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KR-102964134-B1 - PACKAGE STRUCTURE AND DISPLAY DEVICE

KR102964134B1KR 102964134 B1KR102964134 B1KR 102964134B1KR-102964134-B1

Abstract

The present invention relates to the field of semiconductor technology and discloses a package structure and a display device. The package structure comprises a metal bracket, a driving chip, a light-emitting assembly, a package member, and a metal cover plate; wherein the metal bracket includes a few pins and a first surface and a second surface configured oppositely, the driving chip is configured on the first surface of the metal bracket and is used to control the light-emitting state of the light-emitting assembly, the light-emitting assembly is configured on the second surface of the metal bracket and is electrically connected to the driving chip while passing through the metal bracket, the package member is configured on the metal bracket and the package member fixes the metal bracket and covers the driving chip and the light-emitting assembly, the few pins surround the driving chip and are partially exposed outside the package member, and the metal cover plate is configured on one side away from the driving chip and covers the front surface of the driving chip. Through the package structure and display device provided in the present invention, the signal interference problem of the driving chip existing in the prior art can be solved, thereby significantly improving the usability of the product.

Inventors

  • 우, 펑
  • 쩡, 치-헝
  • 후앙, 치엔-청

Assignees

  • 브라이텍 옵토일렉트로닉스 씨오., 엘티디. (지앙수)

Dates

Publication Date
20260512
Application Date
20221101
Priority Date
20220424

Claims (10)

  1. In the package structure, the above package structure is: A metal bracket comprising two or more pins and a first surface and a second surface configured opposite each other; A driving chip configured on the first surface of the metal bracket; A light-emitting assembly configured on a second surface of the metal bracket and electrically connected to the driving chip through the metal bracket, -the driving chip is used to control the light-emitting state of the light-emitting assembly-; A package member configured on the metal bracket, fixing the metal bracket and covering the driving chip and the light-emitting assembly, and surrounding the driving chip with the two or more pins that receive an external electrical signal and transmit it to the driving chip, while configuring the two or more pins to be partially exposed to the outside of itself; and a metal cover plate covering the front of the driving chip, which is configured on one side away from the light-emitting assembly, and the driving chip is configured thereon. The above package member comprises an opaque first colloidal curing layer, the first colloidal curing layer fixes the metal bracket, forms a first groove on a first surface of the metal bracket, and forms a second groove on a second surface of the metal bracket, the driving chip is mounted inside the first groove, and the light-emitting assembly is mounted inside the second groove. A package structure characterized in that the above package member comprises a transparent second colloidal curing layer and an insulating adhesive, wherein the second colloidal curing layer is filled into the second groove and covers the light-emitting assembly, and the metal cover plate is fixed inside the first groove through the insulating adhesive.
  2. In paragraph 1, A package structure characterized in that the metal bracket and the metal cover plate have an integrated structure, and the metal cover plate is configured to face the first surface of the metal bracket and forms a receiving gap for mounting the driving chip in the space between the first surface of the metal bracket.
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  5. In paragraph 1, A package structure characterized in that the above two or more pins surround the outer surfaces of the first surface and the second surface while being exposed outside the first colloid cured layer, and the pins extend to the lower surface of the first colloid cured layer facing the first surface.
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  8. In paragraph 1, A package structure characterized in that the above two or more pins start at the position of the first surface and extend to a lower surface opposite to the first surface while being exposed outside the first colloid cured layer, and the above two or more pins surround the first groove.
  9. In paragraph 8, A package structure characterized in that the metal bracket comprises two or more positioning blocks, the two or more positioning blocks are distributed around the first groove and surround the metal cover plate.
  10. In a display device, A display device comprising two or more package structures described in any one of claims 1, 2, 5, 8, and 9, wherein the two or more package structures are arranged in a matrix.

Description

Package Structure and Display Device The present invention relates to the field of semiconductor technology, and in particular to package structures and display devices. A Light Emitting Diode (LED) is a solid-state semiconductor device capable of converting electrical energy into visible light. It uses a solid-state semiconductor chip as a light-emitting material to induce photon radiation by generating complex energy emission through carriers, thereby directly converting electrical energy into light energy. LED light sources are widely used in the field of display technology due to their advantages, such as high brightness, compact size, low energy consumption, and high stability. Among these, the key to increasing the resolution of LED displays lies in reducing the size of the LED package unit. In the related technology, a vertical package structure, that is, a structure in which the LED chip and the driver chip are configured on opposite sides, was applied to reduce the size of the LED package unit. However, due to this package structure, the driver chip is easily subjected to interference from external signals, and during the operation of the driver chip, signal interference is easily created with other components on the circuit board, which affects the normal use of the LED package unit. The present invention aims to solve the signal interference problem of a driving chip existing in the prior art by devising a package structure and a display device. In a first aspect, the present invention provides a package structure, such package structure comprising: a metal bracket including a few pins and a first surface and a second surface configured oppositely; a driving chip configured on the first surface of the metal bracket; a light-emitting assembly configured on the second surface of the metal bracket, electrically connected to the driving chip while passing through the metal bracket, and used to control the driving chip's own light-emitting state; a package member configured on the metal bracket, which fixes the metal bracket and covers the driving chip and the light-emitting assembly, and surrounds the driving chip with the few pins that receive an external electrical signal and transmit it to the driving chip, while partially exposing the few pins to the outside of itself; and a metal cover plate configured on one side away from the driving chip and covering the front of the driving chip. In one embodiment, the metal bracket and the metal cover plate have an integral structure, and the metal cover plate is configured to face the first surface of the metal bracket and forms a receiving gap for mounting the driving chip in the space between the first surface of the metal bracket and the metal cover plate. In one embodiment, the package member comprises an opaque first colloidal curing layer, the first colloidal curing layer is used to fix the metal bracket, fill the receiving gap, and cover the driving chip, the first colloidal curing layer forms a receiving groove on a second surface of the metal bracket, and the metal assembly is mounted inside the receiving groove. In one embodiment, the package member comprises a transparent second colloidal curing layer, the second colloidal curing layer fills the receiving groove and covers the light-emitting assembly. In one embodiment, the pins surround the outer surfaces of the first and second surfaces while being exposed outside the first colloidal curing layer, and the pins extend to the lower surface of the first colloidal curing layer facing the first surface. In one embodiment, the package member comprises an opaque first colloidal curing layer, the first colloidal curing layer fixes the metal bracket, forms a first groove on a first surface of the metal bracket, and forms a second groove on a second surface of the metal bracket, the driving chip is mounted inside the first groove, and the light-emitting assembly is mounted inside the second groove. In one embodiment, the package member comprises a transparent second colloidal curing layer and an insulating adhesive, wherein the second colloidal curing layer is filled into the second groove and covers the light-emitting assembly, and the metal cover plate is fixed inside the first groove through the insulating adhesive. In one embodiment, the small pin starts at the position of the first surface and extends to a lower surface opposite to the first surface while being exposed outside the first colloidal hardening layer, and the small pin surrounds the first groove. In one embodiment, the metal bracket includes a few positioning blocks, the few positioning blocks are distributed around the first groove and surround the metal cover plate. The package structure provided in the present invention comprises a metal bracket, a driving chip, a light-emitting assembly, a package member, and a metal cover plate. The driving chip and the light-emitting assembly are each configured on opposite sides of the metal brac