KR-102965197-B1 - Substrate processing apparatus

KR102965197B1KR 102965197 B1KR102965197 B1KR 102965197B1KR-102965197-B1

Abstract

The technical concept of the present invention comprises: a center chuck supporting the center of the lower surface of a substrate; a side chuck spaced horizontally apart from the center chuck and supporting the edge of the lower surface of the substrate; a bowl having an opening in the center and arranged to surround the substrate; an air knife extending vertically while surrounding the center chuck and configured to spray gas toward the lower surface of the substrate; a center cleaning unit positioned on one side of the air knife and spraying a cleaning liquid toward the lower surface of the substrate; and a side cleaning unit positioned on the other side of the air knife, spaced horizontally apart from the center cleaning unit and spraying a cleaning liquid toward the lower surface of the substrate; wherein the side chuck is capable of moving in a horizontal or vertical direction with respect to the plane on which the substrate is placed without interference from the bowl.

Inventors

손영준

Assignees

세메스 주식회사

Dates

Publication Date: 20260513
Application Date: 20221228

Claims (10)

A center chuck that supports the center of the lower surface of the substrate; A side chuck spaced horizontally from the center chuck and supporting the lower edge of the substrate; A bowl having an opening in the center and positioned to surround the substrate; An air knife that surrounds the center chuck and extends in a vertical direction, configured to spray gas toward the lower surface of the substrate; A center cleaning unit disposed on one side of the air knife and spraying a cleaning solution toward the lower surface of the substrate; A side cleaning unit disposed on the other side of the air knife, positioned horizontally spaced apart from the center cleaning unit, and spraying a cleaning liquid toward the lower surface of the substrate; comprising A substrate processing apparatus characterized in that the above-mentioned side chuck is movable in a horizontal or vertical direction with respect to a plane on which the substrate is placed without interference with the above-mentioned bowl.
In paragraph 1, The above side chuck is movable in the horizontal and vertical directions with respect to the plane on which the substrate is placed, and A substrate processing device characterized in that the above-described bowl is movable in a direction perpendicular to the plane on which the substrate is placed.
In paragraph 2, A substrate processing device characterized by further including an up-and-down driving unit that moves the bowl in a vertical direction with respect to the plane on which the substrate is placed.
In paragraph 2, It further includes a base plate equipped with a rail that moves the side chuck as the side chuck contacts it, and A substrate processing device characterized in that the above rail extends horizontally with respect to the plane on which the substrate is placed.
In paragraph 4, A substrate processing device characterized in that the above bowl is installed on the base plate without moving in a horizontal direction relative to the base plate.
In paragraph 5, The width of the above bowl is adjustable, A substrate processing device characterized in that the width of the bowl is expandable to the width of the base plate.
In paragraph 2, The above bowl is, The above opening is provided in the center, and the cover portion covering the upper part of the substrate, and A substrate processing device characterized by including a side wall provided on the outer side of the above-mentioned cover portion.
In Paragraph 7, On the above side wall, A substrate processing device characterized by having an extension groove into which one side of the above-mentioned side chuck can be inserted.
In paragraph 8, The above extension groove is, A horizontal groove extending in a horizontal direction with respect to the plane on which the above substrate is placed, and A substrate processing apparatus characterized by including a vertical groove extending in a vertical direction with respect to the plane on which the substrate is placed.
A center chuck that supports the center of the lower surface of the substrate; A side chuck spaced horizontally from the center chuck and supporting the lower edge of the substrate; A bowl having an opening in the center and positioned to surround the substrate; An air knife configured to surround the center chuck, extend in a vertical direction, and spray gas toward the lower surface of the substrate; A center cleaning unit disposed on one side of the air knife and spraying a cleaning solution toward the lower surface of the substrate; A side cleaning unit disposed on the other side of the air knife, positioned horizontally spaced apart from the center cleaning unit, and spraying a cleaning liquid toward the lower surface of the substrate; comprising A substrate processing apparatus characterized in that the side chuck and the bowl are disposed separately, and the side chuck and the bowl are each independently movable with respect to a plane on which the substrate is disposed.

Description

Substrate processing apparatus The present invention relates to a substrate processing device, and more specifically, to a substrate processing device in which the size of the bowl can be expanded as the side chuck can move in horizontal and vertical directions without interference with the bowl. Contaminants such as particles, organic contaminants, and metal contaminants remaining on the substrate surface significantly affect the characteristics and production yield of semiconductor devices. For this reason, the cleaning process for removing various contaminants attached to the substrate surface is critical in the semiconductor manufacturing process, and cleaning processes are performed on the substrate before and after each unit process in semiconductor manufacturing. Generally, the cleaning of a substrate may include a chemical treatment process that uses chemicals to remove metal foreign substances, organic substances, or particles remaining on the substrate, a rinsing process that uses pure water to remove chemicals remaining on the substrate, and a drying process that uses an organic solvent or nitrogen gas to dry the substrate. In addition, the cleaning of the substrate may include a process of treating the bottom surface of the substrate by spraying a cleaning solution onto the bottom surface of the substrate. When wafer chucking is performed using a scanner, if particles are present on the back surface of the substrate, deformation of the substrate occurs in that area, which may cause localized defocus during exposure. To prevent this, the bottom surface of the substrate can be treated by spraying a cleaning solution onto the bottom surface of the substrate. Meanwhile, during the process of cleaning the lower surface of the substrate, contaminants remaining on the lower surface of the substrate or the cleaning solution used to clean the lower surface of the substrate may splash onto the upper surface of the substrate and re-contaminate the substrate. FIG. 1 is a schematic diagram showing a substrate processing apparatus according to an embodiment of the present disclosure. FIG. 2 is a schematic drawing showing a bowl according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram showing a substrate processing apparatus combined with a bowl according to an embodiment of the present disclosure. FIG. 4 is a schematic diagram showing the cleaning of the lower surface of a substrate through a center cleaning unit according to an embodiment of the present disclosure. FIG. 5 is a schematic diagram showing the cleaning of the lower surface of a substrate through a side cleaning unit according to an embodiment of the present disclosure. FIG. 6 is a schematic drawing showing that an extension groove is provided in the side wall of a bowl according to an embodiment of the present disclosure, into which one side of a side chuck can be inserted. FIG. 7 is a schematic diagram showing a substrate processing device in which the side chuck and the bowl are movable as a single unit. FIG. 8 is a schematic diagram showing a comparison of the distance between the substrate and the side wall of the bowl when the lower surface of the substrate is cleaned through the center cleaning unit of a substrate processing device in which the side chuck and the bowl are movable as a single unit, and when the lower surface of the substrate is cleaned through the center cleaning unit according to an embodiment of the present disclosure. FIG. 9 is a schematic diagram showing a comparison of the distance between the substrate and the side wall of the bowl when the lower surface of the substrate is cleaned through the side cleaning unit of a substrate processing device in which the side chuck and the bowl are movable as a single unit, and when the lower surface of the substrate is cleaned through the side cleaning unit according to an embodiment of the present disclosure. Exemplary embodiments of the present invention are provided to more fully explain the invention to those skilled in the art to which the concept of the invention belongs, and the following embodiments may be modified in various different forms, and the scope of the invention is not limited to the following embodiments. Rather, these embodiments are provided to make the invention more faithful and complete and to fully convey the spirit of the invention to those skilled in the art. Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by those skilled in the art to which the concept of the present invention pertains. Furthermore, it will be understood that commonly used terms, such as those defined in advance, should be interpreted in a meaning consistent with their intent in the context of the relevant technology, and should not be interpreted in an overly formal sense unless explicitly defined herein. In the following, variations of the depicted shapes may be expecte