KR-102964049-B1 - APPARATUS AND METHOD FOR OPTIMIZING DIAMETER OF WIRE

Abstract

An apparatus and method for optimizing wire diameter are disclosed. An apparatus for optimizing wire diameter according to one aspect of the present invention comprises a communication interface and a processor connected to the communication interface. The processor receives information regarding the wire diameter per pin of a target connector and the minimum wire diameter per pin of the target connector through the communication interface, identifies a pin requiring optimization based on the received information, and performs optimization of the wire diameter corresponding to the pin requiring optimization based on the information regarding the minimum wire diameter per pin.

Inventors

• 김현관

Assignees

• 주식회사 경신

Dates

Publication Date

20260513

Application Date

20230710

Claims (8)

1. Communication interface; and It includes a processor connected to the above communication interface, The processor receives information regarding the wire diameter per pin of a first target connector and the minimum wire diameter per pin of a first target connector through the communication interface, identifies a pin requiring optimization based on the received information, and performs optimization of the wire diameter corresponding to the pin requiring optimization based on the information regarding the minimum wire diameter per pin. The processor detects a minimum wire diameter corresponding to the pin to be optimized from information regarding the minimum wire diameter for each pin, and performs optimization for the pin to be optimized by changing the wire diameter corresponding to the pin to the detected minimum wire diameter. A wire diameter optimization device characterized by performing optimization for a pin to be optimized by changing the wire diameter corresponding to the pin to be optimized to the larger value between the first and second minimum wire diameters when the first minimum wire diameter, which is the minimum wire diameter corresponding to the pin to be optimized, and the second minimum wire diameter, which is the minimum wire diameter corresponding to the pin to the other end of the wire connected to the pin to be optimized, are different from each other.
2. In Article 1, A wire diameter optimization device characterized by the processor performing a process of comparing the wire diameter and the minimum wire diameter on a pin-by-pin basis, detecting a pin among the pins of the target connector whose wire diameter exceeds the minimum wire diameter, and identifying the detected pin as the target pin for optimization.
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4. In Article 1, A wire diameter optimization device characterized by the processor outputting information about the optimization target pin and changes to the wire diameter corresponding to the optimization target pin to the outside through the communication interface.
5. A wire diameter optimization method performed on a computing device including a processor, A step of receiving information on the wire diameter per pin of the target connector and the minimum wire diameter per pin of the target connector; A step of identifying a pin to be optimized that requires optimization for the wire diameter based on the received information above; and The method includes the step of performing optimization on the wire diameter corresponding to the pin to be optimized based on information regarding the minimum wire diameter for each pin. The steps performed above are, Detecting the minimum wire diameter corresponding to the pin to be optimized from the information on the minimum wire diameter for each pin, and performing optimization for the pin to be optimized by changing the wire diameter corresponding to the pin to the detected minimum wire diameter, A wire diameter optimization method characterized by performing optimization for the pin to be optimized by changing the wire diameter corresponding to the pin to be optimized to the larger value between the first and second minimum wire diameters when the first minimum wire diameter, which is the minimum wire diameter corresponding to the pin to be optimized, and the second minimum wire diameter, which is the minimum wire diameter corresponding to the pin to the other end of the wire connected to the pin to be optimized, are different from each other.
6. In Paragraph 5, The above identification step is, A wire diameter optimization method characterized by performing a process of comparing the wire diameter and the minimum wire diameter for each pin to detect a pin among the pins of the target connector whose wire diameter exceeds the minimum wire diameter, and identifying the detected pin as the target pin for optimization.
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8. In Paragraph 5, A wire diameter optimization method characterized by further including the step of outputting information to the outside regarding the pin to be optimized and changes in the wire diameter corresponding to the pin to be optimized.

Description

Apparatus and Method for Optimizing Wire Diameter The present invention relates to a wire diameter optimization device and method, and more specifically, to a device and method capable of optimizing the wire diameter of a wire applied to a vehicle. Components such as connectors and wires are installed in various parts of the vehicle to transmit electrical signals and power to each system within the vehicle. A significant number of wires are used in a vehicle, and the total weight of the wires applied to the vehicle has a substantial impact on the vehicle's economic efficiency. Therefore, prior to the production of a finished vehicle, it is necessary to reduce the weight of the wires by optimizing the wire diameter of each wire used in the vehicle. Meanwhile, conventionally, humans manually checked the design information of connectors and wires to perform wire diameter optimization; however, this conventional method not only requires a significant amount of time but also has the problem that human error can occur during the optimization process. The background technology of the present invention is disclosed in Korean Registered Patent Publication No. 10-1479074 (December 29, 2014). FIG. 1 is a block diagram showing a wire diameter optimization device according to one embodiment of the present invention. FIG. 2 is a block diagram showing a processor according to one embodiment of the present invention. FIG. 3 is an illustrative diagram for explaining the process of identifying a pin to be optimized according to one embodiment of the present invention. FIG. 4 is an exemplary diagram illustrating the process of performing optimization on a pin to be optimized according to an embodiment of the present invention. FIG. 5 is a flowchart showing a wire diameter optimization method according to one embodiment of the present invention. Hereinafter, a wire diameter optimization device and method according to an embodiment of the present invention will be described in detail with reference to the attached drawings. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. Furthermore, the terms described below are defined considering their functions in the present invention, and these may vary depending on the intention or convention of the user or operator. Therefore, the definitions of these terms should be based on the content throughout this specification. FIG. 1 is a block diagram showing a wire diameter optimization device according to one embodiment of the present invention. Referring to FIG. 1, a wire diameter optimization device (100) according to one embodiment of the present invention may include a communication interface (110), a memory (120), and a processor (130). Each component included in the wire diameter optimization device (100) according to one embodiment of the present invention may be connected and communicate via a bus. Each component may be connected via an individual interface or an individual bus centered on the processor (130), rather than a common bus. The wire diameter optimization device (100) according to one embodiment of the present invention may include various additional components in addition to the components shown in FIG. 1, or may omit some of the above components. The communication interface (110) can communicate with external devices. The communication interface (110) can communicate with various types of external devices according to various types of communication methods. The communication interface (110) can receive various information required in the process of optimizing the wire diameters of wires set to be connected to a connector applied to a vehicle. For example, the communication interface (110) can receive information regarding the wire diameter per pin of the target connector and the minimum wire diameter per pin of the target connector. Here, the target connector may refer to a connector for which the wire diameter is to be optimized. The information regarding the wire diameter per pin of the target connector refers to information in which the wire diameters are organized by pin of the target connector, and may refer to information prior to the application of optimization. Information regarding the minimum wire diameter for each pin of the target connector may be information regarding the minimum applicable wire diameters organized by pin of the target connector. For example, when a first to third pin is provided in connector A, the minimum wire diameter applicable to the first pin may be 0.5 sq, the minimum wire diameter applicable to the second pin may be 0.3 sq, and the minimum wire diameter applicable to the third pin may be 0.5 sq. As such, the minimum wire diameter applicable to each pin may differ, and the present embodiment may receive information regarding this through a communication interface (110). Various information required during the operation of the