KR-20260062116-A - DISPLAY DEVICE
Abstract
An electronic device according to one embodiment of the present invention includes a display panel comprising a display area and a non-display area adjacent to the display area, and an electronic component disposed in the non-display area and electrically connected to the display panel. The display panel includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, and a signal pad electrically connected to the signal line. The signal pad includes a first conductive pattern connected to the end of the signal line, a second conductive pattern disposed on the first conductive pattern and connected to the first conductive pattern, and an insulating pattern disposed between the end of the signal line and the second conductive pattern, wherein an opening is defined in the second conductive pattern and the insulating pattern that overlaps with the end of the signal line. The electronic component includes a bump that contacts the second conductive pattern.
Inventors
- 강승재
- 김기용
- 우희주
- 원초롱
- 장대환
- 조형빈
- 최경빈
Assignees
- 삼성디스플레이 주식회사
Dates
- Publication Date
- 20260507
- Application Date
- 20241025
Claims (20)
- A display panel including a display area and a non-display area adjacent to the display area; and It includes an electronic component disposed in the above-mentioned non-display area and electrically connected to the above-mentioned display panel, and The above display panel is Base layer; Pixels disposed on the above base layer; A signal line electrically connected to the pixel above; and It includes a signal pad electrically connected to the above signal line, and The above signal pad is, A first conductive pattern connected to the end of the above signal line; A second conductive pattern disposed on the first conductive pattern and connected to the first conductive pattern; and It includes an insulating pattern disposed between the end portion of the signal line and the second conductive pattern, and An opening is defined in the second conductive pattern and the insulating pattern that overlaps with the end portion of the signal line, and The above electronic component is an electronic device comprising a bump that contacts the second conductive pattern.
- In Article 1, An electronic device in which the width of the opening measured on the upper surface of the insulating pattern is smaller than the width of the opening measured on the lower surface of the insulating pattern.
- In Article 1, The above opening includes a first region and a second region below the first region, and An electronic device in which the width of the first region is narrower than the width of the second region.
- In Article 1, The above-mentioned opening is an electronic device having a bottle shape in cross-section.
- In Article 1, The above insulating pattern is an electronic device comprising a material having lower hardness compared to the above second conductive pattern.
- In Article 1, The center of the opening of the above insulation pattern corresponds to the center of the bump in the electronic device.
- In Article 1, It includes a first portion adjacent to the bump of the insulation pattern and a second portion disposed below the first portion, The first part is an electronic device protruding more than the second part towards the center of the bump.
- In Article 1, The above display panel is an electronic device further comprising an adhesive layer in contact with the signal pad and the bump.
- In Article 8, The above adhesive layer is an electronic device filled on the inner surface of the opening.
- In Article 1, An electronic device in which an opening corresponding to the opening of the insulation pattern is defined in the first conduction pattern.
- In Article 1, The above display panel further includes a plurality of insulating layers disposed on the base layer and covering the end portion of the signal line, and An electronic device in which openings corresponding to the openings of the insulation pattern are defined in the plurality of insulating layers.
- In Article 11, A portion of the insulating pattern is disposed in the opening of the plurality of insulating layers, and An electronic device in which a portion of the above insulating pattern contacts the inner surface of the plurality of insulating layers where the opening of the plurality of insulating layers is defined.
- In Article 1, The electronic device further comprises a third conductive pattern, wherein the signal pad comprises a first portion disposed on the second conductive pattern and a second portion disposed inside the opening of the insulating pattern.
- In Article 1, On a plane, the end portion of the signal line extends along a first direction, and The above insulation pattern is provided in multiple numbers, and The above plurality of insulation patterns are electronic devices arranged along the first direction.
- In Article 14, The above display panel is disposed on the end portion of the above signal line and further includes a plurality of insulating layers, An electronic device in which the end portion of the signal line and the first conductive pattern are connected through a contact hole penetrating the plurality of insulating layers.
- A display panel including a display area and a non-display area adjacent to the display area; and It includes an electronic component disposed in the above-mentioned non-display area and electrically connected to the above-mentioned display panel, and The above display panel is Base layer; Pixels disposed on the above base layer; A signal line electrically connected to the pixel above; and It includes a signal pad electrically connected to the above signal line, and The above signal pad is, A first conductive pattern connected to the end of the above signal line; A second conductive pattern disposed on the first conductive pattern and connected to the first conductive pattern; and It includes an insulating pattern disposed between the end portion of the signal line and the second conductive pattern, and The above electronic component includes a bump that contacts the second conductive pattern, and The above insulating pattern comprises a first portion and a second portion disposed on the first portion, at least a portion of which protrudes from the first portion toward the center of the bump.
- In Article 16, An electronic device in which, in cross-section, the width of the second part is smaller than the width of the first part.
- In Article 16, An electronic device in which, in cross-section, the first portion of the insulating pattern is extended to contact one side of the first conductive pattern.
- In Article 16, The above display panel further includes a plurality of insulating layers disposed on the base layer and covering the end portion of the signal line, and An electronic device in which, in cross-section, the first portion of the insulating pattern is extended to contact the plurality of insulating layers.
- In Article 16, On a plane, the end portion of the signal line extends along a first direction, and The above insulation pattern is provided in multiple numbers, and The plurality of insulation patterns above include first insulation patterns and second insulation patterns arranged in a zigzag pattern in a second direction intersecting the first direction, and The above plurality of insulation patterns are electronic devices arranged in the above first direction.
Description
Display Device The present invention relates to an electronic device, and more specifically, to an electronic device including a pad area. Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles may include a display device that displays images and detects external inputs. The display device includes a display area that is activated according to an electrical signal. The display device can detect an input applied from the outside through the display area and simultaneously display various images to provide information to the user. The electronic device may include a display device and a circuit board. The display device may be connected to a main board through the circuit board, and a driver chip may be mounted on the display device. The driver chip may be electrically connected to the display device through pads placed in the non-display area of the display device. FIG. 1 is a perspective view of an electronic device according to one embodiment of the present invention. FIG. 2 is an exploded perspective view of an electronic device according to one embodiment of the present invention. FIG. 3 is a cross-sectional view of a display device according to one embodiment of the present invention. FIG. 4 is a plan view of a display panel according to one embodiment of the present invention. FIG. 5 is a cross-sectional view of a display panel according to one embodiment of the present invention. FIG. 6 is an exploded perspective view showing an enlarged pad area of a display device according to one embodiment of the present invention. FIG. 7 is a plan view illustrating a pad area of a display panel according to one embodiment of the present invention. FIG. 8a is an enlarged plan view of a pad according to one embodiment of the present invention, and FIG. 8b and FIG. 8c are cross-sectional views corresponding to I-I' of FIG. 8a and II-II' of FIG. 8a, respectively. FIG. 9a is an enlarged plan view of a pad according to one embodiment of the invention, and FIG. 9b is a cross-sectional view corresponding to III-III' of FIG. 9a. FIG. 10a is a cross-sectional view taken along line III-III' of FIG. 9a before the pad and bump are bonded according to an embodiment of the present invention, and FIG. 10b is a cross-sectional view taken along line III-III' of FIG. 9a after the pad and bump are bonded according to an embodiment of the present invention. FIG. 10c is an enlarged cross-sectional view of one area of FIG. 10b. FIG. 11 is a cross-sectional view of a pad according to another embodiment of the present invention. FIG. 12a is a plan view of a pad according to one embodiment of the present invention, and FIG. 12b is a cross-sectional view corresponding to IV-IV' of FIG. 12a. FIGS. 13a and FIGS. 13b are plan views of a pad according to other embodiments of the present invention, respectively. FIG. 14a is a plan view of a pad according to one embodiment of the present invention, and FIG. 14b is a cross-sectional view corresponding to V-V' of FIG. 14a. FIGS. 14c and FIGS. 14d are plan views of a pad according to another embodiment of the present invention. FIGS. 15a to 15g are cross-sectional views showing a part of a method for manufacturing an electronic device according to one embodiment of the present invention. In this specification, where a component (or region, layer, part, etc.) is described as being "on," "connected," or "combined" with another component, it means that it may be directly placed/connected/combined with the other component, or that a third component may be placed between them. Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the effective illustration of the technical content. "And/or" includes all one or more combinations that the associated components may define. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise. Additionally, terms such as "below," "lower side," "on," and "upper side" are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings. Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other featu