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KR-102964300-B1 - Drive Integrated Circuit and Method for Manufacturing thereof

KR102964300B1KR 102964300 B1KR102964300 B1KR 102964300B1KR-102964300-B1

Abstract

A driving integrated circuit according to an embodiment of the present invention for driving a display panel that outputs an image comprises: a base substrate; a metal pad located on the base substrate; a protective layer located on the base substrate and the metal pad; and a bump located on the metal pad and the protective layer, wherein the upper surface of the bump has a uniform height.

Inventors

  • 박규성

Assignees

  • 주식회사 엘엑스세미콘

Dates

Publication Date
20260513
Application Date
20211227

Claims (15)

  1. In a driving integrated circuit for driving a display panel that outputs an image, Base substrate; A metal pad located on the above base substrate; A protective layer located on the base substrate and the metal pad; and It includes the metal pad and the bump located on the protective layer; The above protective layer overlaps at least partially with the bump, and A driving integrated circuit characterized in that the height of the bump in the area overlapping with the protective layer and the height in the area not overlapping with the protective layer are the same, so that the upper surface of the bump has a uniform height.
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  3. In paragraph 1, The above protective layer overlaps at least partially with the bump, and A driving integrated circuit characterized in that the bump has a first thickness in an area overlapping with the protective layer and a second thickness in an area not overlapping with the protective layer, and the first thickness is smaller than the second thickness.
  4. In paragraph 1, A driving integrated circuit characterized in that the protective layer is positioned to cover the side of the metal pad by overlapping with the edge portion of the metal pad and is positioned by overlapping with the edge portion of the bump.
  5. In paragraph 1, A driving integrated circuit characterized by including at least one barrier metal layer located between the metal pad and protective layer and the bump.
  6. In paragraph 5, The above barrier metal layer includes a first barrier metal layer and a second barrier metal layer, and The first barrier metal layer is in direct contact with the metal pad and is in direct contact with the side surface of the protective layer and at least a portion of the upper surface of the protective layer, and A driving integrated circuit characterized in that the second barrier metal layer is located on the first barrier metal layer.
  7. In paragraph 5, A driving integrated circuit characterized in that the barrier metal layer has the same area as the bump.
  8. In paragraph 1, The above display panel includes gate lines, data lines, and touch sensors, and The driving integrated circuit is characterized by driving or controlling at least one of the gate lines, the data lines, or the touch sensors.
  9. A step of forming a metal pad by patterning a metal pad material on a base substrate; A step of forming a protective layer by patterning a protective layer material; Step of applying bump material; A step of flattening the upper surface of the bump material; and The method includes the step of patterning the bump material to generate the bump; The above protective layer overlaps at least partially with the bump, and A method for manufacturing a driving integrated circuit, characterized in that the height of the bump in the area overlapping with the protective layer and the height in the area not overlapping with the protective layer are the same, so that the upper surface of the bump has a uniform height.
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  11. In Paragraph 9, The above protective layer overlaps at least partially with the bump, and The above bump has a first thickness in the area overlapping with the protective layer and a second thickness in the area not overlapping with the protective layer, A method for manufacturing a driving integrated circuit characterized in that the first thickness is a smaller value than the second thickness.
  12. In Paragraph 9, A method for manufacturing a driving integrated circuit characterized in that the protective layer is positioned overlapping the edge portion of the metal pad, covers the side of the metal pad, and is positioned overlapping the edge portion of the bump.
  13. In Paragraph 9, The step of flattening the upper surface of the bump material is, A method for manufacturing a driving integrated circuit characterized by flattening the upper surface of the bump material through a chemical mechanical polishing (CMP) process.
  14. In Paragraph 9, The step of forming a protective layer by patterning the above protective layer material is: Step of applying the above protective layer material; Step of patterning the applied protective layer material; and A method for manufacturing a driving integrated circuit, characterized by further including the step of applying a metal barrier layer material.
  15. In Paragraph 14, The step of patterning the bump material to generate the bump is, Step of applying the above bump material; Step of patterning the applied bump material; and A method for manufacturing a driving integrated circuit, characterized by further including the step of patterning a coated metal barrier layer material.

Description

Drive Integrated Circuit and Method for Manufacturing thereof This specification relates to a driving integrated circuit and a method for manufacturing the same. Driven by the recent development of the display device industry, such as LCDs, the manufacturing industry for driver integrated circuits (drive ICs) used in display devices is also advancing. In particular, in line with the trend toward lighter, thinner, and smaller display devices, packaging technology for driver integrated circuits used in display devices is constantly evolving. For example, there are Chip-On-Film (COF) bonding technology, which bonds driver integrated circuits to a flexible film substrate, and Chip-On-Glass (COG) bonding technology, which bonds driver integrated circuits to a glass substrate. FIG. 1 is a perspective view of a display device including an integrated driving circuit according to one embodiment of the present invention. Figure 2 is a cross-sectional view taken along II' of Figure 1. FIG. 3 is a cross-sectional view of an integrated driving circuit according to one embodiment of the present invention. FIG. 4 is a flowchart illustrating a method for manufacturing an integrated driving circuit according to one embodiment of the present invention. FIGS. 5a to 5j are drawings illustrating a method for manufacturing an integrated driving circuit according to an embodiment of the present invention. Throughout the specification, identical reference numbers denote substantially identical components. In the following description, detailed descriptions of components and functions known in the art may be omitted if they are not related to the core components of the invention. The meanings of the terms described in this specification should be understood as follows. The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the depicted details. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing the present invention, if it is determined that a detailed description of related known technology may unnecessarily obscure the essence of the present invention, such detailed description is omitted. Where terms such as 'comprising,' 'having,' 'consisting of,' etc. are used in this specification, other parts may be added unless 'only' is used. Where a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise. In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement. Although terms such as "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of the present invention. The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship. Hereinafter, an integrated driving circuit according to an embodiment of the present invention and a display device including the same will be described in detail with reference to FIGS. 1 to 3. FIG. 1 is a perspective view of a display device including an integrated driving circuit according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along I-I' of FIG. 1, and FIG. 3 is a cross-sectional view of an integrated driving circuit according to one embodiment of the present invention. Referring to FIG. 1, the display device may include a display panel (10) on which an image is output, a printed circuit board (main board) (70) on which various circuit components are mounted, a flexible printed circuit (FPC) (60) for connecting the printed circuit board (70) and the display panel (10), and a driving integrated circuit (D-IC) (20) mounted on the display panel (10) to drive the display panel (10) according to an electrical signal transmitted from the printed circui