KR-20260062400-A - METHOD OF PROCESSING SUBSTRATE AND APPARATUS THEREOF

Abstract

A substrate processing method according to one embodiment of the present invention comprises the steps of: processing the substrate by supplying a processing liquid to the substrate through a liquid supply line in which an opening/closing valve and a back-and-forward valve are installed; closing the opening/closing valve based on a first opening/closing profile; and performing a back-and-forward operation based on a first back-and-forward profile, wherein the first opening/closing profile includes information on a closing slope which is a slope of pneumatic pressure applied to the opening/closing valve over time, and the first back-and-forward profile includes information on a back-and-forward slope which is a slope of pneumatic pressure applied to the back-and-forward valve over time, and the first back-and-forward profile may include a plurality of different back-and-forward slopes.

Inventors

• 구희재
• 유재호

Assignees

• 세메스 주식회사

Dates

Publication Date

20260507

Application Date

20241029

Claims (20)

1. In a method for processing a substrate, A step of treating the substrate by supplying a processing liquid to the substrate through a liquid supply line equipped with an opening/closing valve and a back valve; A step of closing the opening/closing valve based on the first opening/closing profile; and It includes the step of performing a stoneback operation based on the first stoneback profile, and The above first opening/closing profile includes information on the closing slope, which is the slope of the pneumatic pressure applied to the opening/closing valve over time, and The first Seokbaek profile above includes information on the Seokbaek slope, which is the slope of the pneumatic pressure applied to the Seokbaek valve over time, and A substrate processing method in which the first stone white profile includes a plurality of different stone white slopes.
2. In paragraph 1, The above-mentioned first stone white profile is, The first stone-back slope, which is the slope during the first hour; and It includes the second stone-white slope, which is the slope during the second time after the first time mentioned above, The above-mentioned first stone slope is a non-zero slope, and A substrate processing method in which the second stone white slope is 0.
3. In paragraph 2, The step of performing a stone-back operation based on the above-mentioned first stone-back profile is: A step of controlling the pneumatic pressure applied to the Seokbaek valve based on the first Seokbaek slope to adjust the pressure of the Seokbaek valve from the first Seokbaek pressure to the second Seokbaek pressure; and A substrate processing method comprising the step of controlling the pneumatic pressure applied to the stoneback valve based on the second stoneback slope to adjust the pressure of the stoneback valve from the second stoneback pressure to the third stoneback pressure.
4. In paragraph 3, The step of performing a stone-back operation based on the above-mentioned first stone-back profile is: The method further includes the step of acquiring a second image, which is an image of the nozzle while the above-mentioned stone-back operation is being performed, and The above method is, A step of determining whether the stone-white state of the nozzle is normal based on the second image above; and A substrate processing method further comprising the step of generating a second stone-back profile by correcting at least one of the plurality of stone-back slopes when it is determined that the stone-back condition of the nozzle is abnormal.
5. In paragraph 4, The step of determining whether the stone-white state of the nozzle is normal based on the second image above is, A substrate processing method comprising the step of determining that the state of the stone white of the nozzle is abnormal when the height of the processing liquid remaining in the nozzle exceeds a preset range.
6. In paragraph 1, The step of closing the opening/closing valve based on the first opening/closing profile is, The method further includes the step of acquiring a first image, which is an image of the nozzle while the above-mentioned opening/closing valve is closed, and The above method is, A step of determining whether the cutoff state of the nozzle is normal based on the first image above; and A substrate processing method further comprising the step of generating a second opening/closing profile by correcting the closing slope when it is determined that the cut-off state of the nozzle is abnormal.
7. In paragraph 6, The step of determining whether the cutoff state of the nozzle is normal based on the first image above is, A substrate processing method comprising the step of determining that the cutoff state of the nozzle is abnormal when liquid splashing, layer separation, cutoff delay, or liquid sagging occurs at the nozzle based on the first image above.
8. In Paragraph 7, The step of generating the second opening/closing profile above is, A substrate processing method comprising the step of generating the second opening/closing profile by performing the correction for the closing slope in a manner that reduces the magnitude of the closing slope when the liquid splashing phenomenon or the layer separation phenomenon occurs at the nozzle.
9. In Paragraph 7, The step of generating the second opening/closing profile above is, A substrate processing method comprising the step of generating the second opening/closing profile by performing the correction for the closing slope in a manner that increases the magnitude of the closing slope when the cutoff delay phenomenon or the liquid sagging phenomenon occurs at the nozzle.
10. In paragraph 1, The above-mentioned first opening/closing profile and the above-mentioned first stone-back profile are, A substrate treatment method that varies depending on the type of the above-mentioned treatment solution.
11. In a device for processing substrates, Housing containing a processing space inside; A support unit that supports a substrate in the above processing space; A liquid supply unit that supplies a processing liquid to the above substrate; It includes a controller that controls the above liquid supply unit, and The above liquid supply unit is, A liquid supply line through which the above-mentioned processing liquid flows; A nozzle connected to the above liquid supply line to supply the processing liquid to the substrate; An opening and closing valve provided on the above liquid supply line; A stone-back valve provided adjacent to the above-mentioned opening/closing valve; and A pressure control device that controls at least one of the above-mentioned opening/closing valve and the above-mentioned stoneback valve, and The above controller is, Command the pressure control device to control the opening/closing valve and the back valve to close the opening/closing valve based on the first opening/closing profile and to perform a back operation based on the first back profile, and The above first opening/closing profile includes information on the closing slope, which is the slope of the pneumatic pressure applied to the opening/closing valve over time, and The first Seokbaek profile above includes information on the Seokbaek slope, which is the slope of the pneumatic pressure applied to the Seokbaek valve over time, and A substrate processing device in which the first stone-back profile includes a plurality of different stone-back slopes.
12. In Paragraph 11, The above-mentioned first stone white profile is, The first stone-back slope, which is the slope during the first hour; and It includes the second stone-white slope, which is the slope during the second time after the first time mentioned above, The above-mentioned first stone slope is a non-zero slope, and A substrate processing device in which the second stone-white slope is 0.
13. In Paragraph 11, It further includes an imaging device for acquiring an image of the above nozzle, and The above imaging device is, A first image, which is an image of the nozzle while the above-mentioned opening/closing valve is closed, is acquired and transmitted to the controller, and The above controller is, The first image is received from the imaging device, and Based on the first image above, determine whether the cutoff state of the nozzle is normal, and If it is determined that the cutoff state of the above nozzle is abnormal, the above closing slope is corrected to generate a second opening/closing profile, and A substrate processing device that commands the pressure control device to control the opening/closing valve according to the second opening/closing profile.
14. In Paragraph 13, The above controller is, A substrate processing device that determines that the cutoff state of the nozzle is abnormal when liquid splashing, layer separation, cutoff delay, or liquid sagging occurs at the nozzle based on the first image above.
15. In Paragraph 14, The above imaging device is, A second image, which is an image of the nozzle while the above stone-white operation is being performed, is acquired and transmitted to the controller, and The above controller is, The second image is received from the imaging device, and based on the second image, it is determined whether the backlighting state of the nozzle is normal. If it is determined that the stone-back condition of the above nozzle is abnormal, at least one of the plurality of stone-back inclinations is corrected to generate a second stone-back profile, and A substrate processing device that commands the pressure control device to control the stone bag valve according to the second stone bag profile.
16. In paragraph 15, The above controller is, A substrate processing device that determines that the state of the granulation liquid in the nozzle is abnormal when the height of the processing liquid remaining in the nozzle exceeds a preset range.
17. In a method for processing a substrate, A step of treating the substrate by supplying a processing liquid to the substrate through a liquid supply line equipped with an opening/closing valve and a back valve; A step of closing the opening/closing valve based on the first opening/closing profile; and It includes the step of performing a stoneback operation based on the first stoneback profile, and The above first opening/closing profile includes information on the closing slope, which is the slope of the pneumatic pressure applied to the opening/closing valve over time, and The first Seokbaek profile above includes information on the Seokbaek slope, which is the slope of the pneumatic pressure applied to the Seokbaek valve over time, and The above stone-white slope is multiple, and The step of performing a stone-back operation based on the above-mentioned first stone-back profile is: A step of controlling the pneumatic pressure applied to the stone bag valve based on the first stone bag slope among the plurality of stone bag slopes to adjust the pressure of the stone bag valve from the first stone bag pressure to the second stone bag pressure; A step of controlling the pneumatic pressure applied to the stone bag valve based on the second stone bag slope among the plurality of stone bag slopes to adjust the pressure of the stone bag valve from the second stone bag pressure to the third stone bag pressure; and A substrate processing method in which the second stone-back pressure and the third stone-back pressure are the same pressure.
18. In Paragraph 17, The above-mentioned first stone white profile is, The first stone-back slope, which is the slope during the first hour; and It includes the second stone-white slope, which is the slope during the second time after the first time mentioned above, The above-mentioned first stone slope is a non-zero slope, and A substrate processing device in which the second stone-white slope is 0.
19. In Paragraph 18, The step of closing the opening/closing valve based on the first opening/closing profile is, The method further includes the step of acquiring a first image, which is an image of the nozzle while the above-mentioned opening/closing valve is closed, and The above method is, A step of determining whether the cutoff state of the nozzle is normal based on the first image above; and A substrate processing method further comprising the step of generating a second opening/closing profile by correcting the closing slope when it is determined that the cut-off state of the nozzle is abnormal.
20. In Paragraph 18, The step of performing a stone-back operation based on the above-mentioned first stone-back profile is: The method further includes the step of acquiring a second image, which is an image of the nozzle while the above-mentioned stone-back operation is being performed, and The above method is, A step of determining whether the stone-back condition of the nozzle is normal based on the second image above; and A substrate processing method further comprising the step of generating a second stone-back profile by correcting at least one of the plurality of stone-back slopes when it is determined that the stone-back condition of the nozzle is abnormal.

Description

Method of processing substrate and apparatus thereof The present invention relates to a substrate processing method and apparatus for processing a substrate with a processing solution. To manufacture semiconductor devices or liquid crystal displays, various processes such as photolithography, ashing, etching, ion implantation, thin film deposition, and cleaning can be performed on the substrate. Among these, the cleaning process is carried out before and after each step to remove particles remaining on the substrate. Among these, the photolithography process is a process for forming a desired pattern on a wafer. The photolithography process is typically carried out in a spinner local facility connected to an exposure system, which continuously processes the coating process, the exposure process, and the development process. This spinner local facility performs the HMDS (Hexamethyl disilazane) treatment process, the coating process, the baking process, and the development process sequentially or selectively. Meanwhile, during the process of manufacturing a substrate, a liquid is supplied to the substrate to perform a substrate processing process. The liquid is supplied to the substrate through a liquid supply line and then through a nozzle. Afterward, a cut-off operation is performed by closing the flow path through an opening/closing valve installed in the liquid supply line. After performing the cut-off operation, to prevent the liquid remaining in the nozzle from being supplied to the substrate, a suck-back operation is performed to suck the liquid remaining in the nozzle back in through a suck-back valve, and the control of the opening/closing valve and the suck-back valve is performed through a speed controller. Here, the cut-off state and the suck-back state change depending on the opening/closing speed of the opening/closing valve and the suck-back valve, the shape of the nozzle, the flow rate of the liquid, etc. However, when controlling the opening/closing valve and the suck-back valve through a speed controller, there is a problem in that only the opening/closing speed and internal volume of the opening/closing valve and the suck-back valve can be controlled. FIG. 1 is a perspective view schematically showing a substrate processing apparatus according to one embodiment of the present invention. Figure 2 is a front view of the substrate processing device of Figure 1. Figure 3 is a plan view of the coating block in the substrate processing apparatus of Figure 1. Figure 4 is a plan view of the developing block in the substrate processing apparatus of Figure 1. Figure 5 is a plan view schematically showing the return robot of Figure 3. FIG. 6 is a plan view schematically showing an example of the heat treatment chamber of FIG. 3 or FIG. 4. Figure 7 is a front view of the heat treatment chamber of Figure 6. FIG. 8 is a cross-sectional view schematically showing an example of the liquid treatment chamber of FIG. 3 or FIG. 4. FIG. 9 is a drawing for explaining a liquid supply unit according to one embodiment of the present invention. FIG. 10 is a flowchart of a substrate processing method according to one embodiment of the present invention. FIG. 11 is a conceptual diagram illustrating an opening and closing operation according to an embodiment of the present invention. FIG. 12 is a conceptual diagram illustrating the operation of a stone back according to one embodiment of the present invention. FIGS. 13 to 15 are conceptual diagrams for explaining a cutoff state according to an embodiment of the present invention. Exemplary embodiments will now be described more fully with reference to the accompanying drawings. Exemplary embodiments are provided to ensure that the present disclosure is thorough and will fully convey its scope to those skilled in the art. To provide a complete understanding of the embodiments of the present disclosure, many specific details, such as examples of specific components, devices, and methods, are presented. It will be apparent to those skilled in the art that specific details are not necessary, that exemplary embodiments may be implemented in many different forms, and that neither should be interpreted as limiting the scope of the present disclosure. In some exemplary embodiments, known processes, known device structures, and known technologies are not described in detail. The terms used herein are merely for describing specific exemplary embodiments and are not intended to limit exemplary embodiments. Singular expressions or expressions where singularity is not specified, as used herein, are intended to include plural expressions unless the context clearly indicates otherwise. The terms “comprising,” “comprising,” “having,” and “having” are open-ended and thus specify the presence of the mentioned features, components, steps, operations, elements, and/or components, and do not exclude the presence or addition of one or more other features, components, steps, operations, elem