. 1 is a schematic perspective view illustrating a wafer gripping device according to one embodiment of the present invention. FIG. 2 is a perspective view schematically illustrating a gripping portion according to one embodiment of the present invention. Figure 3 is a front view of the gripping part shown in Figure 2. FIG. 4 is a schematic plan view illustrating the process of gripping a wafer using a first upper plate gripping part and a first lower plate gripping part of a wafer gripping device according to one embodiment of the present invention and transporting the wafer to a wafer stage. FIG. 5 is a schematic plan view illustrating the process of gripping a wafer using a second upper plate gripping part and a second lower plate gripping part of a wafer gripping device according to one embodiment of the present invention and transporting the wafer to a wafer stage. Hereinafter, the present invention according to a preferred embodiment will be described in detail with reference to the attached drawings. Furthermore, in this specification and drawings, redundant descriptions are omitted for components having substantially the same configuration by using the same reference numerals, and parts in the drawings may be exaggerated in terms of size, length ratio, etc., to aid understanding. The present invention will become clear from the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Meanwhile, the terms used in this specification are for describing the embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. As used in this specification, "comprises" and/or "comprising" do not exclude the presence or addition of one or more other components, steps, actions, and/or elements to the mentioned components, steps, actions, and/or elements. Terms such as "first," "second," etc., may be used to describe various components, but the components should not be limited by these terms. The terms are used solely for the purpose of distinguishing one component from another. FIG. 1 is a schematic perspective view illustrating a wafer gripping device according to one embodiment of the present invention. FIG. 2 is a schematic perspective view illustrating a gripping part according to one embodiment of the present invention, and FIG. 3 is a front view of the gripping part illustrated in FIG. 2. As illustrated in FIGS. 1 to 3, the wafer gripping device (100) according to the present embodiment includes a gripping part (110), a supporting part (120), a moving part (130), and a control part (140). The gripping part (110) is a device for gripping a wafer (W) and includes a frame part (111), a gripping driving part (112), an upper plate (113), and a lower plate (114). The frame part (111) performs the frame function of the gripping part (110) and is connected to the support part (120). The gripping drive unit (112) is installed on the frame unit (111) and generates power to drive the distance (d) between the upper plate (113) and the lower plate (114) closer or further apart. The gripping drive unit (112) includes a pneumatic cylinder driven by pneumatic pressure, and for this purpose, a pneumatic line unit (112a) and a valve (not shown) may be installed. That is, the gripping drive unit (112) is driven under the control of the control unit (140), and the control unit (140) controls the drive by adjusting the pneumatic pres