KR-20260062537-A - Vapor chamber and method for manufacturing the same

Abstract

The present invention relates to a vapor chamber comprising a metal body having an internal space and a metal foam structure filled in the internal space, wherein a refrigerant circulates in the internal space. According to the present invention, the degree of freedom of shape can be increased to overcome the limitations of the prior art.

Inventors

• 정민군

Assignees

• 현대자동차주식회사
• 기아 주식회사

Dates

Publication Date

20260507

Application Date

20241029

Claims (20)

1. A metal body with an internal space formed; and It includes a metal foam structure filled in the above internal space, Characterized by the circulation of a refrigerant in the above internal space, Vapor chamber.
2. In claim 1, The above metal foam structure is formed by the expansion of a metal foam precursor, and The above metal foam precursor comprises metal powder, a thickener, and a foaming agent, Vapor chamber.
3. In claim 2, Characterized by the diameter of the metal powder being 0.3 mm or less. Vapor chamber.
4. In claim 2, Characterized by the fact that the melting point of the metal constituting the metal powder is lower than the melting point of the metal constituting the metal body. Vapor chamber.
5. In claim 4, The material of the above metal body is copper or a copper alloy, and The material of the above metal powder is characterized as being one or more selected from copper, tin, silicon, germanium, lead, zirconium, titanium, manganese, phosphorus, and silver, or an alloy thereof. Vapor chamber.
6. In claim 4, The material of the above metal body is aluminum or an aluminum alloy, and The material of the above metal powder is characterized as being one or more selected from tin, silicon, zinc, calcium, and copper, or an alloy thereof. Vapor chamber.
7. In claim 2, Characterized by the thickness of the metal body being 0.02mm to 2mm, Vapor chamber.
8. In claim 2, Characterized by having a groove or hole formed, Vapor chamber.
9. In claim 2, Characterized by having a step formed Vapor chamber.
10. In claim 2, Characterized by including a portion with different thickness in the width direction, Vapor chamber.
11. In claim 2, Characterized by having a curved surface Vapor chamber.
12. Metal body; and A metal foam structure bonded to the outer surface of the above metal body and having a refrigerant circulating inside, Vapor chamber.
13. In claim 12, The above metal foam structure is formed by the expansion of a metal foam precursor, and The above metal foam precursor comprises metal powder, a thickener, and a foaming agent, Vapor chamber.
14. In claim 13, Characterized by the fact that the melting point of the metal constituting the metal powder is lower than the melting point of the metal constituting the metal body. Vapor chamber.
15. In claim 13, Characterized by having a groove or hole formed, Vapor chamber.
16. In claim 13, Characterized by having a step formed Vapor chamber.
17. In claim 13, Characterized by including a portion with different thickness in the width direction, Vapor chamber.
18. In claim 13, Characterized by having a curved surface Vapor chamber.
19. Step of inserting a metal foam precursor between metal bodies; A step of placing the metal body into which the above metal foam precursor is inserted into a mold of the shape to be manufactured; The method includes the step of heating and forming a metal body into which the metal foam precursor is inserted, and Characterized by the fact that the metal foam precursor expands to form a metal foam structure through the above-mentioned molding step. Method for manufacturing a vapor chamber.
20. In claim 19, A step of injecting a refrigerant into the metal foam structure after the above-mentioned molding step; and A further step comprising sealing the outer surface of the metal body, Method for manufacturing a vapor chamber.

Description

Vapor chamber and method for manufacturing the same The present invention relates to a vapor chamber for heat dissipation and a method for manufacturing the same. A busbar consists of a rod made of copper or aluminum that forms the electrical connection of a high-power circuit. Since high power is applied, heat is generated not only by the inherent resistance of the busbar but also by the contact resistance of the fastening and joining parts; the resulting temperature increase may lead to reduced reliability of the contact parts and deterioration or burnout of surrounding components. To minimize damage caused by such heat generation, a maximum temperature limit is required, and heat dissipation technology is applied for this purpose. Representative heat dissipation technologies include increasing the heat dissipation capacity by widening the surface area of the busbar, and bringing the busbar into direct contact with the coolant or heatsink. However, increasing the busbar area requires increasing the size of the component to expand the heat dissipation surface, which leads to the problem of heat remaining inside the component, and since heat is dissipated within the box, there is a problem of the internal temperature of the box rising. Direct contact cooling methods have limitations in use due to insulation risks and location/shape when used in high-voltage systems. Meanwhile, as another method for heat dissipation, a spacer is a component positioned in the space between a heat-generating object and a heat sink to provide a mechanical connection. To utilize the heat dissipation effect using spacers, they must come into contact with the heating element; however, since they are manufactured as flat surfaces, height correction using TIM adhesives or similar materials is required in areas with height differences. Currently, research is being conducted on converting spacers into vapor chambers, but issues such as the joint structure and insufficient rigidity of the supporting structure for the space between planar structures remain. Furthermore, warpage is prone to occur due to the high temperature of the chip and the low temperature of the heat dissipation part, requiring a delicate design to prevent thermal deformation and micro-wear of the contact parts. In addition, in the case of conventional vapor chambers, structures such as pipe structures, pillar structures, and mesh structures have been formed to create an internal space. In the case of heat pipe structures, while it is easy to ensure component rigidity, there are severe shape constraints, and if manufactured in a planar form, it is difficult to secure the specific surface area necessary for internal heat diffusion. Since they primarily operate in one direction (influenced by the direction of heat transfer), heat movement is difficult when a reverse gradient is formed; furthermore, three-dimensional structures cannot be formed through machining, and it is difficult to apply heat diffusion structures inside the pipe. In the case of a pillar structure, heat can be transferred from the upper to the lower part; however, since methods (such as welding) to fix the pillar to the upper and lower parts of the chamber as a single unit have not been developed, it is difficult to ensure electrical/thermal contact and mechanical rigidity, and it is difficult to form a three-dimensional structure. In addition, due to structural limitations of the sintered body, it is impossible to manufacture it above a certain height, and it is impossible to manufacture it in a bent or curved structure. The matters described in the background technology above are intended to aid in understanding the background of the invention and may include matters that are not prior art already known to those skilled in the art to which this technology belongs. Figure 1 schematically illustrates the structure of the vapor chamber of the present invention. Figure 2 illustrates the principle of forming a three-dimensional structure of the vapor chamber of the present invention. Figure 3 shows the process of change of the metal foam structure of the vapor chamber of the present invention. FIGS. 4 to 6 illustrate embodiments of the vapor chamber of the present invention. FIGS. 7 and FIGS. 8 illustrate embodiments of the vapor chamber integrated busbar of the present invention. In order to fully understand the present invention, the operational advantages of the present invention, and the objectives achieved by the implementation of the present invention, reference must be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described therein. In describing preferred embodiments of the present invention, known technologies or repetitive descriptions that may unnecessarily obscure the essence of the invention will be shortened or omitted. FIG. 1 schematically illustrates the structure of the vapor chamber of the present invention, and FIG. 2 il