KR-102964042-B1 - Heating unit and Substrate processing apparatus

Abstract

The present invention relates to a heating unit and a substrate processing device, and more specifically, to a heating unit and a substrate processing device capable of preventing particle generation caused by a decrease in the temperature of the process gas when the process gas is moving.

Inventors

• 원종필
• 박종혁

Assignees

• 주식회사 테스

Dates

Publication Date

20260512

Application Date

20250403

Claims (8)

1. In a heating unit disposed in a chamber body, A body part having a flow path section in which a connecting flow path for process gas to travel is formed; A cover portion connected to the body portion to cover the above Euro portion; and A heating wire provided between the body portion and the cover portion and arranged to surround the flow path portion; and A heating unit characterized by further comprising a connecting flange on the upper part of the body portion and an O-ring provided on the upper surface of the connecting flange.
2. delete
3. In paragraph 1, The above heating wire is A heating unit characterized by being positioned to start from the lower part of the body, be adjacent to the upper part of the body, and then return to the lower part of the body.
4. In paragraph 1, A heating unit characterized by having a heating wire groove formed in at least one of the body portion and the cover portion, into which the heating wire is inserted.
5. In paragraph 4, The above heating element groove A heating unit characterized by being formed in the body portion to surround the Euro portion and comprising a first heating wire groove into which the heating wire is inserted, and formed in the cover portion and comprising a second heating wire groove into which the heating wire is inserted.
6. In paragraph 5, The above first heating wire groove is It has a pair of first side grooves extending vertically along the above-mentioned Euro section, and a first connecting groove connecting the pair of first side grooves. A heating unit characterized in that the first connecting groove is formed at a predetermined angle with respect to the connecting flange.
7. A chamber having a chamber body and a chamber lid rotatably connected to the chamber body; A body flange connected to the base of the chamber body and having a first flow path formed on its inner side, and a lead flange provided on the chamber lead and having a second flow path formed on its inner side; and A substrate processing apparatus characterized by comprising: a heating unit that is disposed through the chamber body, has a connecting channel formed connecting the first channel and the second channel, and heats the process gas on the connecting channel.
8. In Paragraph 7, The above heating unit is A body part having a fluid section in which the above-mentioned connecting fluid is formed, and A cover portion connected to the body portion to cover the above Euro portion, and A substrate processing device characterized by having a heating wire disposed between the body portion and the cover portion and arranged to surround the Euro portion.

Description

Heating unit and Substrate processing apparatus The present invention relates to a heating unit and a substrate processing device, and more specifically, to a heating unit and a substrate processing device capable of preventing particle generation caused by a decrease in the temperature of the process gas when the process gas is moving. Generally, a substrate processing device accommodates a substrate inside a chamber and can perform various processing steps on the substrate. In addition, a gas supply unit, etc., is provided on the inner upper part of the chamber, and process gas can be supplied toward the substrate using the gas supply unit. In this case, particles may be generated due to a temperature drop while the process gas moves along the path toward the gas supply unit. In particular, when supplying a liquid source by vaporizing it, it is necessary to heat the vaporized process gas above a certain temperature. FIG. 1 is a perspective view illustrating a chamber of a substrate processing apparatus according to one embodiment of the present invention, and FIG. 2 is a perspective view showing the chamber lid of FIG. 1 in an open state, and FIG. 3 is a side cross-sectional view for illustrating the heating unit in FIG. 1, FIG. 4 is a perspective view of a heating unit viewed from the front, and FIG. 5 is a perspective view of the heating unit viewed from the rear, and FIG. 6 is a drawing showing the front view of the connection flange of the heating unit and the bottom view of the heating unit. Figure 7 is a side view of the body part viewed from the side. Hereinafter, the structure of a heating unit and a substrate processing device according to an embodiment of the present invention will be examined in detail with reference to the drawings. FIG. 1 is a perspective view illustrating a chamber (100) of a substrate processing device (1000) according to one embodiment of the present invention, FIG. 2 is a perspective view illustrating a state in which the chamber lid (110) of the chamber (100) of FIG. 1 is open, and FIG. 3 is a side cross-sectional view illustrating a heating unit (300) in FIG. 1. In FIG. 3, the heating unit (300) is not shown in a cross-sectional view. Referring to FIGS. 1 to 3, the chamber (100) may have a chamber body (120) and a chamber lid (110) rotatably connected to the upper part of the chamber body (120). A substrate (not shown) is placed inside the chamber body (120), and a process on the substrate can be performed. Additionally, the chamber lid (110) is connected to the pivot axis (140) of the chamber body (120) and can rotate to open and close the open upper portion of the chamber body (120). Although not shown in the drawing, the chamber lid (110) may be equipped with a gas supply unit that may be composed of a showerhead, etc., for supplying various process gases toward the substrate. In this case, the chamber (100) may be equipped with a component capable of supplying process gas to the gas supply unit. For example, it may be equipped with a body flange (250) connected to the base of the chamber body (120) and having a first flow path (260) formed on the inside, a lead flange (200) provided on the chamber lid (110) and having a second flow path (210) formed on the inside, and a heating unit (300) for moving process gas connecting the body flange (250) and the lead flange (200). That is, process gas is supplied from a process gas supply tank (not shown) toward the first flow path (260) of the body flange (250), and the process gas can move upward through the heating unit (300) and the lead flange (200) and be supplied to the gas supply unit. In this case, when the process gas moves through the chamber body (120), the temperature of the process gas may drop, causing particles to be generated. In particular, when supplying a liquid process gas source by vaporizing it, a configuration capable of heating the vaporized process gas is required. In the present invention, the process gas is moved by the heating unit (300) which is disposed through the chamber body (120), and at the same time, the process gas is heated to a predetermined temperature to solve the aforementioned problem. Below, the configuration of the heating unit (300) will be examined in detail. FIG. 4 is a perspective view of the heating unit (300) viewed from the front, FIG. 5 is a perspective view of the heating unit (300) viewed from the rear, and FIG. 6 is a drawing showing the front view (Fig. 6 (A)) of the connecting flange (344) of the heating unit (300) and the bottom view (Fig. 6 (B)) of the heating unit (300). Referring to FIGS. 4 to 6, the heating unit (300) is positioned through the chamber body (120), and a connecting passage (349) is formed connecting the first passage (260) and the second passage (210), and the process gas on the connecting passage (349) can be heated. For example, the heating unit (300) may have a body part (340) having a flow path (343) in which the connecting flow path (349) throu