KR-20260062423-A - Flexible die-cut circuit board and manufacturing method thereof

KR20260062423AKR 20260062423 AKR20260062423 AKR 20260062423AKR-20260062423-A

Abstract

According to the present disclosure, a flexible die-cut circuit board and a method for manufacturing the same can be provided, comprising: a substrate formed of a flexible material and having one side and another side opposite to the one side; one or more traces formed on one side of the substrate; a pattern fuse that is damaged when an overcurrent flows, wherein a portion of the trace has a thickness smaller than another portion, and a protective layer covering the trace and the pattern fuse, wherein the pattern fuse is formed as a curved pattern in a direction perpendicular to one side of the substrate.

Inventors

황대균
노윤주
신희준
최회욱
홍총표

Assignees

에스케이온 주식회사

Dates

Publication Date: 20260507
Application Date: 20241029

Claims (12)

A substrate formed of a flexible material and having one surface and another surface opposite to the one surface; One or more traces formed on one surface of the above substrate; A pattern fuse in which the thickness of a part of the above trace is formed to be smaller than that of another part, so that it breaks when an overcurrent flows; and A flexible die-cut circuit board comprising a protective layer covering the above trace and pattern fuse.
In claim 1, The above pattern fuse is A flexible die-cut circuit board formed with a curved pattern perpendicular to one surface of the above substrate.
In claim 1, The above trace and the above pattern fuse are a flexible die-cut circuit board having the same width in at least part.
In claim 1, The above pattern fuse is A flexible die-cut circuit board formed in a pattern in which convex and concave portions are repeatedly formed in a direction perpendicular to one surface of the substrate.
In claim 4, The above pattern fuse is A flexible die-cut circuit board in which the convex and concave portions are located within the thickness range of the trace.
A step of pressing the metal film with a press mold in an area of the metal film where a pattern fuse is to be formed; A step of forming a trace and a pattern fuse by die-cutting the metal film so that the pressed area of the metal film is included in the trace; and A method for manufacturing a flexible die-cut circuit board, comprising the step of aligning the trace and pattern fuse on one surface of a substrate formed of a flexible material, and forming a protective layer covering the trace and pattern fuse on the substrate to manufacture a circuit board.
In claim 6, The above pattern fuse is A method for manufacturing a flexible die-cut circuit board formed with a curved pattern in a direction perpendicular to one surface of the substrate.
In claim 6, The above press mold is A lower mold supporting the lower surface of the metal film in the area where the pattern fuse is to be formed; and A method for manufacturing a flexible die-cut circuit board comprising an upper mold that presses the upper surface of the metal film in an area where the pattern fuse is to be formed.
In claim 8, The lower mold above A convex first curve pattern is formed on the upper surface in contact with the area where the above pattern fuse is to be formed, and The upper mold above A method for manufacturing a flexible die-cut circuit board, wherein a convex second curve pattern is formed on a lower surface that contacts the area where the pattern fuse is to be formed, so as to correspond to the concave portion of the first curve pattern.
In claim 6, The step of forming the above trace and pattern fuse is A method for manufacturing a flexible die-cut circuit board, wherein die-cutting is performed such that the above trace and the above pattern fuse have the same width in at least a portion.
In claim 6, The above pattern fuse is A method for manufacturing a flexible die-cut circuit board, wherein a pattern is formed in which convex and concave portions are repeatedly formed in a direction perpendicular to one surface of the substrate.
In claim 11, The above pattern fuse is A method for manufacturing a flexible die-cut circuit board in which the convex and concave portions are located within the thickness range of the trace.

Description

Flexible die-cut circuit board and manufacturing method thereof The present disclosure relates to a flexible die-cut circuit board and a method for manufacturing the same. Circuit boards can connect various electronic components, such as semiconductor chips, sensors, and connectors. Circuit boards are used in a wide variety of electronic devices. Flexible circuit boards, manufactured from flexible materials, can be used in electronic devices of various structures due to their flexibility. For example, flexible circuit boards can be used to connect sensors and connectors in battery modules. A fuse may be connected to the circuit board to protect various electronic components connected to the circuit board from overcurrent. The fuse can break when an overcurrent flows, thereby interrupting the flow of current. For example, a fuse may be connected to a flexible circuit board used in a battery module. FIG. 1 is a drawing showing a battery module to which a flexible die-cut circuit board according to one embodiment is applied. FIG. 2 is a drawing showing a flexible die-cut circuit board according to one embodiment. Figure 3 is a cross-sectional view along A-A' of Figure 2. FIG. 4 is a flowchart showing each step of a method for manufacturing a flexible die-cut circuit board according to one embodiment. FIGS. 5, FIGS. 6, and FIGS. 7 are drawings illustrating each step of a method for manufacturing a flexible die-cut circuit board according to one embodiment. Hereinafter, the present disclosure will be described in detail (with reference to the attached drawings). However, this is merely illustrative and the present disclosure is not limited to the specific embodiments described illustratively. Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the attached drawings. FIG. 1 is a drawing showing a battery module (1) to which a flexible die-cut circuit board (100) according to one embodiment is applied. FIG. 2 is a drawing showing a flexible die-cut circuit board (100) according to one embodiment. FIG. 3 is a cross-sectional view along A-A' of FIG. 2. The battery module (1) can be used for electric vehicles, energy storage systems (ESS), and various other purposes. The battery module (1) may include a plurality of battery cells (10), a busbar assembly (20) that connects a plurality of taps of the plurality of battery cells (10) to transmit power from the battery cells (10), a circuit board (30) that performs data transmission and reception or measurement of the module's status, and a case (40) that houses the plurality of battery cells (10). The battery module (1) may further include other elements not shown in the drawings. The battery cells (10) may be formed in a pouch type, a prismatic type, a cylindrical type, etc. The case (40) may be formed with a front part (40a), a rear part (40b), a lower side part (40c), and a top part (40d), but is not limited thereto. The shape of the case (40) and the components included in the battery module (1) may vary depending on the type of battery cell (10). A circuit board (30) included in a battery module (1) may include a flexible die-cut circuit board (100) according to one embodiment. Various electronic components such as sensors (temperature sensor, current sensor, voltage sensor, etc.), fuses, Battery Management System (BMS) chips, and connectors may be connected to the flexible die-cut circuit board (100). The flexible die-cut circuit board (100) may be used in a battery module (1) or a battery pack including a plurality of battery modules (1). A flexible die-cut circuit board (100) according to one embodiment may include a substrate (110) formed of a flexible material and having one side and another side opposite to the one side, one or more traces (121) formed on one side of the substrate (110), a pattern fuse (122) formed such that the thickness of a part of the trace (121) is smaller than that of another part and is damaged when an overcurrent flows, and a protective layer (130) covering the trace (121) and the pattern fuse (122). Here, the pattern fuse (122) may be formed as a curved pattern in a direction perpendicular to one side of the substrate (110). The layer where the trace (121) and the pattern fuse (122) are located may be called a circuit layer (120). The circuit layer (120) may include one or more traces (121) and pattern fuses (122) and may further include an adhesive (123). The adhesive can bond the substrate, the trace (121), and the protective layer (130). The substrate (110) can be formed from a flexible material. Since the trace (121) formed on the substrate (110) is also formed from a thin metal film (200) and the protective layer (130) is also formed from a flexible material, the flexible die-cut circuit board (100) can be bent. The substrate (110) may have one side (110a) and another side (110b) which is opposite to the one side (110a). Electronic components such as sensors, semiconductor chips, fus