KR-102964180-B1 - In-situ process chamber chuck cleaning by cleaning substrate

Abstract

A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on the lower side of the substrate. One or more structures within the one or more patterns attract one or more particles from the chuck through at least one of electrostatic attraction or mechanical trapping when the substrate is placed on the chuck.

Inventors

• 아자리아 모르
• 비엘리 지암피에트로
• 마크 샤이
• 우지엘 요람
• 파히마 아디

Assignees

• 케이엘에이 코포레이션

Dates

Publication Date

20260512

Application Date

20200609

Priority Date

20191113

Claims (20)

1. In a cleaning assembly, substrate Includes, One or more patterns are formed on the lower side of the substrate, and one or more structures within the one or more patterns attract one or more particles from the chuck through at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck, and The above substrate includes one or more storage units, and A cleaning assembly configured to transport one or more chemical reactants, wherein the above one or more reservoirs are configured to carry one or more chemical reactants.
2. A cleaning assembly according to claim 1, wherein the substrate comprises a ceramic wafer.
3. A cleaning assembly according to claim 1, wherein the substrate is formed as a semiconductor wafer.
4. A cleaning assembly according to claim 1, wherein the one or more structures within the one or more patterns are formed of carbon nanotubes (CNT).
5. A cleaning assembly according to claim 1, wherein the substrate is configured for operation through a handling device.
6. A cleaning assembly according to claim 1, wherein the substrate comprises a plurality of pattern types, and each pattern type is configured to attract particles of different sizes.
7. A cleaning assembly according to claim 1, wherein the electrostatic attraction is caused by van der Waals forces.
8. In paragraph 1, One or more batteries; and It further includes a conductive element attached to the upper side of the above substrate, and A cleaning assembly in which one or more of the above batteries are electrically coupled to the conductor element.
9. In claim 8, the above chuck is a cleaning assembly that is conductive and connected to ground.
10. A cleaning assembly according to claim 9, wherein the one or more batteries are configured to set an electric field of 0.1 to 5 kV between the conductor element and the chuck to enhance electrostatic-based absorption of charged particles from the chuck.
11. A cleaning assembly according to claim 1, wherein the substrate comprises one or more valves for releasing the one or more chemical reactants from the one or more reservoirs to the chuck.
12. A cleaning assembly according to claim 11, wherein the one or more valves comprises one or more mechanical valves configured to open when the substrate is positioned on the chuck.
13. A cleaning assembly according to claim 1, wherein the one or more reservoirs are configured to release the one or more chemical reactants upon exposure to thermal shock.
14. A cleaning assembly according to claim 13, wherein the one or more reservoirs comprise one or more valves that can be activated by a shape memory alloy actuator, and the shape memory alloy actuator is configured to open the one or more valves based on a temperature change of the shape memory alloy actuator.
15. A cleaning assembly according to claim 1, wherein the substrate can be mounted in a cleaning substrate cabinet and the substrate can be transferred from the cleaning substrate cabinet to a process chamber through a handling device.
16. In the system, Cleaning circuit board cabinet Includes, The cleaning substrate cabinet is configured to store a cleaning substrate, and one or more patterns are formed on the lower side of the cleaning substrate, and one or more structures within the one or more patterns attract one or more particles from the chuck through at least one of electrostatic attraction or mechanical trapping when the cleaning substrate is placed on the chuck, The above cleaning substrate includes one or more reservoirs, and A system in which one or more of the above-mentioned storage units are configured to transport one or more chemical reactants.
17. In the system, A process chamber comprising one or more wafer chucks; and Handling device Includes, The handling device is configured to accommodate a cleaning substrate cabinet comprising one or more cleaning substrates, and the handling device is also configured to translate the one or more cleaning substrates from the cleaning substrate cabinet to one or more wafer chucks within the process chamber, and one or more patterns are formed on the lower side of the one or more cleaning substrates, and one or more structures within the one or more patterns attract one or more particles from the one or more wafer chucks through at least one of electrostatic attraction or mechanical trapping when the one or more cleaning substrates are positioned on the one or more wafer chucks, and The above cleaning substrate includes one or more reservoirs, and A system in which the above one or more reservoirs are configured to transport one or more chemical reactants
18. In terms of method, A step of providing a cleaning substrate to a cleaning substrate cabinet; A step of moving the cleaning substrate from the cleaning substrate cabinet onto a wafer chuck contained within a process chamber using a handling device; and A step of cleaning the surface of the wafer chuck with the above cleaning substrate Includes, One or more patterns are formed on the lower side of the cleaning substrate, and one or more structures within the one or more patterns attract one or more particles from the wafer chuck through at least one of electrostatic attraction or mechanical trapping when the cleaning substrate is positioned on the wafer chuck, and The above cleaning substrate includes one or more reservoirs, and A method in which the above one or more reservoirs are configured to transport one or more chemical reactants.
19. delete
20. delete

Description

In-situ process chamber chuck cleaning by cleaning substrate Cross-reference regarding related applications This application claims the benefit of priority to U.S. Provisional Application No. 62/859,587, filed on June 10, 2019, under 35 U.S.C. § 119(e), titled “IN SITU PROCESS CHAMBER CHUCK CLEANING BY DUMMY SUBSTRATE”, in which the inventors are named Mor Azaria, Giampietro Bieli, Shai Mark, Adi Pahima, and Yoram Uziel, the entirety of which is incorporated herein by reference. This application also [claims] 35 U.S.C. Under § 119(e), the benefit of priority of U.S. provisional application No. 62/910,139 filed on October 3, 2019, under the title “IN-SITU PROCESS CHAMBER CHUCK CLEANING BY CLEANING SUBSTRATE”, named as inventors Mor Azaria, Giampietro Bieli, Shai Mark, Adi Pahima, and Yoram Uziel, the entirety of which is incorporated herein by reference. Technology field The present invention generally relates to chuck cleaning, and more specifically to in-situ process chamber chuck cleaning. Chuck cleaning becomes frequently necessary due to the presence of particles in the process chamber. These particles can be introduced into the process chamber in various ways. Materials used by the process tool can accumulate on the walls of the process chamber, generating contaminant particles. Subsequently, particulate matter from this material can detach from the process chamber walls during processing. Additionally, external particles can be transported into the process chamber by external objects, such as wafers. These particles cause the wafer to have uneven contact with the process chuck of a given process tool, leading to non-uniform temperature levels across the wafer during processing. Currently, chuck cleaning is performed by opening the equipment and using a manual cleaning process. Often, the chuck is cleaned manually using tissues or brushes. In such cases, the cleaning process requires machine shutdown, vacuum purging, and equipment cooling. Furthermore, access to the chuck is very limited, and it is highly likely that the process chamber cover must be opened to reach the wafer chuck of a given process tool. These manual cleaning and machine setup processes are lengthy and often require complex calibration processes. In this way, it would be advantageous to provide a system and method for improving the disadvantages of the conventional approach identified above. A cleaning assembly according to one or more embodiments of the present disclosure is disclosed. In one embodiment, the cleaning assembly comprises a substrate. In another embodiment, one or more patterns are formed on the lower side of the substrate. In another embodiment, one or more structures within one or more patterns attract one or more particles from the chuck through at least one of electrostatic attraction or mechanical trapping when the substrate is placed on the chuck. A system according to one or more embodiments of the present disclosure is disclosed. In one embodiment, the system includes a process chamber. The process chamber may include one or more chucks. In another embodiment, the system includes a handling device. The handling device may be configured to accommodate a cleaning substrate cabinet comprising one or more cleaning substrates. The handling device may also be configured to translate one or more cleaning substrates from the cleaning substrate cabinet to one or more wafer chucks within the process chamber. In another embodiment, one or more patterns are formed on the lower side of one or more cleaning substrates. In another embodiment, one or more structures within one or more patterns attract one or more particles from one or more wafer chucks through at least one of electrostatic attraction or mechanical trapping when one or more cleaning substrates are positioned on one or more wafer chucks. A characterization system according to one or more embodiments of the present disclosure is disclosed. In one embodiment, the characterization system includes a characterization subsystem. The characterization subsystem may be configured to inspect a portion of a wafer arranged on a chuck of a process tool. The characterization subsystem may be further configured to generate characterization data based on the inspection of the portion of the wafer arranged on the chuck of the process tool. In another embodiment, the characterization system includes a controller comprising one or more processors configured to receive inspection data from the characterization subsystem. In another embodiment, the characterization system includes a controller comprising one or more processors configured to determine one or more cleaning parameters based on the characterization data. In another embodiment, the characterization system includes a controller comprising one or more processors configured to instruct one or more robot assemblies to position a cleaning substrate on the chuck of a process tool. A method according to one or more embodiments