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KR-102964631-B1 - Heat dissipation substrate and Method for manufacturing the same

KR102964631B1KR 102964631 B1KR102964631 B1KR 102964631B1KR-102964631-B1

Abstract

The present invention relates to a heat dissipation substrate capable of ensuring stable thermal and electrical conductivity without peeling even in high-temperature environments, and a method for manufacturing the same. A heat dissipation substrate according to one embodiment of the present invention comprises a substrate having a metal as the main component; and a pair of heat dissipation layers laminated on both sides of the substrate, wherein the heat dissipation layers comprise conductive particles: 65 to 80 wt% and a polymer-based organic binder: 20 to 35 wt%.

Inventors

  • 송종석

Assignees

  • 피코맥스(주)
  • (주)샘씨엔에스
  • 주식회사 아이디티

Dates

Publication Date
20260513
Application Date
20250822

Claims (15)

  1. A substrate formed from one material selected from aluminum (Al), aluminum alloy, and stainless steel; It includes a pair of heat dissipation layers laminated on both sides of the above-mentioned material, and The heat dissipation layer comprises conductive particles: 65 to 80 wt% and a polymer-based organic binder: 20 to 35 wt%. The above conductive particles are used by mixing 60 to 90 wt% of first conductive particles having an average particle size of 1 to 10 μm and 10 to 40 wt% of second conductive particles having an average particle size of 0.05 to 0.2 μm. A heat dissipation substrate characterized in that the above-mentioned polymer-based organic binder is one or more non-silicon-based polymer binders selected from the group consisting of phenoxy groups, alkoxy groups, carboxyl polymers, polyesters, polyimides, and epoxy.
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  5. In paragraph 1, A heat dissipation substrate characterized in that the conductive particles are one or more types selected from the group consisting of graphene, carbon black, graphite, and carbon nanotubes (CNT).
  6. In paragraph 5, The above conductive particles are, Carbon nanotubes (CNT): 60 ~ 90 wt%, Graphite: 5 ~ 30wt%, Graphene: A heat dissipation substrate containing 1 to 10 wt%.
  7. In paragraph 6, The above conductive particles are, A heat dissipation substrate further containing 1 to 5 wt% carbon black.
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  10. In paragraph 1, The thickness of the above-mentioned material is 45 to 55 μm, and A heat dissipation substrate characterized by the thickness of the heat dissipation layer being 50 to 165 μm.
  11. In paragraph 1, The heat dissipation substrate is characterized by having an electrical conductivity of 10 to 100 Ω and a thermal conductivity of 2 to 7 W/m·k.
  12. A substrate preparation step of preparing a substrate formed from one material selected from aluminum (Al), aluminum alloy, and stainless steel; A heat dissipation coating solution preparation step of preparing a heat dissipation coating solution by mixing 65 to 80 wt% of conductive particles and 20 to 35 wt% of one or more non-silicone-based polymer binders selected from the group consisting of phenoxy groups, alkoxy groups, carboxyl polymers, polyesters, polyimides, and epoxy; A coating step of applying the heat dissipation coating liquid to both sides of the above-mentioned material; The method includes a heat treatment step of applying heat to a substrate coated with the heat dissipation coating liquid on both sides to coat the heat dissipation coating liquid on both sides of the substrate. In the above coating step, a heat dissipation coating liquid is applied to both sides of the substrate by a roll coating method, and A method for manufacturing a heat dissipation substrate, characterized in that the above heat treatment step involves the substrate, on which the heat dissipation coating liquid is applied to both sides, sequentially passing through first to fifth heating zones arranged sequentially inside a tunnel-type drying oven, heating, and then cooling.
  13. In Paragraph 12, A method for manufacturing a heat dissipation substrate, characterized in that the conductive particles mixed in the heat dissipation coating solution in the heat dissipation coating solution preparation step are one or more types selected from the group consisting of graphene, carbon black, graphite, and carbon nanotubes (CNT).
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  15. In Paragraph 12, In the above heat treatment step, the first heating zone and the fifth heating zone are 55 to 60℃, the second heating zone and the fourth heating zone are 115 to 125℃, and the third heating zone is 150 to 180℃, and A method for manufacturing a heat dissipation substrate characterized in that the time for the substrate coated with the heat dissipation coating liquid on both sides to pass through the first to fifth heating zones, respectively, is 0.5 to 5 minutes.

Description

Heat dissipation substrate and Method for manufacturing the same The present invention relates to a heat dissipation substrate and a method for manufacturing the same, and more specifically, to a heat dissipation substrate and a method for manufacturing the same that can secure stable thermal conductivity and electrical conductivity without peeling even in high-temperature environments. Modern electronic devices, particularly semiconductor devices, mobile communication devices, display devices, and home appliances, are becoming increasingly high-performance, high-density, and high-speed; consequently, the amount of heat generated during operation is also rapidly increasing. In particular, mobile and communication devices require low profile, lightweight, high-speed, and high-frequency characteristics as essential requirements, while simultaneously emphasizing the importance of heat dissipation technology capable of effectively controlling heat generated by high output. To solve the heat generation problem within electronic devices and to ensure the lifespan and stability of the devices, heat dissipation substrates or heat dissipation sheets with high-efficiency heat dissipation capabilities are widely used. Heat dissipation substrates are attached to heat-generating parts of electronic devices to disperse or transfer heat to the outside, thereby preventing heat accumulation and preventing damage to components or malfunctions caused by overheating. In addition, as some electronic devices require electrical signal conductivity, there is an increasing demand for composite functional heat dissipation substrates that possess both electrical and thermal conductivity. Conventional heat dissipation substrates are predominantly manufactured by applying a coating solution, which is a mixture of graphite and a silicone-based binder, to the surface of a metal substrate such as aluminum (Al) foil. While such silicone-based binders offer the advantages of flexibility at high temperatures and adequate adhesion to the substrate, they lack thermal stability in high-temperature environments of approximately 180°C or higher. Consequently, cracks frequently occur in the coating layer, leading to the delamination of the coating layer from the substrate. This delamination not only reduces the operational stability of the device but also causes quality issues such as dust generation, surface contamination, and reduced heat dissipation performance. Furthermore, silicone-based binders have the disadvantage of exhibiting limitations in the durability of the coating layer due to their susceptibility to decomposition in high-temperature environments or mechanical shock. In particular, in the case of multi-layered heat dissipation sheets, silicone binders fail to provide sufficient bonding strength between layers, which can lead to problems such as delamination and the formation of internal pores after prolonged use. This negatively impacts not only heat dissipation performance but also electrical connection stability. As an example of the technology forming the background of the present invention, Patent Document 1 discloses a heat dissipation sheet comprising a metal layer; a heat dissipation substrate layer; a heat dissipation coating layer; and an adhesive layer. In this case, the adhesive layer is formed by coating a thermally conductive adhesive comprising an adhesive and a thermally conductive filler to have heat dissipation properties, and the adhesive is disclosed to be selected from acrylic-based, urethane-based, and silicone-based adhesives. The content described above as background technology is intended only to help understand the background of the present invention and should not be construed as an acknowledgment that it constitutes prior art already known to those skilled in the art. FIG. 1 is a cross-sectional view showing a heat dissipation substrate according to one embodiment of the present invention, and FIG. 2 is an SEM image showing a heat dissipation layer of a heat dissipation substrate according to one embodiment of the present invention, and FIG. 3 is a drawing showing a process for manufacturing a heat dissipation substrate according to one embodiment of the present invention. Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are given the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification, and do not inherently possess distinct meanings or roles. In describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art may obscure the essence of the embodiments disclosed in this specification, such detailed description is omit