KR-102964834-B1 - Thermal transfer sheet, method of manufacturing phosphor, and phosphor

Abstract

A thermal transfer sheet comprising a substrate and a transfer layer formed on the substrate, wherein the transfer layer comprises an adhesive layer, the adhesive layer constitutes a surface layer on one side of the thermal transfer sheet, and the adhesive layer comprises an allyl resin and a modified olefin polymer.

Inventors

• 나루미 유스케
• 리 얀후이
• 이마쿠라 요시히로
• 후쿠다 아카네

Assignees

• 다이니폰 인사츠 가부시키가이샤

Dates

Publication Date

20260513

Application Date

20220720

Priority Date

20210720

Claims (12)

1. A thermal transfer sheet comprising a substrate and a transfer layer formed on the substrate, The above transfer layer has an adhesive layer, and The above adhesive layer constitutes a surface layer on one side of the heat transfer sheet, and A heat transfer sheet in which the adhesive layer comprises an allyl resin, a modified olefin polymer, and an ethylene-vinyl acetate copolymer resin.
2. A heat transfer sheet according to claim 1, wherein the allyl resin is diallyl phthalate resin.
3. A heat transfer sheet according to claim 1 or 2, wherein the adhesive layer further contains a styrene-(meth)acrylic copolymer resin.
4. In claim 1 or 2, the transfer layer further comprises a color layer, and The above-mentioned color layer is a heat transfer sheet containing a color material and a resin material.
5. In paragraph 4, a heat transfer sheet in which the resin material is an allyl resin.
6. In paragraph 4, the above-mentioned color layer is a heat transfer sheet containing (meth)acrylic resin and vinyl chloride-vinyl acetate copolymer resin as the resin material.
7. In claim 4, the heat transfer sheet in which the color layer contains allyl resin and vinyl chloride-vinyl acetate copolymer resin as the resin material.
8. In claim 1 or 2, the transfer layer further comprises a release layer, A thermal transfer sheet in which the above peeling layer constitutes the surface layer on the substrate side in the above transfer layer.
9. A heat transfer sheet according to claim 1 or 2, wherein the content ratio of the allyl resin in the adhesive layer is 10 mass% or more and 95 mass% or less, and the content ratio of the modified olefin polymer is 5 mass% or more and 90 mass% or less.
10. A heat transfer sheet according to claim 1 or 2, wherein the content ratio of the allyl resin in the adhesive layer is greater than the content ratio of the modified olefin polymer.
11. A process for preparing a heat transfer sheet and a transfer target, wherein the heat transfer sheet comprises a substrate and a transfer layer formed on the substrate, the transfer layer comprises an adhesive layer, the adhesive layer constitutes a surface layer on one side of the heat transfer sheet, and the adhesive layer comprises an allyl resin, a modified olefin polymer, and an ethylene-vinyl acetate copolymer resin. A process of thermally transferring the transfer layer provided by the thermal transfer sheet onto the above-mentioned transfer target. A method for manufacturing a phosphorus, comprising
12. A phosphor having a transfer target and a transfer layer formed on the transfer target, The above transfer layer comprises an adhesive layer in direct contact with the transfer target, and The adhesive layer is a phosphide containing an allyl resin, a modified olefin polymer, and an ethylene-vinyl acetate copolymer resin.

Description

Thermal transfer sheet, method of manufacturing phosphor, and phosphor The present disclosure relates to a thermal transfer sheet, a method for manufacturing a phosphor, and a phosphor. Conventionally, a thermal melt transfer method is known. In the above method, for example, energy is applied to a thermal transfer sheet having a substrate and a transfer layer using a thermal head, and the transfer layer is transferred onto a transfer target such as a paper substrate and a resin film to form an image. The image formed by the thermal melt transfer method is of high density and has excellent sharpness. For this reason, the above method is suitable for recording binary images such as characters and line drawings. According to the thermal melt transfer method, variable information such as recipient names, customer information, numbers, and barcodes can be recorded on a transfer target using a computer and a thermal transfer printer (see, for example, Patent Document 1). FIG. 1 is a schematic cross-sectional view illustrating one embodiment of a thermal transfer sheet of the present disclosure. FIG. 2 is a schematic cross-sectional view illustrating one embodiment of a thermal transfer sheet of the present disclosure. FIG. 3 is a schematic cross-sectional view illustrating one embodiment of a thermal transfer sheet of the present disclosure. The embodiments of the present disclosure will be described in detail below. The present disclosure may be implemented in many different forms and is not to be interpreted as being limited to the description of the embodiments exemplified below. In order to make the explanation clearer, the drawings may schematically depict the width, thickness, shape, etc. of each layer compared to the embodiments, but this is merely an example and does not limit the interpretation of the present disclosure. In this specification and in each drawing, the same reference numerals are used for elements that have already been described in the previously published drawings, and detailed descriptions may be appropriately omitted. In the present disclosure, where a plurality of upper limit candidates and a plurality of lower limit candidates are exemplified with respect to a certain parameter, the numerical range of the parameter may be constructed by combining any one upper limit candidate and any one lower limit candidate. As an example, the description “Parameter B is preferably A1 or higher, more preferably A2 or higher, and even more preferably A3 or higher. Parameter B is preferably A4 or lower, more preferably A5 or lower, and even more preferably A6 or lower” is explained. In this example, the numerical range of parameter B may be A1 or higher and A4 or lower, A1 or higher and A5 or lower, A1 or higher and A6 or lower, A2 or higher and A4 or lower, A2 or higher and A5 or lower, A2 or higher and A6 or lower, A3 or higher and A4 or lower, A3 or higher and A5 or lower, and A3 or higher and A6 or lower. [Heat Transfer Sheet] The heat transfer sheet of the present disclosure comprises a substrate and a transfer layer formed on the substrate. The transfer layer comprises an adhesive layer. The adhesive layer constitutes a surface layer on one side of the heat transfer sheet. The transfer layer may further comprise a colorant layer. The transfer layer may further comprise a release layer. An embodiment of the heat transfer sheet of the present disclosure will be described with reference to the drawings. The thermal transfer sheet (1) illustrated in FIG. 1 comprises a substrate (10) and a transfer layer (20). The transfer layer (20) includes an adhesive layer (22). The adhesive layer (22) forms a surface layer on one side of the thermal transfer sheet (1). The thermal transfer sheet (1) illustrated in FIG. 2 comprises a substrate (10) and a transfer layer (20). The transfer layer (20) comprises a color layer (24) and an adhesive layer (22) in this order in the thickness direction. The adhesive layer (22) forms a surface layer opposite to the substrate (10) side in the transfer layer (20). The transfer layer (20) of the heat transfer sheet (1) illustrated in FIG. 3 further comprises a release layer (26). The release layer (26) forms the surface layer on the substrate (10) side of the transfer layer (20). The transfer layer (20) comprises the release layer (26), the color layer (24), and the adhesive layer (22) in this order in the thickness direction. The thermal transfer sheet (1) illustrated in FIGS. 1 to 3 has a back layer (30) on a surface opposite to the surface on which the transfer layer (20) is formed in the substrate (10). Hereinafter, each layer provided by the thermal transfer sheet of the present disclosure will be described. <Information> If the substrate has heat resistance capable of withstanding thermal energy applied during thermal transfer and possesses mechanical strength and solvent resistance capable of supporting a transfer layer formed on the substrate, it can be used without