KR-20260062518-A - SOLDERING APPARATUS

KR20260062518AKR 20260062518 AKR20260062518 AKR 20260062518AKR-20260062518-A

Abstract

The present invention provides a soldering apparatus. A soldering apparatus according to an exemplary embodiment of the present invention comprises: a chamber including a soldering area where a substrate is positioned and soldered; a light irradiation unit disposed within the chamber and irradiating light toward the soldering area; a first inlet portion disposed on one side of the chamber and connected to a gas supply device, through which gas is introduced into the chamber; an outlet portion disposed on the other side opposite to the one side of the chamber and through which gas inside the chamber is discharged; a second inlet portion disposed between the first inlet portion and the soldering area at the bottom of the chamber and through which gas is introduced into the chamber; and a control device disposed at the second inlet portion and controlling the degree of opening and closing of the second inlet portion.

Inventors

유호현
박정현
유명현
강태규
황재선

Assignees

삼성전자주식회사

Dates

Publication Date: 20260507
Application Date: 20241029

Claims (10)

A chamber including a soldering region where a substrate is positioned and soldered; A light irradiation unit disposed within the chamber and irradiating light toward the soldering area; A first inlet port disposed on one side of the chamber and connected to a gas supply device, through which gas flows into the chamber; An outlet portion disposed on the other side (104) opposite to one side of the chamber, through which gas inside the chamber is discharged; A second inlet portion disposed between the first inlet portion and the soldering area at the bottom of the chamber, through which gas is introduced into the chamber; and A soldering device comprising a control device disposed in the second inlet port and controlling the degree of opening and closing of the second inlet port.
In paragraph 1, A soldering device comprising a second inlet portion formed on the inner lower surface of the chamber and having a first opening having a width greater than or equal to the width of the soldering area in the width direction of the chamber.
In paragraph 1, A soldering device comprising a second inlet port that includes an inlet flow path arranged to vertically penetrate the outer lower surface and the inner lower surface of the chamber.
In paragraph 1, The second inlet section is positioned to penetrate the outer lower surface and the inner lower surface of the chamber and includes an inlet flow path having an inclined or curved shape. A soldering device configured such that the inflow path becomes closer to the soldering area as it moves from the outer lower surface of the chamber to the inner lower surface.
In paragraph 1, A soldering device comprising a control device, a flap disposed to be openable and closable in the second inlet port, and a driving unit connected to the flap and driving the flap to open and close.
In paragraph 5, The above flap is rotatably disposed in the second inlet, and A soldering device comprising a drive unit connected to the rotation axis of the flap and a drive motor that provides rotational force to the flap.
In paragraph 1, It includes a flow sensor that measures the flow rate of the gas discharged through the outlet, A soldering device configured such that the above-mentioned control device controls the degree of opening and closing of the second inlet port according to the flow rate of the gas measured by the above-mentioned flow sensor.
In paragraph 1, The above chamber is a soldering device having an internal space adjacent to the outlet that has a cross-sectional area that gradually decreases toward the outlet.
In paragraph 1, A soldering device comprising a light irradiation unit including a xenon lamp and a light-transmitting cover disposed below the xenon lamp.
A chamber including a soldering region where a substrate is positioned and soldered; A transfer unit for transferring the above substrate to and from the soldering area; A light irradiation unit disposed within the chamber and irradiating light toward the soldering area; A first inlet port disposed on one side of the chamber and connected to a gas supply device, through which gas flows into the chamber; An outlet portion disposed on the other side opposite to one side of the chamber and connected to a gas suction device that sucks in gas inside the chamber, through which the gas inside the chamber is discharged; A second inlet portion disposed between the first inlet portion and the soldering area at the bottom of the chamber, through which gas is introduced into the chamber; A flow sensor for measuring the flow rate of the gas discharged through the above outlet; and A soldering device comprising a control device disposed in the second inlet port and controlling the degree of opening and closing of the second inlet port according to the flow rate of the gas measured by the flow sensor.

Description

Soldering apparatus The present invention relates to a soldering device. Recently, there has been a surge in demand for the miniaturization and high density of electronic components, and these components are mounted on printed circuit boards through a soldering process. To carry out the soldering process, reflow soldering devices that perform the reflow soldering process or soldering devices that perform the soldering process by irradiating light are generally used. Since contaminants such as vaporized flux are generated during the soldering process using these devices, an exhaust system is required to prevent the internal components of the soldering device from being contaminated by these contaminants. FIG. 1 is an exemplary diagram showing a soldering apparatus according to one embodiment of the present invention. FIG. 2 is a planar exemplary diagram showing a soldering apparatus according to one embodiment of the present invention. FIG. 3 is another exemplary diagram showing a soldering apparatus according to one embodiment of the present invention. FIG. 4 is an exemplary diagram showing a soldering apparatus according to another embodiment of the present invention. Hereinafter, preferred embodiments are described in detail with reference to the attached drawings so that those skilled in the art can easily practice the present invention. However, in describing the preferred embodiments of the present invention in detail, if it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the essence of the present invention, such detailed description is omitted. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and operations. Furthermore, in this specification, terms such as "upper" and "lower" are based on the drawings, and in reality, they may vary depending on the direction in which the components are arranged. Additionally, throughout the specification, when a part is described as being 'connected' to another part, this includes not only cases where they are 'directly connected,' but also cases where they are 'indirectly connected' with other components in between. Furthermore, 'including' a component means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. FIG. 1 is an exemplary diagram showing a soldering device according to one embodiment of the present invention, FIG. 2 is a planar exemplary diagram showing a soldering device according to one embodiment of the present invention, and FIG. 3 is another exemplary diagram showing a soldering device according to one embodiment of the present invention. Referring to FIGS. 1 to 3, a soldering device according to an exemplary embodiment of the present invention may include a chamber (100), a light irradiation unit (200), a first inlet unit (300), an outlet unit (400), a second inlet unit (500), and a control device (600). The above chamber (100) may include a soldering area (110) in which a substrate (W) is positioned and soldered. In the soldering area (110), the substrate (W) on which an electronic component (E) is placed can be soldered by solder paste (not shown) through a light irradiation unit (200) to be described later. As shown in FIGS. 1 to 3, the soldering area (110) may be provided as a single unit within the chamber (100), but the present invention is not limited thereto and may be provided as a plurality within the chamber (100) as needed, such as the shape of the light irradiation unit (200) to be described later, the size of the substrate (W), and the arrangement shape of the soldering area (110). In the present invention, the substrate (W) may be a single-array substrate or a continuous-array substrate in which a plurality of columns of single-piece printed circuit boards are arranged. In an exemplary embodiment, the substrate (W) may be a substrate having a single-array structure of 1 column 1 row, 2 columns 1 row, 2 columns 2 rows, 3 columns 1 row, 3 columns 2 rows, 4 columns 2 rows, 6 columns 2 rows, or 9 columns 2 rows. In this embodiment, as shown in FIG. 2, the substrate (W) may have a structure in which six rows of individual printed circuit board sections (UB) are arranged in a continuous sequence along the transfer direction (X) of the transfer section (T) to be described later. In each row of individual printed circuit board sections (UB), one or more individual printed circuit boards may be arranged along the width direction (Y) perpendicular to the transfer direction (X). For example, as shown in FIG. 2, one individual printed circuit board may be arranged along the width direction (Y) perpendicular to the transfer direction (X) in each row of individual printed circuit board sections (UB), but is not limited thereto. Various electronic components (E) may be arranged in each row of individual printed circuit board sections (UB) using solder paste.