KR-102964083-B1 - SEMICONDUCTOR HEAT ENERGY UTILIZATION VACUUM COOLING SYSTEM

KR102964083B1KR 102964083 B1KR102964083 B1KR 102964083B1KR-102964083-B1

Abstract

The present invention relates to a vacuum cooling system utilizing semiconductor heat energy. A vacuum cooling system according to one embodiment of the present invention may include: a cold heat generation module that uses water as a working fluid and generates cooling steam through vaporization in a vacuum state; a heat exchange module that receives cooling steam generated by the cold heat generation module, generates cold heat energy through heat exchange, and releases it to a cooling target space where a semiconductor is located; a liquefaction condensation module that receives cooling steam that has passed through the heat exchange module, liquefies it into condensate, and resupplies it to the cold heat generation module; a heat supply module that captures thermal energy generated from the semiconductor and supplies it to the cold heat generation module as a heat source for vaporization; and an integrated control module for integrally controlling the cold heat generation module, the heat exchange module, the liquefaction condensation module, and the heat supply module. The integrated control module is configured with control parameters including vacuum pressure, target temperature for the space to be cooled, temperature of the heat exchange module, cold supply temperature, operating time, circulation time, and usage conditions of thermal energy captured in the heat supply module, and control of each module can be performed based on the pre-configured control parameters.

Inventors

김용엽

Dates

Publication Date: 20260512
Application Date: 20251204

Claims (12)

In a vacuum cooling system utilizing semiconductor heat energy that generates cooling energy by utilizing thermal energy generated from a semiconductor, A cooling and heat generation module that uses water as a working fluid and generates cooling steam through vaporization in a vacuum; A heat exchange module that receives cooling steam generated from the above-mentioned cold heat generation module, generates cold heat energy through heat exchange, and releases it to a cooling target space where a semiconductor is located; A liquefaction condensation module that receives cooling water vapor passing through the heat exchange module, liquefies it into condensate, and re-supplies it to the cold heat generation module; A heat supply module that captures thermal energy generated from a semiconductor and supplies it to the above-mentioned cold-heat generation module as a heat source for vaporization; and An integrated control module for integrally controlling the above-mentioned cold heat generation module, heat exchange module, liquefaction condensation module, and heat supply module; Includes, The above integrated control module is, Control parameters including vacuum pressure, target temperature for the space to be cooled, temperature of the heat exchange module, cold supply temperature, operating time, circulation time, and usage conditions of thermal energy captured in the heat supply module are set, and control of each module is performed based on the pre-set control parameters, and The above heat supply module is, A heat capture unit for capturing thermal energy generated in a semiconductor; and A heat transfer unit that transfers thermal energy collected in the above heat collection unit to the above cold heat generation module; Includes, The above integrated control module is, A vacuum cooling system utilizing semiconductor heat generation energy, which controls the operation of the heat transfer unit so that the amount of heat energy supplied from the heat collection unit to the cold heat generation module is adjusted according to control parameters including pre-set heat energy usage conditions.
In paragraph 1, The above cold heat generation module is, A chamber unit for generating cooling steam; A vacuum generating unit that maintains a vacuum state inside the chamber unit; A pressure measuring unit that measures the internal pressure of the chamber unit in real time; and A cold trap unit for capturing cooling water vapor generated in the above chamber unit; A vacuum cooling system utilizing semiconductor heat energy, including
In paragraph 2, The above chamber unit is, It includes a first chamber and a second chamber, The above-mentioned first chamber and second chamber are, The internal pressure is formed differently according to the control parameters set in the integrated control module above, and A vacuum cooling system utilizing semiconductor heat energy, characterized by being controlled such that, based on the control parameters provided by the integrated control module, the second chamber is alternately driven to receive condensate or form a vacuum state inside while the first chamber is generating cooling steam according to a preset driving time interval, thereby continuously generating cooling steam.
In paragraph 1, The above heat exchange module is, A heat exchange unit that exchanges heat with cooling steam supplied from the above-mentioned cold heat generation module and releases cold energy to a cooling target space where a semiconductor is located; An air circulation fan unit for circulating air in the above-mentioned space to be cooled; and A temperature measuring unit that measures the temperature of the above-mentioned cooling target space in real time and transmits it to the above-mentioned integrated control module; A vacuum cooling system utilizing semiconductor heat energy, including
In paragraph 4, The above integrated control module is, The driving speed of the air circulation fan unit and the amount of heat exchanged through the heat exchange unit are controlled according to control parameters including a pre-set target temperature for the cooling target space, the outlet side temperature of the heat exchange unit, and the cold supply temperature. A vacuum cooling system utilizing semiconductor heat energy, wherein the operating conditions of the heat exchange module are adjusted based on the temperature of the space to be cooled measured by the temperature measuring unit.
In paragraph 1, The above liquefaction condensation module is, A condensation unit that liquefies cooling steam passing through the above heat exchange module and converts it into condensate; A condensate storage unit for storing converted condensate; and A circulation unit that allows the condensate stored in the above condensate storage unit to be recirculated to the above cold heat generation module; A vacuum cooling system utilizing semiconductor heat energy, including
In paragraph 6, The above integrated control module is, Automatically controlling the liquefaction operating conditions of the condensation unit or the timing of the resupply of condensate according to control parameters including a preset cold supply temperature and circulation time, A vacuum cooling system utilizing semiconductor heat generation energy, wherein the integrated control module is configured to adjust the operating conditions of the liquefaction condensation module based on temperature information received from the heat exchange module.
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In paragraph 1, The above heat supply module is, A power supply unit for supplying thermal energy to the above-mentioned cold-heat generation module in case of emergency; A vacuum cooling system utilizing semiconductor heat energy, further including
In Paragraph 10, The above integrated control module is, When thermal energy generated in the semiconductor is collected in the heat collection unit, a thermal energy usage condition is set including a first operating condition that supplies thermal energy to the cold heat generation module through the heat transfer unit and a second operating condition that supplies thermal energy to the cold heat generation module through the power supply unit. A vacuum cooling system utilizing semiconductor heat energy, configured such that when the heat energy collected by the heat collection unit is less than a preset threshold value, the integrated control module switches to the second operating condition, thereby controlling the operation of the heat supply module so that either the first operating condition or the second operating condition is selected.
In paragraph 1, The above vacuum cooling system is, A first flow path connecting the above cold heat generation module and the above heat exchange module, and connecting the above heat exchange module and the liquefaction condensation module, which becomes a passage through which cooling water vapor generated in the above cold heat generation module passes through the above heat exchange module and moves to the above liquefaction condensation module; A second flow path connecting the above-mentioned liquefaction condensation module and the above-mentioned cold heat generation module so that condensate formed in the above-mentioned liquefaction condensation module is re-supplied to the above-mentioned cold heat generation module; and A third flow path connecting the heat supply module and the cold heat generation module so that the thermal energy captured in the heat supply module is transferred as a heat source for the vaporization action of the cold heat generation module; A vacuum cooling system utilizing semiconductor heat energy, characterized in that each module, including, is organically interconnected.

Description

Semiconductor Heat Energy Utilization Vacuum Cooling System The present invention relates to a vacuum cooling system utilizing semiconductor heat energy, and more specifically, to a vacuum cooling system utilizing semiconductor heat energy that uses water as a working fluid, generates cooling steam using the latent heat of vaporization under vacuum, and performs high-efficiency and eco-friendly cooling by integrally controlling the heat exchange, condensation, and recirculation processes of the steam and the supply of semiconductor waste heat as a heat source. With the expansion of the AI industry, the construction and operation of AI data centers are increasing, and the associated massive power consumption is emerging as a major challenge. In particular, large-scale thermal energy is generated during the operation of semiconductor chips within data centers, and high-temperature heat sources of approximately 90°C are formed per unit chip; therefore, continuous and powerful cooling is essential for stable operation. In this regard, it is known that power consumption for cooling semiconductor heat accounts for a significant portion (about 40%) of the total power consumption of data centers, and thus, cooling itself is pointed out as a key factor limiting the energy efficiency of data centers. Conventional cooling methods have primarily relied on chiller-based cooling systems, which have a structural limitation in that they require a continuous input of separate power for cooling. Furthermore, as the efficiency limitations of existing cooling systems have accumulated, new cooling technologies such as liquid cooling or immersion cooling are emerging as alternatives to address these issues. This suggests that conventional technologies are unable to sufficiently meet the demands for cooling efficiency and energy savings required in high-heat, high-density environments. Meanwhile, conventional refrigeration technology frequently uses Freon-based refrigerants, and the use of such refrigerants has been cited as one of the causes of the climate crisis and global warming due to their association with greenhouse gas emissions and ozone depletion. Consequently, conventional technology faces the problem of relying on refrigerants with potential environmental hazards to ensure cooling performance, leading to an increasing demand for eco-friendly cooling technologies. Furthermore, in conventional technology, there is a strong tendency for the high-temperature thermal energy generated by semiconductors to be largely treated as "wasted heat." In other words, there is a need for fundamental improvements from an energy-saving perspective, given the inefficiency where additional power is consumed for cooling on one hand, while the high-temperature heat source generated from semiconductor operation is not actively utilized as an effective energy source on the other. Furthermore, the method of using water as the working fluid and utilizing the latent heat of vaporization in a vacuum state suggests the possibility of achieving high-efficiency cooling based on the high latent heat characteristics compared to Freon-based refrigerants. For example, the utilization of the latent heat of vaporization of water under low pressure conditions (e.g., 10 Torr) is cited as the basis for high efficiency, and a comparison is also presented showing that the heat of vaporization of water is significantly higher (e.g., 2,500 kJ/kg vs. 220 kJ/kg) compared to the heat of vaporization (heat absorption) of conventional Freon-based refrigerants (R-22). However, in conventional technology, configuration and operation concepts for achieving continuous operation and efficiency at the system level by combining this water-vacuum-based cooling with the utilization of semiconductor waste heat have not been sufficiently presented. Therefore, there is a technical requirement for a high-efficiency vacuum cooling system that can generate cold energy by recovering and utilizing high-temperature heat generated from semiconductors as an effective heat source, while minimizing (or excluding) the use of environmentally hazardous substances, and stably supplying that cold energy. FIG. 1 is a schematic diagram showing the overall structure of a vacuum cooling system utilizing semiconductor heat generation energy according to one embodiment of the present invention. FIG. 2 is an exemplary diagram showing the movement path of cooling water vapor and condensate and the release path of cold energy through the organic linkage of each module in a vacuum cooling system utilizing semiconductor heat energy according to one embodiment of the present invention. Hereinafter, preferred embodiments in which the objectives of the present invention can be specifically realized will be described with reference to the attached drawings. In describing these embodiments, the same names and reference numerals are used for identical components, and additional descriptions thereof will be omi