KR-102964394-B1 - LASER DRILLING STAGE

Abstract

A laser drilling stage according to an embodiment of the present invention is a laser drilling stage in which a laser process is performed on a display panel, comprising: a rectangular platen; a lower bridge attached and arranged along the longitudinal direction of the upper surface of the platen; an upper bridge attached to the upper portion of the lower bridge; a transfer track installed on the upper portion of the upper bridge; an inner magnet array installed on one side along the longitudinal direction of the transfer track; an outer magnet array installed on the other side along the longitudinal direction of the transfer track; a transfer magnet array installed on the upper surface of the transfer track; a mover that moves along the longitudinal direction along the transfer track; a fixing chuck installed on the upper portion of the mover to fix a workpiece panel; a UVW stage installed between the mover and the fixing chuck; a bracket attached to the side of the mover; a first mover installed on the lower portion of the mover to provide thrust to the mover at a position corresponding to the inner magnet array; a second mover installed on the lower portion of the bracket to provide thrust to the mover at a position corresponding to the transfer magnet array; and the outer magnet array and It includes a third mover that provides thrust to the mover at a corresponding position.

Inventors

• 조규중

Assignees

• 이노로보틱스 주식회사

Dates

Publication Date

20260513

Application Date

20241017

Claims (6)

1. As a laser drilling stage on which a laser process is performed on a display panel, Square-shaped plate; A lower bridge attached and arranged along the longitudinal direction of the upper surface of the above plate; An upper bridge attached to the upper part of the lower bridge above; A transfer track installed on the upper part of the upper bridge; An inner magnet array installed on one side in the longitudinal direction of the above transfer track; An outer magnet array installed on the other side in the longitudinal direction of the above transfer track; A transfer magnet array installed on the upper surface of the above transfer track; A mover that is transported longitudinally along the above-mentioned transport track; A fixing chuck installed on the upper part of the above mover to fix the workpiece panel; A UVW stage installed between the above mover and the above fixed chuck; A bracket attached to the side of the above-mentioned mover; A first mover installed at the lower part of the mover and providing thrust to the mover at a position corresponding to the inner magnet array; A second mover providing thrust to the mover at a position corresponding to the above-mentioned transfer magnet array; and A laser drilling stage characterized by including a third mover installed at the lower part of the bracket and providing thrust to the mover at a position corresponding to the outer magnet array.
2. In paragraph 1, A laser drilling stage characterized by the fact that the outer magnet array comprises at least two magnet arrays installed in parallel.
3. In paragraph 2, A laser drilling stage characterized by further including an extension beam connected to and attached to the transfer track to support at least two magnet arrays at the lower part of the at least two magnet arrays.
4. In paragraph 3, A laser drilling stage characterized by including a spacer located between at least two magnet arrays on the upper part of the expansion beam.
5. In paragraph 3, A laser drilling stage characterized by further including a cable tray installed on the longitudinal side of the extension beam to support a cable.
6. In paragraph 1, A laser drilling stage characterized by the upper bridge being sealed with bellows and in a vacuum state.

Description

Laser Drilling Stage The present invention relates to a laser drilling stage, and more specifically, to a laser drilling stage used in a large-area display manufacturing process. As smartphones evolve day by day, the displays installed in them are being replaced by OLED displays. In particular, bezel-less OLEDs, which have been a major topic, serve as a material for the premiumization of smartphones, and most companies leading the market are adopting this technology. Specifically, to reduce the bezel area and maximize the screen size, holes must be drilled for the transmitter, camera, ambient light sensor, and infrared sensor; lasers are used in the technology to form these highly precise holes. In particular, to achieve this, a process called laser etching or laser drilling is performed between the deposition and thin film encapsulation processes in the manufacturing process of OLED displays. In the case of smartphones, precise position control is essential because the laser drilling process involves processing relatively small display panels. Recently, display devices equipped with large-area display panels, such as large smart TVs and monitors, have emerged. Throughout the development of the display industry, "large-scale expansion" has served as the foundation for sustainable growth by creating new markets and expanding scale. Large-scale expansion refers to the establishment of production lines for large-area display panels and the increase in panel size. Display manufacturers are making significant efforts to build large-area lines to increase productivity and produce large panels at lower costs. With the increase in display size, positional and repeatability accuracy decreases during panel transfer for laser drilling and laser processing in the display manufacturing process. Furthermore, as pixel sizes in display panels gradually decrease, process precision is increasing; consequently, precise stage position control and repeatability are essential for large-area display manufacturing. FIG. 1 is a perspective view of a laser drilling stage according to an embodiment of the present invention. FIG. 2 is a side perspective view of a laser drilling stage according to an embodiment of the present invention. FIG. 3 is a partial enlarged view of a laser drilling stage according to an embodiment of the present invention. Specific structural or functional descriptions regarding embodiments according to the concept of the present invention disclosed herein are provided merely for the purpose of explaining embodiments according to the concept of the present invention, and embodiments according to the concept of the present invention may be implemented in various forms and are not limited to the embodiments described herein. Terms such as "first" or "second" may be used to describe various components, but said components should not be limited by said terms. For the sole purpose of distinguishing one component from another, for example, without departing from the scope of rights according to the concept of the present invention, the first component may be named the second component and similarly the second component may be named the first component. When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. Conversely, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. Other expressions describing the relationships between components, such as "between" and "exactly between," or "adjacent to" and "directly adjacent to," should be interpreted in the same way. The terms used herein are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described herein, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings attached to this specification. The present invention relates to a stage used in a display laser drilling process, and more specifically, to a stage that performs laser processing on a display panel in a high vacuum state of 10⁻⁷ to 10⁻⁶ Torr. In particular, this relates to a stage that performs a laser process to produce mainly 6G to 8.5G displays among large-area displays, and for convenience of explanation, it is referred to as a laser drilling stage, which is the name of the p