KR-20260062216-A - sensor device and electronic device including the same

Abstract

A sensor device according to one embodiment comprises a flexible substrate, a first wiring and a second wiring embedded in the substrate and spaced apart from each other in a first direction, and a deformation control unit located on a first surface of the substrate, wherein the first wiring and the second wiring overlap in the first direction to form a capacitor, and the deformation control unit overlaps with the capacitor in the first direction, and the Young's modulus of the deformation control unit has a Young's modulus greater than that of the substrate, and the substrate has a gap located between the first wiring and the second wiring.

Inventors

• 임재익
• 홍용택
• 김하윤
• 장동주

Assignees

• 삼성디스플레이 주식회사
• 서울대학교산학협력단

Dates

Publication Date

20260507

Application Date

20241028

Claims (20)

1. A flexible substrate, A first wiring and a second wiring embedded in the above substrate and spaced apart from each other in a first direction, and It includes a deformation control unit located on the first surface of the above substrate, and The first wiring and the second wiring overlap in the first direction to form a capacitor, and The above deformation control unit overlaps with the capacitor in the first direction, and The Young's modulus of the above deformation control unit has a larger Young's modulus than that of the substrate, The above substrate has a gap located between the first wiring and the second wiring. Sensor device.
2. In paragraph 1, The above gap is a sensor device filled with air.
3. In paragraph 2, The above substrate includes a first portion on the side where the first wiring is embedded and a second portion on the side where the second wiring is embedded, The above first part has a first gap surface defining the gap, The second part above defines the gap and has a second gap surface facing the first gap surface. Sensor device.
4. In Paragraph 3, The sensor device having the first gap surface and the second gap surface having a curved surface.
5. In Paragraph 4, The first gap surface and the second gap surface are parallel to each other in the sensor device.
6. In paragraph 1, The first wiring and the second wiring are a serpentine sensor device.
7. In paragraph 1, The first wiring and the second wiring are a sensor device comprising AgNW-PEDOT:PSS.
8. In paragraph 1, The deformation control unit is a sensor device that overlaps with one end of the first wiring or is aligned with the one end in the first direction.
9. In paragraph 1, The above deformation control unit is a sensor device including plastic.
10. In paragraph 1, A sensor device further comprising a strain sensor located on a first surface of the substrate or on a second surface of the substrate facing the first surface.
11. In Paragraph 10, The strain sensor is a sensor device spaced apart from the capacitor in the first direction.
12. In Paragraph 11, The strain sensor is a sensor device spaced apart from the strain control unit in a plane.
13. In Paragraph 12, A sensor device further comprising a signal processing unit that uses the detection signal of the deformation sensor to separate the influence of deformation in the planar direction of the substrate from the detection signal of the pressure sensor and generates detection data corresponding to the pressure in the first direction.
14. A flexible substrate, A first wiring and a second wiring embedded in the above substrate and spaced apart from each other in a first direction, A deformation control unit located on the first surface of the above substrate, and It includes a strain sensor located on a first surface of the substrate or on a second surface of the substrate facing the first surface, and The first wiring and the second wiring overlap in the first direction to form a capacitor, and The above deformation control unit overlaps with the capacitor in the first direction, and The strain sensor is spaced apart from the capacitor in the first direction. Sensor device.
15. In Paragraph 14, The strain sensor is a sensor device spaced apart from the strain control unit in a plane.
16. In Paragraph 14, A sensor device further comprising a signal processing unit that uses the detection signal of the deformation sensor to separate the influence of deformation in the planar direction of the substrate from the detection signal of the pressure sensor and generates detection data corresponding to the pressure in the first direction.
17. In Paragraph 14, The first wiring and the second wiring are a serpentine sensor device.
18. In Paragraph 14, The deformation control unit is a sensor device that overlaps with one end of the first wiring or is aligned with the one end in the first direction.
19. Display panel, and It includes a sensor device that overlaps the above-mentioned display panel, and The sensor device above is, A flexible substrate, A first wiring and a second wiring embedded in the above substrate and spaced apart from each other in a first direction, and It includes a deformation control unit located on the first surface of the above substrate, and The first wiring and the second wiring overlap in the first direction to form a capacitor, and The above deformation control unit overlaps with the capacitor in the first direction, and The Young's modulus of the above deformation control unit has a larger Young's modulus than that of the substrate, The above substrate has a gap located between the first wiring and the second wiring. Electronic device.
20. In Paragraph 19, An electronic device further comprising a strain sensor located on a first surface of the substrate or on a second surface of the substrate facing the first surface.

Description

Sensor device and electronic device including the same The present disclosure relates to a sensor device and an electronic device including the same. The electronic device may have various functions. For example, the electronic device may be a wearable device and may include a display surface that displays an image on at least one side to display information. Additionally, the electronic device may include a sensor for receiving commands from a user. Sensors in electronic devices can receive commands through various input means. For example, a pressure sensor can receive commands by sensing pressure from a user's hand, an electronic pen, etc. Pressure sensors can have various structures for sensing pressure. For instance, a pressure sensor's electrical characteristics can change as its structure changes in response to applied force, and it can receive information through the changing electrical signals. FIG. 1 is a plan view of an electronic device including a sensor device according to one embodiment. FIG. 2 is a cross-sectional view of an electronic device including a sensor device according to one embodiment. FIG. 3 is a cross-sectional view of a sensor device according to one embodiment. FIGS. 4, FIGS. 5, and FIGS. 6 each illustrate a planar structure of a wiring included in a sensor device according to one embodiment. FIG. 7 illustrates a cross-sectional structure of one wiring of a sensor device according to one embodiment. FIG. 8 shows the strain on the surface of a substrate around a strain control unit included in a sensor device according to one embodiment. FIG. 9 shows the strain rate in a cross-section of a substrate around a strain control unit included in a sensor device according to one embodiment. FIG. 10 is a graph (a, b, c) showing the change in capacitance according to the pressure applied to the sensor before and after tensioning of an electronic device including a sensor device according to one embodiment, and a table showing the rate of change in signal. FIG. 11 is a graph showing the change in capacitance according to the presence or absence of pressure applied to a pressure sensor before (a, b) and after (c, d) tension of an electronic device including a sensor device according to one embodiment. FIG. 12 is a cross-sectional view of a sensor device according to one embodiment. FIG. 13 is a cross-sectional view of a sensor device according to one embodiment. FIG. 14 is a diagram illustrating sequential processes of a method for manufacturing a sensor device according to one embodiment. FIG. 15 is a cross-sectional view showing one process step of a method for manufacturing a sensor device according to one embodiment. FIG. 16 is a cross-sectional view showing one process step of a method for manufacturing a sensor device according to one embodiment. FIG. 17 is a cross-sectional view showing a process step after the process step illustrated in FIG. 16 in a method for manufacturing a sensor device according to one embodiment. FIG. 18 is a cross-sectional view showing one process step of a method for manufacturing a sensor device according to one embodiment. FIG. 19 is a cross-sectional view showing a process step after the process step illustrated in FIG. 18 in a method for manufacturing a sensor device according to one embodiment. Hereinafter, various embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the explanation have been omitted, and the same reference numerals are used for identical or similar components throughout the specification. Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present invention is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, for convenience of explanation, the thickness of some layers and regions has been exaggerated in the drawings. Furthermore, when it is said that a part, such as a layer, membrane, region, or plate, is "on" or "on" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when it is said that a part is "directly above" another part, it means that there is no other part in between. Also, saying that a part is "on" or "on" a reference part means that it is located above or below the reference part, and does not necessarily mean that it is located "on" or "on" in the direction opposite to gravity. Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless spec