KR-20260062279-A - End ribbon bonding apparatus for hetero-junction silicon solar modules and method of the same

KR20260062279AKR 20260062279 AKR20260062279 AKR 20260062279AKR-20260062279-A

Abstract

The present invention relates to an end ribbon joining device for a heterojunction silicon photovoltaic module and an end ribbon joining device and method for a shingled heterojunction silicon photovoltaic module, comprising: a seating stage for seating a shingled string; an ECA spraying unit for applying adhesive to a busbar formed on the shingled string; a heated bonding unit having a compression means for joining an end ribbon and the busbar to transmit current generated from the shingled string to a junction box; and a control unit for controlling the adhesive spraying conditions of the ECA spraying unit, controlling the temperature of the heated bonding unit, and controlling the movement and pressure range of the heated bonding unit, thereby improving the yield of a shingled photovoltaic module made of HJT cells and lowering the manufacturing process cost.

Inventors

정채환
박민준
윤성민
전기석

Assignees

한국생산기술연구원

Dates

Publication Date: 20260507
Application Date: 20241029

Claims (9)

In an end ribbon joining device for a shingled heterojunction silicon photovoltaic module, A mounting stage for mounting shingled strings; An ECA spraying unit for applying adhesive to a busbar formed on the above-mentioned shingled string; A heated adhesive portion having a compression means for joining an end ribbon and a busbar for transmitting current generated in the above shingled string to a junction box; and An end ribbon bonding device for a heterojunction silicon photovoltaic module, characterized by including a control unit that controls the adhesive spraying conditions of the ECA spraying unit, controls the temperature of the heated bonding unit, and controls the movement and pressure range of the heated bonding unit.
In Paragraph 1, An end ribbon joining device for a heterogeneous junction silicon photovoltaic module, characterized in that the heat bonding portion comprises an upper pressing means and a lower pressing means for pressing the end ribbon located on the busbar on which the adhesive is applied at the upper and lower ends of the shingled string.
In paragraph 2, The end ribbon bonding device for a heterojunction silicon photovoltaic module, characterized in that the above-mentioned heating bonding portion independently heats the temperatures of the upper compression means and the lower compression means.
In a method for joining end ribbons of a shingled heterojunction silicon photovoltaic module, i) a step of providing a shingled string for joining the end ribbon; ii) A step of placing the above-mentioned shingled string on the stage; iii) a step of spraying and applying adhesive onto the shingled string according to preset spraying conditions of the adhesive; iv) a step of positioning the end ribbon on the shingled string to which the adhesive is applied; and v) A method for joining an end ribbon of a heterojunction silicon photovoltaic module, characterized by including the step of moving the heated adhesive portion heated to a set temperature to join the end ribbon to the shingled string.
In Paragraph 4, The above step v) is a method for joining end ribbons of a heterogeneous silicon photovoltaic module, characterized by joining the end ribbon located on the shingled string, on which the adhesive is applied, between the upper pressing means and the lower pressing means of the heated adhesive portion by pressing from the upper and lower sides.
In Paragraph 4, The above step v) is a method for joining end ribbons of a heterojunction silicon photovoltaic module, characterized by heating the heated bonding portion to a temperature range of 130°C to 150°C.
In Paragraph 4, End ribbon bonding method for a heterojunction silicon photovoltaic module, characterized in that the adhesive is ECA.
In Paragraph 4, The above step iii) is a method for joining end ribbons of a heterojunction silicon photovoltaic module, characterized by applying the adhesive to the upper busbar or the rear busbar of the shingled string.
A heterojunction silicon photovoltaic module manufactured by any one of the methods selected from paragraphs 4 to 8.

Description

End ribbon bonding apparatus for hetero-junction silicon solar modules and method of the same The present invention relates to an end ribbon bonding apparatus and method for a heterojunction silicon photovoltaic module. In particular, since the end ribbon detaches due to insufficient bonding strength compared to conventional PERC cells when a high-temperature soldering process is applied to a heterojunction silicon photovoltaic module, the invention relates to an end ribbon bonding apparatus and method for a heterojunction silicon photovoltaic module that prevents the end ribbon from detaching from the busbar by bonding at a low temperature using a conductive adhesive, prevents crystallization of a-Si in the heterojunction silicon photovoltaic module, and prevents the conductivity of the transparent electrode from decreasing at high temperatures. Currently, PERC solar cells using p-type monocrystalline silicon wafers as substrates account for more than 80% of the global solar cell market. China's Trina Solar announced that it achieved a peak R&D efficiency of 24.5% on M12 ( 210x210mm² ) large-area wafers, indicating that the technology has matured to the point where the peak mass production efficiency of p-type PERC solar cells is approaching the mass production limit of 24.5%. Since the average efficiency of mass-produced solar cells is expected to plateau after reaching 24%, n-type heterojunction (HJT) solar cells, which have a mass production limit efficiency of 28.5%, are attracting attention in order to develop high-efficiency solar cells with an efficiency of over 24%. HJT solar cells are a type of photovoltaic cell that converts sunlight into electricity by combining multiple layers of various semiconductor materials; a heterojunction refers to a junction formed by the interface between different materials, such as a combination of amorphous silicon (a-Si) and crystalline silicon (c-Si). HJT solar cells have the advantages of being able to achieve a conversion efficiency of over 30% in the case of bifacial modules, being less affected by temperature changes so they can be used at high temperatures, and possessing a high bifaciality factor. However, while p-PERC silicon solar cells exhibit high durability even in high-temperature processes exceeding 800°C, HJT solar cells have the disadvantage of being difficult to process at high temperatures. An example of technology regarding HJT solar cell modules and processes is disclosed in the following patent documents 1 to 3, etc. For example, Patent Document 1 below discloses a technology related to a heterojunction solar cell that improves the conversion efficiency of an HJT cell using LECO technology, wherein the solar cell comprises a substrate having a first surface and a second surface; a first intrinsic amorphous silicon layer, a first doping layer, and a first dielectric layer are sequentially arranged on the first surface; a first anti-reflection layer is arranged on the first dielectric layer and an opening is provided; and a first grid line is arranged on the first dielectric layer through the opening of the first anti-reflection layer and provides a contact with the first doping layer. Furthermore, the following patent document 2 describes a shingled solar cell module in which a plurality of solar cell cells are shingledly arranged through a junction, comprising: a plurality of fingers arranged at regular intervals in the horizontal direction on the upper surface of the cell; a plurality of upper busbars extending in the vertical direction to collect current from the fingers on the upper surface of the cell; a plurality of rear busbars extending parallel to the upper busbars on the rear surface of the cell; and an upper end ribbon having an upper body region extending in the horizontal direction of a string to connect at least two upper branch regions arranged parallel to each of the upper branch regions, each of which is in contact with the plurality of upper busbars. A shingled solar cell module is disclosed, comprising a rear end ribbon having at least two rear branch regions arranged in parallel and each of which is in contact with a plurality of rear busbars and a rear body region extending in the transverse direction of a string to connect each of the rear branch regions, wherein the upper end ribbon is characterized in that only a portion of the upper branch region is connected to the upper busbar and on the cell plane, the remaining portion is bent to wrap around the side of the cell body, and further, the upper body region is secondarily bent so as to correspond to the back of the cell. Meanwhile, the following patent document 3 discloses an apparatus and method for evaluating the adhesive strength of a shingled solar cell module, wherein a first end ribbon is soldered to one end portion of the shingled solar cell module and a second end ribbon is soldered to the other end portion of the shingled solar cell module. Figure 1 is a schemati