KR-102964485-B1 - Circuit board and electronic apparatus including the same

KR102964485B1KR 102964485 B1KR102964485 B1KR 102964485B1KR-102964485-B1

Abstract

The present invention provides a circuit board and an electronic device equipped with the same, wherein a specific shape is marked at regular intervals on a dummy pattern inside a cut line of the circuit board to easily identify which circuit it is. The circuit board comprises: a substrate layer; a plurality of wiring patterns formed in parallel on one or both sides of the substrate layer; and a dummy pattern formed between the wiring patterns, wherein the dummy pattern includes a channel recognition pattern.

Inventors

김진현
권범준
손동은
이재문

Assignees

스템코 주식회사

Dates

Publication Date: 20260512
Application Date: 20210326

Claims (14)

Base layer; A plurality of wiring patterns formed on one or both sides of the above substrate layer, comprising a plurality of inner leads, a plurality of outer leads, and connecting wiring connecting an inner lead selected among the plurality of inner leads and an outer lead selected among the plurality of outer leads; and It includes a dummy pattern formed between two different outer leads, and The above dummy pattern is a circuit board including a pattern for channel recognition.
In Article 1, The above channel recognition pattern is a circuit board that displays the channel sequence number of itself or an adjacent wiring pattern.
In Article 1, The above channel recognition pattern is a circuit board formed between two different outer leads.
In Article 1, The above channel recognition pattern is a plurality of times, and the circuit board is formed spaced apart with respect to the direction in which the wiring patterns are formed in parallel.
In Article 4, A circuit board having wiring patterns of the same number of channels or a number of channels according to a certain rule formed within the spacing between the above-mentioned multiple channel recognition patterns.
In Article 5, The above plurality of channel recognition patterns are circuit boards having different shapes.
In Article 6, A circuit board that indicates the channel sequence number of a wiring pattern by varying the number of open regions, wherein the above-mentioned channel recognition pattern includes open regions along the length direction of the pattern.
In Article 7, A circuit board in which the above-mentioned open area is formed to be perpendicular or inclined with respect to the length direction of the channel recognition pattern.
In Article 8, The above channel recognition pattern is a circuit board including an island-type bar pattern formed between the above open areas.
In Article 6, A circuit board in which the above-mentioned channel recognition pattern includes recognition marks on the pattern surface or side, and the number or shape of the recognition marks is varied to indicate the channel sequence number of the wiring pattern.
In Article 10, The above recognition mark is a circuit board including a pattern of grooves or protrusions.
In Article 1, A circuit board in which the width between the above-mentioned channel recognition pattern and the adjacent wiring pattern is different from the width between the above-mentioned dummy pattern and the adjacent wiring pattern or the width between adjacent wiring patterns.
In Article 1, The above circuit board is a chip-on-film circuit board.
An electronic device having a circuit board according to any one of claims 1 to 13 mounted inside.

Description

Circuit board and electronic apparatus including the same The present invention relates to a circuit board and an electronic device equipped with the same. More specifically, it relates to a circuit board applicable to a chip-on-film and an electronic device equipped with the same. A Chip On Film (COF) is a type of flexible circuit board on which semiconductor devices are mounted and which is installed in electronic components or electronic devices. Such a Chip On Film uses a flexible film as a base substrate, and conductive wiring patterns can be formed on one or both sides of the base substrate. FIG. 1 is a cross-sectional view schematically illustrating the structure of a circuit board according to one embodiment of the present invention. FIG. 2 is a plan view for explaining a wiring layer constituting a circuit board according to one embodiment of the present invention. FIG. 3 is a first exemplary diagram illustrating a dummy pattern and a channel recognition pattern of a wiring layer constituting a circuit board according to one embodiment of the present invention. FIG. 4 is a second exemplary diagram for explaining a dummy pattern and a channel recognition pattern of a wiring layer constituting a circuit board according to one embodiment of the present invention. FIG. 5 is a third exemplary diagram illustrating a dummy pattern and a channel recognition pattern of a wiring layer constituting a circuit board according to one embodiment of the present invention. FIG. 6 is a fourth exemplary diagram illustrating a dummy pattern and a channel recognition pattern of a wiring layer constituting a circuit board according to an embodiment of the present invention. FIG. 7 is a fifth exemplary diagram illustrating a dummy pattern and a channel recognition pattern of a wiring layer constituting a circuit board according to one embodiment of the present invention. FIG. 8 is a sixth exemplary diagram illustrating a dummy pattern and a channel recognition pattern of a wiring layer constituting a circuit board according to one embodiment of the present invention. FIG. 9 is a seventh exemplary diagram illustrating a dummy pattern and a channel recognition pattern of a wiring layer constituting a circuit board according to one embodiment of the present invention. FIG. 10 is an eighth exemplary diagram illustrating a dummy pattern and a channel recognition pattern of a wiring layer constituting a circuit board according to one embodiment of the present invention. FIG. 11 is a ninth exemplary diagram illustrating a channel recognition pattern of a wiring layer constituting a circuit board according to one embodiment of the present invention. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components. When elements or a layer are referred to as being "on" or "on" another element or layer, it includes not only being directly on top of the other element or layer but also cases where another layer or element is interposed in between. On the other hand, when an element is referred to as being "directly on" or "directly on," it indicates that no other element or layer is interposed in between. Spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used to facilitate the description of the relationship between one element or component and other elements or components as illustrated in the drawings. Spatially relative terms should be understood as terms that include different orientations of the element during use or operation, in addition to the orientations illustrated in the drawings. For example, if an element illustrated in the drawings is flipped, an element described as "below" or "beneath" of another element may be placed "above" of that other element. Therefore, the exemplary term "below" may include both the lower and upper directions. Elements may also be oriented in other directions, and accordingly, spatially relative terms may be interpreted according to the orientation. Although terms such as "first," "second," etc. are used to describe various elements, components, and/or sections, it goes without saying that these elements, components, and/or sections are not limited by these terms. These terms are used merely to distinguish one element, com