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KR-20260062402-A - APPARATUS AND METHOD FOR TREATING SUBSTRATE

KR20260062402AKR 20260062402 AKR20260062402 AKR 20260062402AKR-20260062402-A

Abstract

A substrate processing device according to one embodiment of the present invention may have a cup having a processing space provided therein, a support unit supporting a substrate in the processing space, a nozzle supplying a processing liquid to the substrate, and a monitoring jig provided to be supported on the support unit and changing color by the force of the processing liquid.

Inventors

  • 황준혁
  • 최현석

Assignees

  • 세메스 주식회사

Dates

Publication Date
20260507
Application Date
20241029

Claims (10)

  1. In a substrate processing device, A cup with an internal processing space; A support unit that supports a substrate in the above processing space; A nozzle for supplying a processing liquid to the above substrate; and A substrate processing device having a monitoring jig that is supported on the above-mentioned support unit and whose color changes by the force of the processing liquid.
  2. In paragraph 1, A substrate processing device provided such that the change in color caused by the force of the processing liquid in the above monitoring jig occurs only in the target area.
  3. In paragraph 2, The above monitoring jig has the same shape as the above substrate, A substrate processing device, wherein the above target area is an area including a set point of impact of the processing liquid supplied from the nozzle when the substrate is supported by the support unit.
  4. In paragraph 2, A substrate processing device further comprising an imaging unit for acquiring an image of the target area of the monitoring jig supported by the support unit.
  5. In paragraph 4, It further includes a control unit that receives the image from the imaging unit and performs control over the liquid supply unit based on the image. The above control unit is, A substrate processing device that controls the position of the nozzle supplying the processing liquid based on the above image.
  6. In paragraph 1, A substrate processing device in which the above target region is composed of a shape memory material.
  7. In paragraph 6, The above shape memory material is a substrate processing device comprising a cobalt chloride material.
  8. In paragraph 1, A substrate processing device in which the above-mentioned processing solution is deionized water.
  9. In a method for processing a substrate, A substrate processing step of positioning a nozzle at a setting position and supplying a processing liquid from the nozzle to a substrate supported on a support unit to process the substrate; The method includes a position setting step for setting the setting position of the nozzle prior to the substrate processing step, wherein The above position setting step is, A jig positioning step of positioning a monitoring jig comprising a material whose color changes due to the impact force of the processing liquid supplied from the nozzle on the support unit; A processing liquid discharge step of discharging a processing liquid from a nozzle located at the above-mentioned setting position to the monitoring jig supported by the support unit; Area detection step for detecting an area in which the color changes due to the impact force of the processing liquid in the monitoring jig; and A substrate processing method comprising a comparison step for comparing whether an area detected in the detection step is identical to the impact position of the processing liquid set on the monitoring jig.
  10. In Paragraph 9, The above comparison step is, A substrate processing method further comprising a correction step of correcting the position of the nozzle to the setting position when the detected area is different from the impact position of the processing liquid as a result of the comparison above.

Description

Apparatus and Method for Treating Substrate The present invention relates to a substrate processing apparatus and a substrate processing method, and more specifically, to an apparatus for processing a substrate by supplying a processing solution to the substrate. To manufacture semiconductor devices or liquid crystal displays, various processes such as photolithography, ashing, etching, ion implantation, thin film deposition, and cleaning can be performed on the substrate. Among these, the cleaning process is carried out before and after each step to remove particles remaining on the substrate. These cleaning processes are applied differently depending on the surface properties of the substrate. In particular, when hydrophobizing the substrate surface or cleaning a hydrophobized surface, chemical treatment and wetting steps are performed. Chemicals may be supplied while the substrate is rotating, followed by the supply of a wetting solution. Additionally, an inert gas such as nitrogen is supplied to the substrate for drying purposes before and after the process of treating the substrate with liquids such as chemicals or wetting solutions. In processes involving the supply of fluids such as liquids and gases, the position of the fluid on the substrate affects the process. Therefore, it is required to accurately set the nozzle so that the fluid is supplied to the correct position on the substrate. FIG. 1 is a schematic diagram showing a substrate processing apparatus according to one embodiment of the present invention. FIG. 2 is a drawing illustrating a liquid treatment chamber according to one embodiment of the present invention. FIGS. 3 and 4 are drawings for explaining a monitoring jig according to an embodiment of the present invention. FIGS. 5 to 6 are flowcharts of a substrate processing method according to one embodiment of the present invention. Embodiments of the present invention may be described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the essence of the present invention, such detailed description may be omitted. Additionally, the same reference numerals may be used throughout the drawings for parts having similar functions and operations. The statement that a component "may include" may mean that, unless specifically stated otherwise, it does not exclude other components but rather that additional components may be included. Specifically, terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. A singular expression may include a plural expression unless the context clearly indicates otherwise. Additionally, the shapes and sizes of elements in drawings may be exaggerated for clearer explanation. Terms such as "first," "second," etc., may be used to describe various components, but said components may not be limited by said terms. These terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. Conversely, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. Other expressions describing the relationship between components, such as "between" and "exactly between," or "adjacent to" and "directly adjacent to," may be interpreted in the same way. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. FIG. 1 is a schematic diagram showing a substrate processing apparatus according to one embodiment of the present inven