KR-20260062497-A - METHOD OF PROCESSING SUBSTRATE AND APPARATUS THEREOF

KR20260062497AKR 20260062497 AKR20260062497 AKR 20260062497AKR-20260062497-A

Abstract

A substrate processing method according to one embodiment of the present invention may include the steps of: transmitting a monitoring signal from a first control block connected to a first sensor to a second control block connected to a second sensor; determining whether the second control block is operating normally based on a response to the monitoring signal; and determining an output signal of the second sensor based on whether the second control block is operating normally.

Inventors

손상현
서용준
하상민
서영주
이익호

Assignees

세메스 주식회사

Dates

Publication Date: 20260507
Application Date: 20241029

Claims (10)

In a method for processing a substrate, A step of transmitting a monitoring signal from a first control block connected to a first sensor to a second control block connected to a second sensor; A step of determining whether the second control block is operating normally based on the response to the above monitoring signal; and A substrate processing method comprising the step of determining the output signal of the second sensor based on whether the second control block is operating normally.
In paragraph 1, The step of determining whether the above-mentioned second control block is operating normally is: A substrate processing method comprising the step of determining that the second control block is operating normally based on whether the second control block receives the monitoring signal transmitted by the first control block within a preset time after the first control block transmits the monitoring signal to the second control block.
In paragraph 2, If it is determined that the above second control block is operating abnormally, A substrate processing method further comprising the step of indicating that the second control block above is operating abnormally.
In paragraph 3, A substrate processing method further comprising the step of backing up data of the second control block.
In paragraph 2, The step of determining the output signal of the second sensor is: When the first sensor and the second sensor are of the same type, and it is determined that the second sensor is operating normally, A step of acquiring a first sensing signal of the first sensor; A step of acquiring a second sensing signal of the second sensor; and A substrate processing method comprising the step of synthesizing the first sensing signal and the second sensing signal to obtain the output signal of the second sensor.
In paragraph 2, The step of determining the output signal of the second sensor is: If the first sensor and the second sensor are of the same type, and it is determined that the second sensor is operating abnormally, A step of acquiring a first sensing signal of the first sensor; and A substrate processing method comprising the step of replacing the first sensing signal with the output signal of the second sensor.
In paragraph 2, The step of determining the output signal of the second sensor is: If the first sensor and the second sensor are of different types, and it is determined that the second sensor is operating abnormally, A step of acquiring a first sensing signal of the first sensor; and A substrate processing method comprising the step of inferring the output signal of the second sensor based on the first sensing signal.
In a method for processing a substrate, A step in which a control block generates a reference signal; The control block receives a signal in which the reference signal and the sensing signal acquired by the sensor connected to the control block are combined; and A substrate processing method comprising the step of determining whether the sensor operates normally based on the synthesized signal.
In paragraph 8, If the input port of the above control block is an analog port, the reference signal is an analog signal, and A substrate processing method in which, when the input port of the above-mentioned control block is a digital port, the above-mentioned reference signal is a digital signal.
In paragraph 8, A substrate processing method in which the shape of the reference signal is different from the shape of the sensing signal.

Description

Method of processing substrate and apparatus thereof The present invention relates to a substrate processing method and apparatus, and more specifically, to a substrate processing method and apparatus for detecting whether a module attached to a substrate processing apparatus has failed. As process precision improves in semiconductor chip production, malfunctions and shutdowns caused by equipment issues during the process can affect productivity and lead to astronomical financial losses. Meanwhile, semiconductor equipment is equipped with numerous electronic circuits, and since there are many possible inputs and outputs, it is difficult to detect malfunctions. Furthermore, because failures in circuit modules are typically recognized only after a specific operation fails, there is a problem in that it is difficult to avoid problematic situations caused by malfunctions. When duplicating external input sensors, such as emergency stop buttons, multiple connection ports are used to stop the system when the input results from the multiple ports differ; however, there is a problem in that it is difficult to distinguish whether this situation was caused by the button or by a failure of the corresponding port. Furthermore, for ports transmitting continuous data signals, there is a problem in that it is difficult to detect port failures or no-signal conditions. In the case of analog signals, a specific voltage range is used to verify port connectivity and check if the input signal is operating, but this has the disadvantage of reducing signal measurement resolution. In other words, to ensure the operational stability of semiconductor equipment, it is necessary to have methods for preemptively detecting malfunctions in terms of circuits, sensors, and data signals, as well as methods for appropriately switching the functions of redundant modules. FIG. 1 is a block diagram of a substrate processing apparatus according to one embodiment of the present invention. FIGS. 2 and 3 are conceptual diagrams for explaining a method for transmitting and receiving monitoring signals according to an embodiment of the present invention. FIG. 4 is a flowchart of a substrate processing method according to one embodiment of the present invention. FIG. 5 is a block diagram of a substrate processing apparatus according to another embodiment of the present invention. FIG. 6 is a flowchart of a substrate processing method according to another embodiment of the present invention. FIG. 7 is a conceptual diagram illustrating a substrate processing method according to another embodiment of the present invention. Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in describing preferred embodiments of the present invention in detail, specific descriptions of related known functions or configurations are omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the present invention. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and operations. The term 'comprising' a component means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components. Specifically, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Singular expressions include plural expressions unless the context clearly indicates otherwise. Additionally, the shapes and sizes of elements in drawings may be exaggerated for clearer explanation. Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms may be used for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. Conversely, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. Other expressions describing the relationships between components, such as