KR-20260062248-A - Sensor module

KR20260062248AKR 20260062248 AKR20260062248 AKR 20260062248AKR-20260062248-A

Abstract

The present invention relates to a sensor module, and more specifically, to a sensor module comprising: a circuit board having a coupling region and an extension region extending to one side of the coupling region; a sensor package coupled to one side of the coupling region and including a package substrate, a sensor chip mounted on the package substrate, and a molding portion for molding the sensor chip; and a coupling portion connecting the circuit board and the sensor package, wherein the circuit board includes a plurality of first signal terminals formed on the upper surface of the coupling region; a first dummy terminal surrounding the plurality of first signal terminals; and a transmission line for transmitting an electrical signal between the first signal terminals and a signal processing portion of a main device, wherein the package substrate includes a plurality of second signal terminals electrically connected to the first signal terminals; and a second dummy terminal surrounding the plurality of second signal terminals, and wherein the coupling portion includes a first coupling portion electrically connecting each of the plurality of first signal terminals and the second signal terminals; and a second coupling portion connecting the first dummy terminal and the second dummy terminal to form a waterproof portion.

Inventors

남부현
황태현

Assignees

(주)파트론

Dates

Publication Date: 20260507
Application Date: 20241028

Claims (12)

A circuit board having a coupling region and an extension region extending to one side from the coupling region; A sensor package comprising a package substrate, a sensor chip mounted on the package substrate, and a molding portion for molding the sensor chip, which is coupled to one surface of the above-mentioned coupling region; and It includes a coupling portion connecting the circuit board and the sensor package, and The above circuit board is, A plurality of first signal terminals formed on the upper surface of the above-mentioned coupling area; A first dummy terminal surrounding the plurality of first signal terminals; and It includes a transmission line that transmits an electrical signal between the first signal terminal and the signal processing unit of the main device, and The above package substrate is, A plurality of second signal terminals electrically connected to the first signal terminal; and It includes a second dummy terminal surrounding the plurality of second signal terminals, and The above-mentioned connecting part is, A first coupling part that electrically connects each of the plurality of first signal terminals and second signal terminals; and A sensor module including a second coupling portion that forms a waterproof portion by connecting the first dummy terminal and the second dummy terminal.
In Article 1, The first joint and the second joint are formed of solder. Sensor module.
In Article 1, The above first and second joints are formed with solder mixed with epoxy resin, During the soldering process, the solder is distributed on the inside, and the epoxy resin is separated and distributed to the outside. Sensor module.
In Article 1, The above first coupling part is, A first solder portion electrically connecting the first signal terminal and the second signal terminal; and It includes a first waterproof layer covering the outside of the first solder part, and The above second coupling part is, A second solder portion electrically connecting the first dummy terminal and the second dummy terminal; and A second waterproof layer covering the outside of the second solder part Sensor module.
In Paragraph 4, The first and second waterproof layers mentioned above have a thickness formed in the horizontal direction such that the lower thickness is thicker than the upper thickness. Sensor module.
In Paragraph 4, The first and second waterproof layers are formed by covering and wrapping the outer surfaces of the first and second solder parts. Sensor module.
In Paragraph 4, The second solder portion of the second joint portion and the second waterproof layer are simultaneously melted and formed when the solder of the first joint portion is melted. Sensor module.
In Article 1, The lower edge of the sensor package protrudes 0.01mm to 0.2mm outward from the circuit board when mounted on the circuit board. Sensor module.
In Article 1, The first and second signal terminals are arranged in a first direction and a second direction, with a greater number arranged in the first direction, and The first and second dummy terminals include a first extension portion extending in the first direction and a second extension portion extending in the second direction, and The width of the first and second dummy terminals is formed such that the second extension portion is narrower than the first extension portion. Sensor module.
In Article 1, The above extended region extends from one end of the above combined region, and The above-mentioned coupling region is formed in the region of the above-mentioned end portion and includes a connecting wiring portion connecting the plurality of first signal terminals and the extension region, and The first dummy terminal is located on the upper part of the connection wiring section. Sensor module.
In Article 1, The above extended region extends from one end of the above combined region, and The above-mentioned coupling region is formed in the region of the above-mentioned end portion and includes a connecting wiring portion connecting the plurality of first signal terminals and the extension region, and The first dummy terminal is formed to surround the connecting wiring portion. Sensor module.
In Article 1, The above extended region extends from one end of the above combined region, and The above-mentioned coupling region is formed in the region of the above-mentioned end portion and includes a connecting wiring portion connecting the plurality of first signal terminals and the extension region, and The spacing distance between the one end portion of the first dummy terminal and the plurality of first signal terminals is formed to be longer than the spacing distance between the opposite portion of the one end portion of the first dummy terminal and the plurality of first signal terminals. Sensor module.

Description

Sensor module The present invention relates to a sensor module, and more specifically, to a sensor module formed by mounting a sensor package (e.g., a fingerprint recognition sensor) on a circuit board. Security devices are widely used to protect technology or business secrets. These devices set passwords that can only be used by designated individuals. While passwords typically used simple characters or numbers, security is now being enhanced by utilizing human biometric information such as fingerprints or irises. A fingerprint recognition sensor module for setting a password using fingerprints utilizes a capacitance sensor based on the presence or absence of finger contact, an optical sensor using light, or an ultrasonic sensor using ultrasound to detect fingerprints. These fingerprint recognition sensor modules are used in various fields and devices, such as doors and lockers, as well as in portable devices like smartphones and wearable devices, and as drive switches for various products. In the case of a technology in which a fingerprint recognition sensor module is applied to a mechanical button exposed to the outside of a smartphone among the conventional sensor modules described above, the sensor package of the sensor module is mounted on a circuit board and installed. At this time, considering waterproofing, epoxy resin is applied using an underfill method to the edge portion facing the sensor package mounted on the circuit board. However, recently, due to the miniaturization of the circuit board itself or components, the area to be coated with the epoxy resin has been reduced or excluded, making it difficult to apply the epoxy resin. FIG. 1 is an exploded perspective view illustrating the configuration of the present invention and an example of electrical connection between a sensor package and a circuit board. FIG. 2 is a bottom perspective view illustrating the configuration of the present invention. FIG. 3 is a cross-sectional view illustrating the configuration, electrical connection, and waterproof structure of the present invention (an example in which both the first and second joints are soldered). FIG. 4 is a partial excerpt cross-sectional view specifically enlarged illustrating the waterproof structure of FIG. 3. FIG. 5 is a cross-sectional view illustrating the configuration, electrical connection, and waterproof structure of the present invention (an example in which both the first and second joints are epoxy solder). FIG. 6 is a plan view illustrating the structure of the surface where the first signal terminal of the circuit board of the present invention is located and the difference in width between the first direction and the second direction of the first dummy terminal. FIGS. 7 and FIGS. 8 are plan views illustrating other examples of a state in which a connecting wiring portion is located in the coupling area of the present invention. Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are assigned the same reference number, and redundant descriptions thereof will be omitted. Furthermore, in describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, each step described may be performed regardless of the order listed, except where it must be performed in the order listed by a particular causal relationship. In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. The present invention will be described below with reference to the attached drawings. As illustrated in the attached drawings FIGS. 1 to 3, the present invention comprises: a circuit board (110) having a coupling region (101) and an extension region (102) extending to one side of the coupling region (101); a sensor package (120) coupled to one side of the coupling region (101) and including a package substrate (120a), a sensor chip (120b) mounted on the package substrate (120a), and a molding portion (120c) for molding the sensor chip (120b); and a coupling portion (130) connecting the circuit board (110) and the sensor