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KR-102964031-B1 - low dielectric adhesive composition and polyimide composite film for flexible printed circuit board having the same

KR102964031B1KR 102964031 B1KR102964031 B1KR 102964031B1KR-102964031-B1

Abstract

The present invention relates to a low dielectric adhesive composition and a polyimide composite film for a flexible circuit board comprising the same. More specifically, the invention relates to a low dielectric adhesive composition having not only low dielectric constant and dielectric loss, but also excellent adhesive strength, flexural resistance, and hole processability, and a polyimide composite film for a flexible circuit board comprising the same.

Inventors

  • 김광무

Assignees

  • 주식회사 엡솔

Dates

Publication Date
20260512
Application Date
20251114

Claims (10)

  1. Comprising a mixed resin; and an epoxy resin; and The above mixed resin comprises polyphenylene ether (PPE) resin and polyimide resin; and The above epoxy resin is a low dielectric adhesive composition comprising a bisphenol A type epoxy resin and a hydrogenated bisphenol A type cycloaliphatic epoxy resin.
  2. In paragraph 1, The above low dielectric adhesive composition comprises 20 to 40 parts by weight of epoxy resin per 100 parts by weight of mixed resin, and A low dielectric adhesive composition comprising, based on the total weight%, 60 to 90 weight% of polyphenylene ether resin and 10 to 40 weight% of polyimide resin.
  3. In paragraph 1, A low dielectric adhesive composition in which the above polyphenylene ether resin is a modified polyphenylene ether (m-PPE) resin having a weight-average molecular weight of 1,000 to 3,000.
  4. In paragraph 3, The above modified polyphenylene ether (m-PPE) resin is a low dielectric adhesive composition comprising a compound represented by the following chemical formula 1. [Chemical Formula 1] In the above chemical formula 1, Y is a divalent hydrocarbon group having 20 or fewer carbon atoms in a straight-chain, branched, or cyclic form, x is 1 to 50, and y is 1 to 50.
  5. delete
  6. In paragraph 1, A low dielectric adhesive composition comprising, based on the total weight%, 10 to 40 weight% of a bisphenol A type epoxy resin and 60 to 90 weight% of a hydrogenated bisphenol A type cycloaliphatic epoxy resin.
  7. In paragraph 6, The above bisphenol A type epoxy resin comprises a bisphenol A type epoxy resin having an epoxy equivalent of 380 to 580 g/eq and a bisphenol A type epoxy resin having an epoxy equivalent of 180 to 350 g/eq, and The above hydrogenated bisphenol A type cycloaliphatic epoxy resin is a low dielectric adhesive composition having an epoxy equivalent of 130 to 330 g/eq.
  8. In paragraph 1, The above low dielectric adhesive composition further comprises a curing accelerator; and a functional polymer additive; and The above low dielectric adhesive composition comprises, per 100 parts by weight of mixed resin, 0.1 to 1.5 parts by weight of a curing accelerator and 0.5 to 2.0 parts by weight of a functional polymer additive.
  9. Polyimide substrate layer; and A low dielectric adhesive layer formed on one or both sides of the polyimide substrate layer; comprising The above low dielectric adhesive layer is a polyimide composite film for a flexible circuit board formed by curing the low dielectric adhesive composition of claim 1.
  10. In Paragraph 9, A polyimide composite film for a flexible circuit board, further comprising a metal layer formed on one surface of the adhesive layer.

Description

Low dielectric adhesive composition and polyimide composite film for flexible printed circuit board having the same The present invention relates to a low dielectric adhesive composition and a polyimide composite film for a flexible circuit board comprising the same. More specifically, the invention relates to a low dielectric adhesive composition having not only low dielectric constant and dielectric loss, but also excellent adhesive strength, flexural resistance, and hole processability, and a polyimide composite film for a flexible circuit board comprising the same. Flexible circuit clad layers (FCCL) are characterized by having flexible circuit flexibility, formed by laminating a polymer film layer and a metal conductive layer. These flexible circuit clad layers are widely used as materials for electronic devices such as mobile phones, digital camcorders, laptops, and LCD monitors. In particular, with the recent increase in the adoption of 5G and 6G communication devices, the transmission signals of electronic devices are rapidly becoming faster and higher in frequency. Consequently, there is a need to develop materials capable of achieving low dielectric properties that can reduce electrical signal loss in high-frequency ranges suitable for this trend, specifically in the frequency range of 10 GHz or higher. Although polyphenylene ether resin is well known as a polymer material with generally low dielectric properties, it is not widely applied due to the disadvantages of being a thermoplastic resin that lacks solvent resistance and is highly brittle, leading to easy cracking. Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. In the drawings, parts unrelated to the explanation have been omitted to clearly explain the present invention, and the same reference numerals are assigned to identical or similar components throughout the specification. The low dielectric adhesive composition of the present invention comprises a mixed resin and an epoxy resin. Specifically, the low dielectric adhesive composition of the present invention may include 20 to 40 parts by weight, preferably 25 to 35 parts by weight, of epoxy resin per 100 parts by weight of mixed resin. If the epoxy resin is included in an amount less than 20 parts by weight, there may be a problem of reduced adhesive strength, and if it exceeds 40 parts by weight, there may be a problem of reduced low dielectric properties. First, the mixed resin may include polyphenylene ether (PPE) resin and polyimide resin. If the low dielectric adhesive composition of the present invention includes only polyphenylene ether resin instead of the mixed resin, there may be a problem with reduced heat resistance and/or flexibility, and if it includes only polyimide resin, there may be a problem with reduced processability and/or low dielectric properties. Specifically, the mixed resin may comprise, based on the total weight%, 60 to 90 weight% of polyphenylene ether resin, preferably 60 to 80 weight%, more preferably 60 to 70 weight%, and 10 to 40 weight% of polyimide resin, preferably 20 to 40 weight%, more preferably 30 to 40 weight%. If the polyphenylene ether resin is included in an amount less than 60 weight%, there may be a problem with reduced low dielectric properties, and if it exceeds 90 weight%, there may be a problem with reduced flexibility and/or processability. In addition, the polyphenylene ether resin may be a modified polyphenylene ether (m-PPE) resin. The modified polyphenylene ether (m-PPE) resin is a resin in which the physical properties are improved by polymerizing the polyphenylene ether (PPE) resin with other resins such as polystyrene (HIPS). The modified polyphenylene ether (m-PPE) resin of the present invention may have a weight-average molecular weight of 1,000 to 3,000, preferably 1,200 to 2,500, and more preferably 1,500 to 2,000. If the weight-average molecular weight is less than 1,000, there may be a problem in forming a uniform coating film, and if it exceeds 3,000, there may be a problem in forming a uniform coating film. Specifically, the modified polyphenylene ether (m-PPE) resin may include a compound represented by the following chemical formula 1. [Chemical Formula 1] In the above chemical formula 1, Y may be a straight-chain, branched, or cyclic divalent hydrocarbon group with 20 or fewer carbon atoms, preferably a straight - chain divalent hydrocarbon group with 20 or fewer carbon atoms, and more preferably -CH₂- , -CH₂CH₂- , -CH₂CH₂CH₂CH₂- , -CH₂CH₂CH₂CH₂CH₂- , or -CH₂CH₂CH₂CH₂CH₂CH₂CH₂- . In addition, in the above chemical formula 1, x may be 1 to 50, preferably 10 to 40, and more preferably 20 to 35. In addition, in the above formula 1, y may be 1 to 50, preferably 1