KR-102965271-B1 - PLANE HEATER FOR HEAT TREATMENT OF SUBSTRATE

Abstract

According to one aspect of the present invention, a plate heater for heat treatment of a substrate is provided, comprising a plate-shaped casing portion, a plurality of heating zones disposed inside the plate-shaped casing portion, and a heating wire portion disposed in the plurality of heating zones and having a zigzag shape with alternating straight and curved portions, wherein the plurality of heating zones include a first heating zone adjacent to one side of the plate-shaped casing portion and a second heating zone adjacent to one side of the plate-shaped casing portion and spaced apart from the first heating zone in a first direction, and the heating wire portion further includes a bypass portion disposed between the first and second heating zones.

Inventors

• 박성범

Assignees

• 한화모멘텀 주식회사

Dates

Publication Date

20260513

Application Date

20240904

Claims (10)

1. Plate-shaped casing section; A plurality of heating zones disposed inside the plate-shaped casing portion; and It includes a heating element arranged in the plurality of heating zones and having a zigzag shape with alternating straight and curved sections, The above plurality of heating zones are, A first heating zone adjacent to one side of the plate-shaped casing portion; and It includes a second heating zone adjacent to one side of the plate-shaped casing portion and spaced apart from the first heating zone in a first direction, and The above heating element is, A first heating element disposed in the first heating zone; A second heating element disposed in the second heating zone; and It includes a bypass section disposed between the first heating zone and the second heating zone, and It further includes a rod member for line arrangement positioned between the first and second heating zones, and The above-mentioned rod member for line arrangement includes an insertion portion having a concave shape from one side of the above-mentioned rod member toward the other side, and The above bypass portion is disposed within the above insert portion, and It includes a fixing bracket portion positioned across the upper surface of the above-mentioned bar member for line arrangement, covering a part of the open insertion portion, and fixing the curved portion of the first heating wire portion and the curved portion of the second heating wire portion. The above fixing bracket part is, A first locking part that protrudes downward from one end side and fixes the curved portion of the first heating wire part; and A plate-shaped heater for substrate heat treatment, comprising a second locking portion that protrudes downward from the other end side and fixes the curved portion of the second heating element.
2. In paragraph 1, The plurality of heating zones further include a third heating zone adjacent to the other side of the plate-shaped casing portion and spaced apart from the first and second heating zones in the second direction. A plate-shaped heater for substrate heat treatment, wherein the second direction is perpendicular to the first direction.
3. In paragraph 2, A plate-shaped heater for substrate heat treatment, comprising first to third heating element sections each disposed in the first to third heating zones.
4. In paragraph 3, The above bypass section is a plate-shaped heater for substrate heat treatment connected to the above third heating section.
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7. In paragraph 1, The above plate-shaped casing includes an upper cover panel disposed above the heating element and a lower cover panel disposed below the heating element. Based on the vertical direction, A plate-shaped heater for substrate heat treatment, wherein the height from the upper surface of the lower cover panel to the upper surface of the line arrangement rod member is higher than or equal to the height from the upper surface of the lower cover panel to the upper surface of the heating element.
8. In paragraph 1, The above plate-shaped casing includes an upper cover panel disposed above the heating element and a lower cover panel disposed below the heating element. Based on the vertical direction, A plate-shaped heater for substrate heat treatment, wherein the height from the upper surface of the lower cover panel to the lower surface of the heating element is different from the height from the lower surface of the upper cover panel to the upper surface of the heating element.
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Description

Plane Heater for Heat Treatment of Substrate The present invention relates to a plate-shaped heater for substrate heat treatment, and more specifically, to a plate-shaped heater for substrate heat treatment having a structure that supports only the straight portion of a zigzag-shaped heating element. Generally, glass substrates used in the manufacture of flat panel displays, semiconductors, solar cells, etc., undergo various heat treatment processes for the formation of inorganic, organic, and/or semiconductor devices. In other words, substrates such as glass substrates used in the manufacture of flat panel displays, semiconductors, and solar cells undergo a heat treatment process within a substrate heat treatment device to crystallize or phase-change the deposited film. A heat treatment device for substrates positions the substrate to be heat-treated at a distance from the upper side of a plate heater and heat-treats the substrate by evenly heating it with the plate heater. As panels such as flat panel displays and solar cells become larger, large plate-shaped heaters are required to heat-treat large glass substrates. Conventional plate heaters have a structure in which a zigzag-shaped heating wire is supported in both the curved and straight sections within a casing, and the contact area between the heating wire and the support is large, which has the problem of reduced thermal efficiency during heating and cooling of the heating wire. In addition, conventional plate heaters had a problem in that it was difficult to manufacture large-area plate heaters due to short circuits and breakage caused by thermal expansion of the heating wires as they repeatedly heated and cooled. FIG. 1 is a perspective view illustrating one embodiment of a plate-shaped heater for substrate heat treatment according to the present invention. FIG. 2 is an enlarged view of section A of FIG. 1. FIG. 3 is an enlarged view of section B of FIG. 1. FIG. 4 is an enlarged view of section C of FIG. 1. FIG. 5 is an enlarged view showing a portion of the planar surface of a plate-shaped heater for substrate heat treatment according to the present invention. FIG. 6 is a cross-sectional view illustrating one embodiment of a plate-shaped heater for substrate heat treatment according to the present invention. FIG. 7 is an enlarged plan view of section D of FIG. 1. The present invention will be explained in more detail. Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings as follows. Prior to the detailed description of the present invention, terms and words used in the specification and claims described below should not be interpreted as being limited to their ordinary or dictionary meanings. Accordingly, the embodiments described in the specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all technical concepts of the present invention; therefore, it should be understood that various equivalents and modifications capable of replacing them may exist at the time of filing this application. FIG. 1 is a perspective view illustrating an embodiment of a plate-shaped heater for substrate heat treatment according to the present invention, FIG. 2 is an enlarged view of portion A of FIG. 1, FIG. 3 is an enlarged view of portion B of FIG. 1, FIG. 4 is an enlarged view of portion C of FIG. 1, FIG. 5 is an enlarged view illustrating a part of the planar surface of a plate-shaped heater for substrate heat treatment according to the present invention, and FIG. 6 is a cross-sectional view illustrating an embodiment of a plate-shaped heater for substrate heat treatment according to the present invention. An embodiment of a plate-shaped heater for substrate heat treatment according to the present invention will be described in detail below with reference to FIGS. 1 to 6. One embodiment of a plate-shaped heater for substrate heat treatment according to the present invention includes a plate-shaped casing part (100) including an upper cover panel (110) and a lower cover panel (120) positioned at a distance from each other. The plate-shaped casing (100) has a spaced heating element placement space formed between the upper cover panel (110) and the lower cover panel (120) to allow a heating element (200) to be placed, and further includes a side cover panel (130) that surrounds the heating element placement space. The shapes of the upper cover panel (110) and the lower cover panel (120) can be manufactured in various shapes, such as polygons including squares and circles, and in the present invention, the plate-shaped casing part (100) is given as an example having a rectangular shape. A heating element (200) that generates heat to heat a substrate is located inside the plate-shaped casing part (100), that is, in the heating element placement space. The heating element (200) can be inserted into one side