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KR-102965309-B1 - Method and system for manufacturing circuit boards having perforated molded parts

KR102965309B1KR 102965309 B1KR102965309 B1KR 102965309B1KR-102965309-B1

Abstract

The present invention relates to a method and system for manufacturing circuit boards (1) having perforated molding parts (2). The object of the present invention is to ensure that the elements to be compressed of the circuit board (1) are positioned very accurately during the compression process. This is achieved by arranging and fixing the semi-finished product (9) having a perforated mask (L) in a specific shape relative to each other to form a semi-finished product (9), and by placing the semi-finished product (9) in a press (4) using the perforated mask (L) and compressing it together with at least one other element (8, 10, 12) to form a circuit board substrate for manufacturing the circuit board (1). The present invention also relates to a system for manufacturing circuit boards (1) and processing circuit boards (1) to prepare corresponding semi-finished products (9) to form a circuit board substrate for manufacturing the circuit board (1).

Inventors

  • 볼펠, 마르쿠스

Assignees

  • 쥬마테크 게엠베하

Dates

Publication Date
20260513
Application Date
20220404
Priority Date
20210409

Claims (15)

  1. A method for manufacturing a circuit board (1) having perforated molding parts (2), wherein the perforated molding parts (2) are arranged and affixed to each other in a predetermined shape to form a semi-finished product (9) having a perforated mask (L), and the semi-finished product (9) is then positioned and aligned within a press (4) by the perforated mask (L) and pressed together with at least one additional element (8, 10, 12) to form a circuit board substrate for manufacturing the circuit board (1).
  2. In Article 1, a. Step A: A step for compressing elements of a circuit board (1), comprising providing a press (4) including positioning pins (5) for positioning perforated molded parts (2) during the compression process, b. Step B: A step of providing perforated molded parts (2) having receiving holes (3) that match the external shape of the positioning pins (5), c. Step C: A step of providing a mold (6) capable of aligning the perforated molded parts (2) so as to form a perforated mask (L) into which positioning pins (5) for positioning the perforated molded parts (2) can be inserted. d. Step D: A step of forming a perforated mask (L) by arranging the perforated molded parts (2) using a mold (6), e. Step E: A step of connecting the perforated molded parts (2) with the perforated mask (L) attached to the conductive element (8) on the surface and, if applicable, the electrically insulating element on the surface, f. Step F: A step of positioning the semi-finished product (9) and at least one electrical insulating element (10) on the surface in the press (4) while introducing the positioning pins (5) into the perforation mask (L), g. Step G: A step of compressing the semi-finished product (9) together with the electrical insulating element (10) on the surface in a press (4) to embed the perforated molded parts (2) into the electrical insulating element (10) on the surface, and h. Step H: A step of manufacturing a circuit board (1) by forming a conductor structure (11) from a conductive element (8). A method for manufacturing a circuit board characterized by including
  3. A method for manufacturing a circuit board according to claim 1 or 2, wherein the press (4) comprises at least two parts (4a, 4b) that are movable relative to each other and are joined together in a compression direction (P) and compressed relative to each other through elements to be compressed of the circuit board (1).
  4. In Article 1 or Article 2, A method for manufacturing a circuit board characterized in that the semi-finished product (9) is placed on a surface (E) aligned perpendicular to the compression direction (P) or attached to a surface (E) aligned perpendicular to the compression direction (P).
  5. In Article 1 or Article 2, A method for manufacturing a circuit board characterized in that the positioning pins (5) of the press (4) are inserted into the perforation mask (L) in the compression direction (P) or in the opposite direction of the compression direction.
  6. In Article 2, A method for manufacturing a circuit board characterized in that the perforated molded parts (2) are connected to the electrically insulating elements (10) on the surface by bonding or welding in step E.
  7. In Article 2, A method for manufacturing a circuit board characterized by perforating a conductive element (8) on a surface to transfer a perforation mask (L) to a conductive element (8) on a surface.
  8. In Article 2, A method for manufacturing a circuit board characterized by removing or flipping the semi-finished product (9) from the mold (6) after step E or before step F so that the conductive element (8) on the surface faces downward and the perforated molding part (2) faces upward.
  9. In Article 2, A method for manufacturing a circuit board characterized in that, in step F, the semi-finished product (9) is placed in a press (4) with the conductive element (8) on the surface facing forward.
  10. In Article 2, A method for manufacturing a circuit board characterized by forming a semi-finished product (9) such that the conductor elements (12) are arranged using a mold (6) in step D and connected to a conductive element (8) and an electrically insulating element on the surface in step E, so that the conductor elements (12) are electrically interconnected by a conductor structure (11) formed in step H.
  11. In Article 2, A method for manufacturing a circuit board characterized in that the perforated molded portions (2) are partially or completely formed of a conductive material and are electrically interconnected by a conductor structure (11) formed in step H.
  12. A system for manufacturing a circuit board (1) to be used in the method for manufacturing a circuit board according to claim 1, wherein the system comprises: a. A press (3) for compressing elements of a circuit board (1), comprising positioning pins (5) for positioning perforated molding parts (2) during the compression process, b. Perforated molded parts (2) having receiving holes (3) that match the external shape of the positioning pins (5), and c. A manufacturing system for a circuit board characterized by including a mold (6) for arranging the perforated molded parts (2) to form a perforated mask (L) into which positioning pins (5) for positioning the perforated molded parts (2) can be inserted.
  13. In Article 12, A manufacturing system for a circuit board, wherein the mold (6) includes at least one (dedicated) receptacle (7) for each perforated molding part (2), the internal shape of the receptacle matches the external shape of the perforated molding part (2), and the perforated molding part (2) placed within the receptacle (7) extends so as to completely fill the receptacle (7) or the surface of the perforated molding part (2) is flush with the surface of the mold (6).
  14. In Article 12 or Article 13, A manufacturing system for a circuit board characterized in that at least one of the perforated molding parts (2) can be placed within the same receptacle (7) of the mold (6) in several rotational positions.
  15. In Article 12 or Article 13, A manufacturing system for a circuit board, characterized in that each positioning pin (5) includes an insertion slope that forms a tapered shape from the maximum cross-sectional portion of the positioning pin (5) to the tip of the positioning pin (5).

Description

Method and system for manufacturing circuit boards having perforated molded parts The present invention relates to a method and system for manufacturing circuit boards having perforated molded portions. German Patent No. 0 2018 203 715 A1 discloses a method for manufacturing circuit boards having at least one conductor extending between connection points. The conductor is placed within a receptacle of a mold and connected to a metal foil at the location of the desired connection points. The conductor is then embedded in an insulating material. Finally, a conductor structure for interconnecting several conductors is formed from the metal foil, for example by etching. In order to securely interconnect the embedded conductors by means of a conductor structure, the position of the conductor structure must precisely match the embedded conductors. To this end, so-called registration holes, through which the conductor structure is aligned in a conventional manner, are generally formed in the metal foil. These registration holes are used as receiving holes to position the pins of the press when compressing the elements of the circuit board to be compressed. These holes are formed in the inner layers of the circuit board. In this way, all layers of the connected circuit board can be aligned to a plane positioned perpendicular to the compression direction of the press using the positioning pins. However, matching holes have different shapes, such as elongated holes and round balls, and positioning accuracy may vary depending on the shape of the hole. Furthermore, the receiving holes must always be handled carefully to avoid damaging or expanding their edges. Otherwise, positioning accuracy will be compromised when applying the metal foil to the pins. In addition, the receiving holes are a cost factor; although small, they are significant in large quantities. Moreover, the receiving holes are almost always placed in different locations depending on the shape and size of the metal foil. To process films of different shapes and sizes, it must be possible to use different processing tools and positioning pins. FIG. 1 shows a schematic plan view of a mold and corresponding molding parts of a system according to the present invention for manufacturing circuit boards according to the method of the present invention, wherein the mold has a rectangular shape and has a total of two receptacles having a rectangular shape for receiving perforated molding parts each having a rectangular shape and two L-shaped receptacles for corresponding L-shaped conductor elements. FIG. 2 shows a schematic plan view of a mold according to FIG. 1, wherein rectangular molded parts having elongated receiving holes and L-shaped conductive elements are received in the corresponding receptacles of the mold to completely fill these receptacles and end flush with the surface of the mold, and the conductive elements of the surface are positioned on the surface of the mold to cover the receptacles, the molded parts, and the conductive elements disposed therein (thus, the outlines of these molded parts and conductive elements are shown as dashed lines), and the conductive elements of the surface are perforated at positions corresponding to the receiving holes of the molded parts so that a perforation mask formed by the receiving holes of the molded parts extends over the conductive elements of the surface, and a conductive structure to be subsequently formed from the conductive elements, comprising connection points and conductive wiring for electrically connecting the conductive elements to each other, is schematically indicated by dashed lines, and the desired positions of the positioning pins within the receiving holes of the molded parts in the desired arrangement of the semi-finished product formed by the molded parts, conductive elements, and the conductive elements of the surface are indicated by dashed lines. It is outlined. FIG. 3 shows a schematic side view of the arrangement structure of FIG. 2 before combining the components of a semi-finished product, in particular before placing molded parts and conductive elements in the corresponding receptacles of the mold, and before placing a surface conductive element on the surface of the mold to cover the molded parts and conductive elements placed in the receptacles. FIG. 4 shows a schematic side view of the arrangement structure of FIG. 2 and FIG. 3 after the molded parts and conductive elements are placed in the corresponding receptacles of the mold, and after the surface conductive elements are placed on the surface of the mold to cover the molded parts and conductive elements placed in the receptacles. FIG. 5 shows a schematic side view of an arrangement structure consisting of a press and elements of a circuit board to be compressed by the press to explain an intermediate step of the method according to the present invention, in which the semi-finished product and the electrically insulating el