KR-102964526-B1 - SEMICONDUCTOR INTERCONNECTION POST FEEDING UNIT AND TEST APPARATUS FOR SEMICONDUCTOR INTERCONNECTION POSTS INCORPORATING THE SAME

KR102964526B1KR 102964526 B1KR102964526 B1KR 102964526B1KR-102964526-B1

Abstract

A semiconductor connection post feeding unit according to the present invention comprises a post transfer unit that transfers a semiconductor connection post in a transfer direction through vibration, and a post supply unit connected to the post transfer unit that supplies the semiconductor connection post transferred from the post transfer unit onto a test rotary table. The post transfer unit and the post supply unit have a guide groove formed that is long and recessed along the transfer direction so that the semiconductor connection post is transferred in a seated state, and at the end of the guide groove, a cutting hole is formed with a bottom opening for a predetermined length so that the semiconductor connection post falls onto the test rotary table.

Inventors

이태현
편민욱
김경태
장현지
은동진

Assignees

덕산하이메탈(주)

Dates

Publication Date: 20260513
Application Date: 20240828

Claims (20)

A post transfer unit that transfers a semiconductor connection post in a transfer direction through vibration; and A post supply unit connected to the above post transfer unit and supplying a semiconductor connection post transmitted from the above post transfer unit onto a test rotary table; Includes, In the above post transfer unit and the above post supply unit, a guide groove that is long and recessed along the transfer direction is formed so that the semiconductor connection post is transferred in a seated state. The end portion of the guide groove is provided with a cutting hole with a bottom opening for a predetermined length so that the semiconductor connection post falls directly downward along the inner surface of the guide groove onto the test rotary table, thereby preventing the semiconductor connection post from scattering or overlapping when falling onto the test rotary table and allowing it to be stably seated in an aligned state. Semiconductor connection post-feeding unit.
In paragraph 1, The longitudinal section of the above guide groove is formed in a shape where downwardly sloping surfaces meet from both ends toward the center, Semiconductor connection post-feeding unit.
In paragraph 1, The width of the guide groove is formed to be 1.1 to 1.3 times the diameter of the semiconductor connection post, Semiconductor connection post-feeding unit.
In paragraph 1, The width of the cutting hole is formed to be 1.1 to 1.2 times the diameter of the semiconductor connection post, Semiconductor connection post-feeding unit.
In paragraph 1, The length of the cutting hole is formed to be 5 to 10 times the diameter of the semiconductor connection post, Semiconductor connection post-feeding unit.
In paragraph 1, The height between the end portion of the cutting hole and the seating surface of the test rotary table is formed to be 0.5 to 1 times the diameter of the semiconductor connection post. Semiconductor connection post-feeding unit.
In paragraph 1, The above post supply part is formed to be inclined downward toward the transfer direction, and the above post transfer part is formed to be inclined upward toward the transfer direction, The slope of the horizontal plane of the post supply section is formed to be greater than the slope of the horizontal plane of the post transfer section. Semiconductor connection post-feeding unit.
In paragraph 1, The above guide grooves are provided in plurality on the post transfer unit and the post supply unit, spaced apart in the width direction, and At the tip of the above post supply unit, a first through hole formed vertically between adjacent guide grooves and a second through hole formed vertically on the outer side of the outermost guide grooves on both sides are formed. Semiconductor connection post-feeding unit.
In paragraph 8, The cross-sectional area of the second through hole is formed to be larger than the cross-sectional area of the first through hole, Semiconductor connection post-feeding unit.
In paragraph 1, A post loading unit further comprising a post loading unit connected to the post transfer unit on the opposite side of the post supply unit, wherein a loading space is formed inside for loading the semiconductor connection post, and the semiconductor connection post is supplied to the post transfer unit side. Semiconductor connection post-feeding unit.
A test rotary table that provides a mounting surface on which a semiconductor connection post is mounted and performs a test on the semiconductor connection post; and A semiconductor connection post feeding unit comprising a post transfer unit that transfers a semiconductor connection post in a transfer direction through vibration, and a post supply unit connected to the post transfer unit and supplying the semiconductor connection post transferred from the post transfer unit onto the test rotary table; Includes, In the above post transfer unit and the above post supply unit, a guide groove that is long and recessed along the transfer direction is formed so that the semiconductor connection post is transferred in a seated state. The end portion of the guide groove is provided with a cutting hole with a bottom opening for a predetermined length so that the semiconductor connection post falls directly downward along the inner surface of the guide groove onto the test rotary table, thereby preventing the semiconductor connection post from scattering or overlapping when falling onto the test rotary table and allowing it to be stably seated in an aligned state. Test device for semiconductor connection posts.
In Paragraph 11, The longitudinal section of the above guide groove is formed in a shape where downwardly sloping surfaces meet from both ends toward the center, Test device for semiconductor connection posts.
In Paragraph 11, The width of the guide groove is formed to be 1.1 to 1.3 times the diameter of the semiconductor connection post, Test device for semiconductor connection posts.
In Paragraph 11, The width of the cutting hole is formed to be 1.1 to 1.2 times the diameter of the semiconductor connection post, Test device for semiconductor connection posts.
In Paragraph 11, The length of the cutting hole is formed to be 5 to 10 times the diameter of the semiconductor connection post, Test device for semiconductor connection posts.
In Paragraph 11, The height between the end portion of the cutting hole and the mounting surface of the test rotary table is formed to be 0.5 to 1 times the diameter of the semiconductor connection post. Test device for semiconductor connection posts.
In Paragraph 11, The above post supply part is formed to be inclined downward toward the transfer direction, and the above post transfer part is formed to be inclined upward toward the transfer direction, The slope of the horizontal plane of the post supply section is formed to be greater than the slope of the horizontal plane of the post transfer section. Test device for semiconductor connection posts.
In Paragraph 11, The above guide grooves are provided in plurality on the post transfer unit and the post supply unit, spaced apart in the width direction, and At the tip of the above post supply unit, a first through hole formed vertically between adjacent guide grooves and a second through hole formed vertically on the outer side of the outermost guide grooves on both sides are formed. Test device for semiconductor connection posts.
In Paragraph 18, The cross-sectional area of the second through hole is formed to be larger than the cross-sectional area of the first through hole, Test device for semiconductor connection posts.
In Paragraph 11, The above semiconductor connection post-feeding unit is, A post loading unit further comprising a post loading unit connected to the post transfer unit on the opposite side of the post supply unit, wherein a loading space is formed inside for loading the semiconductor connection post, and the semiconductor connection post is supplied to the post transfer unit side. Test device for semiconductor connection posts.

Description

Semiconductor Interconnection Post Feeding Unit and Test Apparatus for Semiconductor Interconnection Posts Including the Same The present invention relates to a semiconductor connection post feeding unit capable of improving inspection speed, inspection efficiency, and inspection accuracy by minimizing scattering or clumping during the process of supplying semiconductor connection posts to a test rotary table, and a test device for semiconductor connection posts including the same. With the advancement of semiconductor technology, high-density circuit packaging and the complexity of integrated circuits are increasing. This progress entails demands for miniaturization and high integration alongside improved semiconductor device performance; consequently, the reliability and accuracy of micro-electrical connection elements, such as semiconductor connection posts, have become increasingly critical. Traditionally, semiconductor connection posts have been primarily used in flip-chip packaging technology. In this technology, very small copper posts are used for the electrical connection of semiconductor chips, playing a crucial role in transmitting electrical signals between the substrate and the chip. However, accurately positioning and securing these fine connection posts is a major challenge during the manufacturing process, and there is a problem that the performance of the entire system may be degraded, especially if the posts are misaligned or incompletely connected during the testing process. In addition, although various feeding and alignment mechanisms were conventionally used to test semiconductor connection posts, misalignment, misalignment, or damage to the posts frequently occurred during the transfer and placement process due to the minute size and high precision requirements of the semiconductor connection posts. In addition, during the process of testing the dimensions (size, angle, etc.) and electrical characteristics of semiconductor connection posts using a rotary test table, if the semiconductor connection posts are not accurately seated on the rotary table, contact between micro-pins causes a problem that significantly affects the accuracy of test results and inspection yield. Therefore, a method to resolve these problems is required. FIG. 1 is a drawing showing the appearance of a test device for a semiconductor connection post according to one embodiment of the present invention. FIGS. 2 and FIGS. 4 are drawings showing the structure of a semiconductor connection post feeding unit in a test device for a semiconductor connection post according to an embodiment of the present invention. FIG. 5 is a diagram showing the supply of a semiconductor connection post to a test rotary table through a semiconductor connection post feeding unit in a test device for a semiconductor connection post according to one embodiment of the present invention. FIG. 6 is a drawing showing the specifications of a guide groove in a test device for a semiconductor connection post according to one embodiment of the present invention. FIG. 7 is a drawing showing the specifications of a cutting hole in a test device for a semiconductor connection post according to one embodiment of the present invention. FIG. 8 is a drawing showing the distance between a cutting hole and a test rotary table in a test device for a semiconductor connection post according to one embodiment of the present invention. FIG. 9 is a drawing showing the feeding form of a semiconductor connection post according to the specifications of a cutting hole in a test device for a semiconductor connection post according to one embodiment of the present invention. In this specification, where a component (or region, layer, part, etc.) is described as being "on," "connected," or "combined" with another component, it means that it may be directly placed/connected/combined with the other component, or that a third component may be placed between them. Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of the components are exaggerated for the effective illustration of the technical content. "And/or" includes all one or more combinations that the associated configurations can define. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise. Additionally, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the components depicted in the drawings. These terms are re