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KR-20260000624-U - IMPROVED POWER SEMICONDUCTOR MODULE PACKAGING STRUCTURE

KR20260000624UKR 20260000624 UKR20260000624 UKR 20260000624UKR-20260000624-U

Abstract

The present invention relates to a structure for improving the packaging of a power semiconductor module, and more specifically, the structure for improving the packaging of a power semiconductor module comprises a cooling base, at least one circuit board, at least one copper nut terminal, a plastic shell sidewall, and an insulating adhesive. The circuit board comprises at least one chip and is assembled into a power semiconductor module. The copper nut terminal is installed on the cooling base or on the circuit board. The copper nut terminal is used as a bridge for external current or internal current of the power semiconductor module. The chip is electrically connected to the copper nut terminal through multiple strands of wire. A filling space is formed inside the plastic shell sidewall, and an insulating adhesive is injected into the filling space to cover the circuit board. The copper nut terminal is used for the function of allowing current to pass through. The structure for improving the packaging of a power semiconductor module according to the present invention can significantly reduce electromagnetic radiation and is more suitable for applications using high current.

Inventors

  • 친펑 린

Assignees

  • 친펑 린

Dates

Publication Date
20260512
Application Date
20251105
Priority Date
20241105

Claims (8)

  1. As a packaging improvement structure for a power semiconductor module, the packaging improvement structure for the power semiconductor module comprises a cooling base, at least one circuit board, at least one copper nut terminal, a plastic shell sidewall, and an insulating adhesive. The above circuit board is installed on the cooling support, and the circuit board includes at least one chip, and the chip is assembled into a power semiconductor module; The copper nut terminal is installed on the cooling base or on the circuit board, and the copper nut terminal is used as a bridge for external current or internal current of the power semiconductor module, and the chip is electrically connected to the copper nut terminal through multiple strands of wire; The plastic shell sidewall is installed wrapping around the cooling base, a filling space is formed inside the plastic shell, and the height of the plastic shell sidewall is lower than the height of the copper nut terminal; The insulating adhesive is injected into the filling space to cover the circuit board, and the injection height of the insulating adhesive does not exceed the height of the copper nut terminal. A structure for improving the packaging of a power semiconductor module, characterized in that the copper nut terminal is used for the function of conducting current.
  2. In paragraph 1, A structure for improving the packaging of a power semiconductor module, characterized in that the types of the chips mentioned above may use one of a diode chip, a Metal Oxide Semiconductor (MOS) chip, a Bipolar Junction Transistor (BJT) chip, or an Insulated Gate Bipolar Transistor (IGBT) chip, or various combinations thereof.
  3. In paragraph 2, A structure for improving the packaging of a power semiconductor module, characterized in that among the above chips, a Metal Oxide Semiconductor (MOS) chip, a Bipolar Junction Transistor (BJT) chip, and an Insulated Gate Bipolar Transistor (IGBT) chip can be used as a switch function.
  4. In paragraph 2, A power semiconductor module packaging improvement structure characterized in that the diode chip among the above chips is used for a rectification function.
  5. In paragraph 2, A structure for improving the packaging of a power semiconductor module, characterized by including at least one additional set of control terminals, wherein the control terminals receive at least one external control signal and are used to determine whether to open or close the current of the chips.
  6. In paragraph 1, A structure for improving the packaging of a power semiconductor module, characterized in that the number of the copper nut terminals is at least one.
  7. In paragraph 1, A structure for improving the packaging of a power semiconductor module, characterized in that the circuit board further comprises at least one electronic unit, and the electronic unit is connected to the chip and assembled together into a power semiconductor module.
  8. As a packaging improvement structure for a power semiconductor module, the packaging improvement structure for the power semiconductor module comprises a cooling base, at least one circuit board, at least one copper nut terminal, a plastic shell sidewall, and an insulating adhesive. The above circuit board is installed on the cooling support, and the circuit board includes at least one chip, and the chip is assembled into a power semiconductor module; At least one copper nut terminal is installed on the cooling base or on the circuit board, and the copper nut terminal is used as a bridge for external current or internal current of the power semiconductor module, and the chip is electrically connected to the copper nut terminal through multiple strands of wire, and the copper nut terminal is also used for the function of conducting current; The plastic shell sidewall is installed wrapping around the cooling base, a filling space is formed inside the plastic shell, and the height of the plastic shell sidewall is lower than the height of the copper nut terminal; The insulating adhesive is injected into the filling space to cover the circuit board, and the injection height of the insulating adhesive does not exceed the height of the copper nut terminal; An improved packaging structure for a power semiconductor module characterized by the above-mentioned chip being a diode chip and being used for a rectification function.

Description

Improved Power Semiconductor Module Packaging Structure The present invention relates to a type of circuit board packaging structure, and in particular to an improved packaging structure for a power semiconductor module applicable to a high-capacity current region. With the rapid development of the electronics industry, electronic products are gradually evolving toward a trend of multifunctionality and high performance. Referring to Figures 1 and 2, Figure 1 is a perspective view of the packaging structure of a conventional power semiconductor module, and Figure 2 is a three-dimensional exploded view of the packaging structure of a conventional power semiconductor module. As shown in Figures 1 and 2, the three external connection terminals of the circuit board are in the form of rectangular blocks, and these terminals pass through three through holes corresponding to the external case and are then recessed at a 90-degree angle in the same direction for the packaging process. As a result, the overall size of the package becomes excessively large, and because the external connection terminals are rectangular, the negative impact of electromagnetic waves becomes prominent. Figure 1 is a perspective view of the packaging structure of a power semiconductor module of the prior art. Figure 2 is a three-dimensional exploded view of the packaging structure of a power semiconductor module of the existing technology. FIG. 3 is a perspective view of a packaging improvement structure for a power semiconductor module of the present invention. FIG. 4 is a partial three-dimensional exploded view of the packaging improvement structure of the power semiconductor module of the present invention. FIG. 5 is a perspective view of another embodiment of the packaging improvement structure of the power semiconductor module of the present invention. FIG. 6 is a partial stereoscopic exploded view of another embodiment of the packaging improvement structure of the power semiconductor module of the present invention. The applicant has improved the problems of existing products through years of research and development, and then intends to explain how the present invention provides an improved packaging structure for power semiconductor modules to achieve the most efficient function. Referring to the contents of FIGS. 3 to 6, FIG. 3 is a perspective view of a packaging improvement structure for a power semiconductor module of the present invention, FIG. 4 is a partial three-dimensional exploded view of a packaging improvement structure for a power semiconductor module of the present invention, FIG. 5 is a perspective view of another embodiment of a packaging improvement structure for a power semiconductor module of the present invention, and FIG. 6 is a partial three-dimensional exploded view of another embodiment of a packaging improvement structure for a power semiconductor module of the present invention. As shown in the drawing above, the packaging improvement structure (100) of a power semiconductor module comprises a cooling base (110), at least one circuit board (120), at least one copper nut terminal (130), a plastic shell sidewall (140), and an insulating adhesive (160). The circuit board (120) is installed on the cooling base (110), and the circuit board (120) comprises at least one chip (122), and the chip is assembled into a power semiconductor module, wherein the circuit board (120) may be a ceramic circuit board. In another embodiment, the circuit board (120) further comprises at least one electronic unit, and the electronic unit is connected to the chip (122) and assembled together into the power semiconductor module. The copper nut terminal (130) is installed on the cooling base (110) or on the circuit board (120), and the copper nut terminal (130) is used as a bridge for external current or internal current of the power semiconductor module, and among them, the copper nut terminal (130) is used for the function of allowing current to pass through. The chip (122) is electrically connected to the copper nut terminal (130) through several strands of wire (EL). The plastic shell side wall (140) is installed to wrap around the cooling base (110) and is formed in a sealed form, and a filling space (142) is formed inside the plastic shell (140), and among them, the height of the plastic shell side wall (140) is lower than the height of the copper nut terminal (130). The insulating adhesive (160) is injected into the filling space (142) to cover the circuit board (120), and the injection height of the insulating adhesive (160) does not exceed the height of the copper nut terminal (130). In addition, in another embodiment, a similar function of covering the circuit board (120) through an external case can be implemented. As shown in the embodiments illustrated in FIGS. 3 and 4, the types of chips may be one of a diode chip, a Metal Oxide Semiconductor (MOS) chip, a Bipolar Junction Transistor (BJT) chip, or an Insulated Gate Bip