KR-20260062194-A - Display panel, electronic device, and method of manufacturing electronic device

Abstract

According to one aspect of the present invention, a display panel is provided comprising a substrate including a first region, a second region, and a bending region between the first region and the second region, a driving circuit chip disposed in the second region of the substrate, and a cover film disposed in the second region of the substrate, covering the driving circuit chip and having at least one groove, wherein the at least one groove of the cover film is disposed in the second region and is defined across a portion of the cover film in the thickness direction of the cover film.

Inventors

• 김진형
• 소용권
• 김연우

Assignees

• 삼성디스플레이 주식회사

Dates

Publication Date

20260507

Application Date

20241025

Claims (20)

1. A substrate comprising a first region, a second region, and a bending region between the first region and the second region; A driving circuit chip disposed in the second region of the substrate; and A cover film disposed in the second region of the substrate, covering the driving circuit chip and including at least one groove; comprising, The at least one groove of the cover film is disposed in the second region and is defined across a portion of the cover film in the thickness direction of the cover film, Display panel.
2. In Article 1, The above at least one groove is provided in a closed-loop shape, Display panel.
3. In Article 2, The closed-loop shape of the above at least one groove partitions at least one adhesive area, Display panel.
4. In Article 2, Each having a plurality of grooves having the above-mentioned closed-loop shape, wherein the plurality of grooves are spaced apart from each other. Display panel.
5. In Paragraph 4, The shape of one of the plurality of grooves is different from the shape of another of the plurality of grooves, Display panel.
6. In Article 1, The above cover film comprises a first layer, a second layer, and a third layer, wherein the at least one groove penetrates the third layer, Display panel.
7. In Article 6, The first portion of the third layer of the cover film is spaced apart from the second portion of the third layer by the at least one groove, Display panel.
8. In Article 6, The above cover film further comprises an adhesive layer between the second layer and the third layer, and the at least one groove penetrates the third layer and the adhesive layer. Display panel.
9. In Article 1, The above substrate is bent in the bending area, and The second region of the substrate, the driving circuit chip, and the cover film are disposed below the first region of the substrate. Display panel.
10. An electronic device comprising a housing and a display panel coupled to the housing, The above display panel is, A substrate comprising a first region, a second region, and a bending region between the first region and the second region; A driving circuit chip disposed in the second region of the substrate; and A cover film disposed in the second region of the substrate, covering the driving circuit chip and including at least one groove; comprising, The at least one groove of the cover film is disposed in the second region and is defined across a portion of the cover film in the thickness direction of the cover film, and The housing and the display panel are joined through an adhesive disposed in an adhesive area defined by at least one groove of the cover film of the display panel. Electronic device.
11. A process of combining a display panel and a housing; including, The above display panel is, A substrate comprising a first region, a second region, and a bending region between the first region and the second region; A driving circuit chip disposed in the second region of the substrate; and A cover film disposed in the second region of the substrate, covering the driving circuit chip and including at least one groove; comprising The at least one groove of the cover film is disposed in the second region and is defined across a portion of the cover film in the thickness direction of the cover film, and The process of combining the display panel and the housing comprises placing an adhesive on the cover film of the display panel and bonding the display panel and the housing. Method of manufacturing an electronic device.
12. In Article 11, The above at least one groove is provided in a closed-loop shape that partitions an adhesive area, and at least a portion of the adhesive is disposed in the adhesive area. Method of manufacturing an electronic device.
13. In Article 12, The above cover film comprises a first layer, a second layer, and a third layer, and the at least one groove penetrates the third layer, and The first portion of the third layer corresponding to the adhesive area is spaced apart from the second portion of the third layer by the at least one groove, Method of manufacturing an electronic device.
14. In Article 13, A portion of the adhesive is disposed on the first portion of the third layer, and another portion of the adhesive is disposed within the at least one groove beyond the first portion of the third layer. Method of manufacturing an electronic device.
15. In Article 14, A process of removing the adhesive and the first portion of the third layer together; further comprising Method of manufacturing an electronic device.
16. In Article 15, A process of placing a new adhesive in an opening formed by removing the first portion of the third layer; further comprising Method of manufacturing an electronic device.
17. In Article 12, Provides a plurality of grooves including a plurality of closed-loop shapes that partition a plurality of adhesive regions, wherein the plurality of adhesive regions are spaced apart from each other. Method of manufacturing an electronic device.
18. In Article 17, The shape of one closed loop among the plurality of grooves is different from the shape of another closed loop among the plurality of grooves. Method of manufacturing an electronic device.
19. In Article 11, A process for verifying whether the above adhesive is properly placed; further comprising, Method of manufacturing an electronic device.
20. In Article 11, A process of bending the substrate in the bending region such that the second region of the substrate, the driving circuit chip, and the cover film are positioned below the first region of the substrate; further comprising Method of manufacturing an electronic device.

Description

Display panel, electronic device, and method of manufacturing electronic device The present invention relates to a display panel, an electronic device including such a display panel, and a method for manufacturing an electronic device using such a display panel. The electronic device may include a display panel as a component for displaying images and/or video. The electronic device may also include a housing for accommodating the display panel. The display panel may be bonded to the housing through means such as an adhesive. A display panel may include a substrate divided into a display area and a peripheral area. A plurality of pixels may be arranged in the display area. The display area may be equipped with a thin-film transistor corresponding to each pixel and a light-emitting diode electrically connected to the thin-film transistor. The display panel may display images and/or video through the light-emitting diode. The peripheral area may be equipped with various wirings, a driving unit, a control unit, etc., that transmit electrical signals to the display area. FIG. 1 is a schematic plan view of an electronic device according to one embodiment of the present invention. FIG. 2 is a schematic plan view of a display panel according to one embodiment of the present invention. FIG. 3 is a schematic circuit diagram showing a light-emitting diode provided in a pixel of a display panel according to one embodiment of the present invention and a pixel circuit connected thereto. FIG. 4 is a cross-sectional view showing a portion of the display area of a display panel according to one embodiment of the present invention. FIGS. 5a, 5b, and 5c are bottom views of a display panel according to various embodiments of the present invention. FIGS. 6a and 6b are cross-sectional views of display panels according to various embodiments of the present invention. FIGS. 7a and 7b are cross-sectional views of a portion of a display panel according to various embodiments of the present invention. FIG. 8 is a flowchart showing each process of a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 9 is a bottom view schematically showing one process of a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 10a is a bottom view schematically illustrating one process of a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 10b is a cross-sectional view of a display panel taken along the XX' line of FIG. 10a. FIG. 11a is a bottom view schematically illustrating one process of a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 11b is a cross-sectional view of a display panel taken along the line XI-XI' of FIG. 11a. FIG. 12a is a bottom view schematically showing one process of a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 12b is a cross-sectional view of a display panel taken along the line XII-XII' of FIG. 12a. FIG. 13a is a bottom view schematically showing one process of a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 13b is a cross-sectional view of a display panel taken along the line XIII-XIII' of FIG. 13a. FIG. 14a is a bottom view schematically showing one process of a method for manufacturing an electronic device according to one embodiment of the present invention. FIG. 14b is a cross-sectional view of a display panel taken along the line XIV-XIV' of FIG. 14a. The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted. In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component. In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise. In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added. In the following e