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KR-20260062398-A - Nozzle unit and Substrate processing unit

KR20260062398AKR 20260062398 AKR20260062398 AKR 20260062398AKR-20260062398-A

Abstract

A substrate processing device is disclosed. The substrate processing device comprises: a cup having a processing space; a spin chuck supporting a substrate in the processing space; and a nozzle unit supplying a processing fluid to a substrate supported by the spin chuck; wherein the nozzle unit may include: a support shaft provided with a longitudinal direction in the vertical direction; a support arm coupled to the support shaft and provided with a longitudinal direction perpendicular to the support shaft; a nozzle provided at the end of the support arm; a fixing bolt for fixing the support arm to the support shaft; and a stress distribution bolt positioned spaced apart from the fixing bolt along the longitudinal direction of the support arm and coupled to the support arm at a position that does not overlap with the support shaft when viewed from above.

Inventors

  • 김성필

Assignees

  • 세메스 주식회사

Dates

Publication Date
20260507
Application Date
20241029

Claims (10)

  1. In a substrate processing device: A cup having a processing space; A spin chuck that supports a substrate in the above processing space; It includes a nozzle unit that supplies a processing fluid to a substrate supported on the spin chuck; The above nozzle unit is A support shaft provided in the vertical direction along its length; A support arm coupled to the support shaft, with its longitudinal direction provided perpendicular to the support shaft; A nozzle provided at the end of the above-mentioned support arm; A fixing bolt for fixing the above support arm to the above support shaft; and A substrate processing device comprising a stress-distributing bolt positioned spaced apart from the fixing bolt along the longitudinal direction of the support arm and coupled to the support arm at a position that does not overlap with the support axis when viewed from above.
  2. In paragraph 1, A frame coupled to the upper surface of the support arm, having a lower plate formed by extending from a position where the support arm and the support shaft overlap to a position where the support arm does not overlap with the support shaft; and It includes a support pad placed on the lower plate, and The above stress-distributing bolt is provided to secure the support pad and the lower plate to the support arm in a substrate processing device.
  3. In paragraph 2, The above stress-distributing bolt is a substrate processing device in which the support arm is fixed to the support arm at a position where the support arm does not overlap with the support axis.
  4. In paragraph 3, A substrate processing device provided with the above fixing bolt to fix the support pad and the lower plate to the support arm and the support shaft at a position where the support arm and the support shaft overlap.
  5. In paragraph 1, A substrate processing device further comprising a vibration damping unit provided to the support arm to dampen vibrations when the support arm moves.
  6. In paragraph 5, The above vibration damping unit is A frame having an upper plate and a lower plate, coupled to the upper surface of the support arm; A support pad placed on the lower plate above; and A substrate processing device comprising an elastic member positioned between the upper plate and the lower plate.
  7. In paragraph 6, A substrate processing device provided with the above fixing bolt to fix the support pad and the lower plate to the support arm and the support shaft.
  8. Regarding the nozzle unit: A support shaft provided in the vertical direction along its length; A support arm coupled to the support shaft, with its longitudinal direction provided perpendicular to the support shaft; A nozzle provided at the end of the above-mentioned support arm; A fixing bolt for fixing the above support arm to the above support shaft; A stress-distributing bolt positioned spaced apart from the fixing bolt along the longitudinal direction of the support arm and coupled to the support arm at a position that does not overlap with the support axis when viewed from above; and A nozzle unit comprising a vibration damping unit provided to the support arm to dampen vibrations when the support arm moves.
  9. In paragraph 8, A frame having a lower plate and an upper plate formed by extending from a position where the support arm and the support shaft overlap to a position where the support arm does not overlap with the support shaft, and coupled to the upper surface of the support arm; and It further includes a support pad placed on the lower plate, and The stress-distributing bolt is provided to secure the support pad and the lower plate to the support arm at a position where the support arm does not overlap with the support shaft, and A nozzle unit provided with the above fixing bolt to fix the support pad and the lower plate to the support arm and the support shaft at a position where the support arm and the support shaft overlap.
  10. In Paragraph 9, The above vibration damping unit is A nozzle unit comprising an elastic member positioned between the upper plate and the lower plate.

Description

Nozzle unit and Substrate processing unit The present invention relates to a nozzle unit and a substrate processing device. Generally, as semiconductor devices become more dense, highly integrated, and high-performance, the miniaturization of circuit patterns progresses rapidly; contaminants such as particles, organic contaminants, and metal contaminants remaining on the substrate surface have a significant impact on device characteristics and production yield. For this reason, cleaning processes to remove various contaminants and unnecessary films attached to the substrate surface have emerged as critically important in semiconductor manufacturing, and substrate cleaning processes are being implemented at the pre- and post-stages of each unit process in semiconductor manufacturing. Cleaning methods currently used in semiconductor manufacturing processes are broadly divided into dry cleaning and wet cleaning. Wet cleaning is further divided into a bath type, in which contaminants are removed by chemical dissolution by immersing the substrate in a chemical solution, and a single-wafer type, in which contaminants are removed by supplying a chemical solution to the surface of the substrate while it is placed on a spin chuck and rotated. In a single-wafer type cleaning device, various types of cleaning solutions are used depending on the type of contaminants and film material to be removed from the substrate, and the cleaning solution is supplied to the substrate through a swing nozzle unit. Figure 8 is a drawing showing a typical swing nozzle unit. As shown in FIG. 8, the swing nozzle unit (20) experiences a phenomenon where the nozzle arm (22) sags in the up-and-down direction or twists in the left-and-right direction due to torque deformation of the bolt (24) connecting the nozzle arm (22) and the rotation axis (23) during repetitive motion (swing/up-and-down), and as a result, the point of impact and the amount of liquid supplied through the nozzle (21) change, and a problem occurs in which process defects occur. FIG. 1 is a schematic plan view of the substrate processing facility of the present invention. Figure 2 is a plan view of the substrate processing apparatus of Figure 1. Figure 3 is a cross-sectional view of the substrate processing apparatus of Figure 1. FIG. 4 is a perspective view illustrating a nozzle unit. Fig. 5 is a side view of the nozzle unit illustrated in Fig. 4. Figure 6 is a plan view of the nozzle unit illustrated in Figure 4. FIG. 7 is a drawing for explaining the sagging prevention member illustrated in FIG. 4. Figure 8 is a drawing showing a conventional nozzle unit. Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in describing preferred embodiments of the present invention in detail, specific descriptions of related known functions or configurations are omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the present invention. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and operations. The term 'comprising' a component means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components. Specifically, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Singular expressions include plural expressions unless the context clearly indicates otherwise. Additionally, the shapes and sizes of elements in drawings may be exaggerated for clearer explanation. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. Conversely, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. Other expressions describing the relationships between c