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KR-102964215-B1 - Fe-Ni alloy foil, method for manufacturing Fe-Ni alloy foil, and parts

KR102964215B1KR 102964215 B1KR102964215 B1KR 102964215B1KR-102964215-B1

Abstract

The present invention aims to suppress deformations such as edge wave, central elongation, and bending in an ultra-thin (thickness 50 μm or less) Fe-Ni alloy foil, and to obtain an Fe-Ni alloy foil in which such deformations are suppressed. The Fe-Ni alloy foil according to the present invention has a positron extinction lifetime (PAL) of 0.150 ns or more, and can reduce the amount of deformation (a comprehensive evaluation amount of deformations such as edge wave, central elongation, and bending) compared to conventional products. In order to achieve a PAL of 0.150 ns or more, the microstructure is made to have a porous structure, so an alloy ingot (slab) is manufactured by HIP treatment, and the Fe-Ni alloy foil can be obtained by rolling and heat treating the alloy ingot according to a conventional method.

Inventors

  • 오야마 줌페이
  • 요네무라 미츠하루
  • 나카무라 하지메

Assignees

  • 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤

Dates

Publication Date
20260512
Application Date
20230612
Priority Date
20220630

Claims (9)

  1. The component, in mass%, C: 0∼0.030%, Si: 0∼0.21%, Mn: 0∼0.30%, Ni: 30.0∼60.0%, Co: 0∼5.00%, P: 0.01% or less, S: 0.01% or less, and The remainder is Fe and impurities, Fe-Ni alloy foil characterized by a plate thickness of 50 μm or less and a positron annihilation lifetime of 0.150 ns or more.
  2. The Fe-Ni alloy foil of claim 1, wherein the positron annihilation lifetime is 0.150 ns to 0.200 ns.
  3. Fe-Ni alloy foil according to claim 1 or 2, wherein the plate thickness is 20 μm or less.
  4. A method for manufacturing an Fe-Ni alloy foil as described in claim 1 or 2, The component, in mass%, C: 0∼0.030%, Si: 0∼0.21%, Mn: 0∼0.30%, Ni: 30.0∼60.0%, Co: 0∼5.00%, P: 0.01% or less, S: 0.01% or less, and A process for preparing Fe-Ni alloy powder in which the remainder is Fe and impurities, and A method for manufacturing an Fe-Ni alloy foil, characterized by including a process for manufacturing an Fe-Ni alloy ingot by the HIP method using the above Fe-Ni alloy powder, and a rolling process for rolling the above Fe-Ni alloy ingot.
  5. A method for manufacturing an Fe-Ni alloy foil according to claim 4, further comprising at least one annealing process between each rolling pass of the rolling process or after the final rolling.
  6. In claim 4, a method for manufacturing an Fe-Ni alloy foil having a plate thickness of 20 μm or less.
  7. In claim 5, a method for manufacturing an Fe-Ni alloy foil having a plate thickness of 20 μm or less.
  8. A part having the Fe-Ni alloy foil described in claim 1 or 2.
  9. In claim 8, a part having a plate thickness of the Fe-Ni alloy foil of 20 μm or less.

Description

Fe-Ni alloy foil, method for manufacturing Fe-Ni alloy foil, and parts The present invention relates to an Fe-Ni metal foil, a method for manufacturing the Fe-Ni metal foil, and a part using the Fe-Ni alloy foil. With the miniaturization and high-density packaging of electronic devices, downsizing and weight reduction of each electronic component constituting the device are required. For example, aluminum foil or stainless steel foil containing Fe-Ni alloy is used as a case for secondary batteries. While thinning of the case plate thickness is sought to make secondary batteries lighter and thinner, it is also required to maintain strength. Therefore, thinning is being pursued by switching from conventional aluminum foil to stainless steel foil while maintaining strength (e.g., Patent Document 1). In addition, thinning is required not only for components used in the electronic device itself, but also for materials and components that are indispensable for the manufacture of electronic devices. For example, metal masks indispensable for the manufacture of organic light-emitting diodes (OLEDs) utilize Fe-Ni alloy foils with good etchability and thermal expansion properties, but thinning is required due to the increase in pixel density (e.g., Patent Document 2). As such, in response to the demand for thinning of Fe-Ni alloy foils, Fe-Ni alloy foils with a thickness of 100 μm or less are being distributed, and furthermore, Fe-Ni alloy foils with a thickness of 50 μm or less are being required. Figure 1 is a diagram illustrating an example of the relationship between PAL and deformation amount in Fe-Ni alloy foil. Figure 2 is a diagram illustrating an overview of a vertical suspension test. Figure 3 is a conceptual diagram illustrating an example of a method for measuring the gap between the test specimen and the vertical plane in a vertical suspension test. Hereinafter, the Fe-Ni alloy foil according to the present invention will be described in detail. Unless otherwise specifically noted, "%" regarding the composition indicates the mass percentage in the steel. Cases where a lower limit is not specifically specified or where the lower limit is 0% include cases where it is not contained (0%). [Palternative Annihilation Lifetime (PAL)] Positron Annihilation Lifetime (PAL) is an indicator used to evaluate lattice defects, including vacancies, in materials such as metallic or polymeric materials. It is also sometimes referred to as average positron annihilation lifetime. PAL can evaluate the types of lattice defects. PAL is a comprehensive indicator of the number of vacancies and the size of the vacancies in the material. In the present invention, vacancies refer not to defects such as shrinkage cavities or gas vacancies that occur during solidification in castings, but to atomic vacancies or point defects. Although a detailed explanation of PAL is omitted here, the PAL becomes longer as the vacancies increase in size. Meanwhile, as the number of vacancies increases, the detected relative intensity (the count of γ-rays emitted when a positron is annihilated, equivalent to the probability of existence) increases; as the number of vacancies increases, bonding occurs between the vacancies, and as a result, the vacancies become larger and the PAL becomes longer. Positron extinction lifetime (PAL) can be measured by a PAL measuring device. As a PAL measuring device, commercially available devices such as the positron extinction lifetime measuring device manufactured by TechnoAP can be used. The inventors evaluated using 22 Na as the positron source with the positron extinction lifetime measuring device manufactured by TechnoAP. When evaluating PAL, the Fe-Ni alloy foil to be evaluated is cut into 10 mm squares, and two sets of three layers are prepared by stacking three of these layers. A positron source is inserted into the three-layered Fe-Ni alloy foil, and this is wrapped in aluminum foil to secure it, thereby preparing a sample for PAL measurement. The prepared sample is placed in a measuring device to measure the positron annihilation lifetime (PAL). It is also recommended to use data analysis software attached to the measuring device (e.g., PALSfit3 developed by the Technical University of Denmark). When measuring, in order to account for the influence of the Kapton film lifetime (0.3800 ps) or the epoxy resin lifetime (1.9044 ps), it is recommended to fix these lifetimes for analysis. Materials manufactured by the conventional solvent method (solvent materials) are free of voids, and the primary lattice defects are dislocations. Furthermore, in the case of solvent materials, dislocations are not introduced uniformly throughout the entire material during the solidification process. Simply put, the state of dislocations differs between the surface and the center of the solidified alloy ingot. When dislocations are the primary defects, if the yield stress is exceeded due to stress concentration caused by processing