KR-102965087-B1 - ORGANIC LIGHT EMITTING DISPLAY DEVICE

KR102965087B1KR 102965087 B1KR102965087 B1KR 102965087B1KR-102965087-B1

Abstract

The present specification discloses an organic light-emitting display device. The organic light-emitting display device comprises: a substrate having a display area in which an image is displayed and a non-display area surrounding the display area defined therein; a first wiring in the non-display area of the substrate; a first flattening layer for flattening the upper portion of the first wiring; a second wiring on the first flattening layer; and a second flattening layer for flattening the upper portion of the second wiring.

Inventors

박종찬
장창재

Assignees

엘지디스플레이 주식회사

Dates

Publication Date: 20260513
Application Date: 20240129

Claims (13)

A substrate including a display area in which an image is displayed and a GIP area outside the display area; A transistor located in the display area of the above substrate; A first wiring disposed on the same layer as the source or drain electrode of the transistor in the GIP region of the substrate; A first flattening layer disposed on top of the first wiring of the above GIP region and including a flat upper surface; A second wiring disposed on the first flattening layer of the above GIP region; A second flattening layer disposed in the above GIP area and the above display area, including a flat upper surface, and disposed on the upper portion of the second wiring in the above GIP area; An organic light-emitting device disposed on the second planarization layer of the above-mentioned display area and comprising an anode, an organic light-emitting layer, and a cathode; and A display device comprising a bank positioned to cover the end of the anode, wherein the bank is positioned on the second flattening layer in the GIP region.
In Article 1, A display device in which a metal layer connected to the organic light-emitting diode of the display area is disposed on the second planarization layer of the GIP area.
In Article 2, The above metal layer is a display device that transmits power voltage to the cathode of the above organic light-emitting diode.
In Paragraph 3, The above metal layer is a display device that contacts the cathode of the organic light-emitting diode on the upper part of the first wiring and the second wiring.
In Article 1, A display device comprising at least one of the first flattening layer and the second flattening layer, wherein the first flattening layer and the second flattening layer comprise a dielectric material.
In Article 1, A display device further comprising a buffer layer located between the substrate and the first wiring.
In Article 1, A display device covering the first wiring and further comprising an inorganic layer located below the first flattening layer.
In Article 1, A display device further comprising a buffer layer covering the upper part of the first flattening layer and located below the second wiring.
In Article 1, A display device in which the first wiring and the second wiring are arranged vertically separated with the first flattening layer in between.
In Article 1, A display device in which the first wiring and the second wiring overlap at least partially in the vertical direction.
In Article 1, The first wiring above is a display device that is wiring associated with a GIP circuit.
In Article 11, The above second wiring is a display device that transmits a control signal to the above GIP circuit.
In Article 1, The above substrate is a flexible substrate and is a display device.

Description

Organic Light Emitting Display Device This specification relates to an organic light-emitting display device. Video display devices, which display various information on a screen, are a core technology of the information and communication era and are evolving in a direction that is thinner, lighter, more portable, and higher in performance. Accordingly, organic light-emitting diodes (OLEDs) that display images by controlling the amount of light emitted by organic light-emitting diodes are gaining attention. Organic light-emitting diodes (OLEDs) are self-emissive devices utilizing a thin light-emitting layer between electrodes, offering the advantage of being capable of thin-film fabrication. A typical OLED display has a structure in which a pixel driving circuit and an OLED are formed on a substrate, and an image is displayed as light emitted from the OLED passes through the substrate or a barrier layer. Since organic light-emitting display devices are implemented without a separate light source device, they are easy to implement as flexible display devices. In this case, flexible materials such as plastic and metal foil can be used as substrates for organic light-emitting display devices. Recently, as organic light-emitting diode (OLED) displays have become smaller and higher-resolution, the required wiring has increased, but the space for arranging it has become insufficient. Under these circumstances, securing space for various elements, including electrical wiring, has become a critical challenge. Furthermore, methods to optimize the placement of various components and elements are also being researched. FIG. 1 is a plan view showing an organic light-emitting display device according to an embodiment of the present specification. FIG. 2 is a cross-sectional view showing a portion of the display area of an organic light-emitting display device according to one embodiment of the present specification. FIG. 3 is a cross-sectional view showing a portion of the non-display area of an organic light-emitting display device according to the prior art. FIGS. 4a and 4b are drawings showing a portion of the non-display area of an organic light-emitting display device according to one embodiment of the present specification. The advantages and features of this specification and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are exemplary and are not limited to the details illustrated in this specification. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing the present invention, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the invention, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in this specification, other parts may be added unless "only" is used. When a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise. In interpreting components, they are interpreted to include an error range even without separate explicit description. In the case of descriptions of positional relationships, for example, where the positional relationship between two parts is described using expressions such as 'on,' 'above,' 'below,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used. When an element or layer is referred to as being "on" another element or layer, this includes cases where another layer or element is interposed directly on the other element or in the middle. Where it is stated that a component is "connected," "coupled," or "joined" to another component, it should be understood that the component may be directly connected or joined to the other component, but that another component may be "interposed" between each component, or that each component may be "connected," "coupled," or "joined" through the other component. Although terms such as "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of the present invention. The size and thickness of each component shown in the