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KR-20260062587-A - MULTILAYER ELECTRONIC COMPONENT

KR20260062587AKR 20260062587 AKR20260062587 AKR 20260062587AKR-20260062587-A

Abstract

A body comprising a dielectric layer having one of SrTiO3 and TiO2 as a main component, wherein at least one of the elemental sites excluding the oxygen element (O) is substituted with a donor element, and an internal electrode alternately disposed with the dielectric layer in a first direction; and an external electrode disposed on the body; wherein the dielectric layer comprises a plurality of dielectric crystal grains, a grain boundary disposed between the adjacent dielectric crystal grains, an n-midpoint disposed at a point where three or more of the grain boundaries meet, a first metal oxide disposed at the n-midpoint, and a second metal oxide disposed at the grain boundary, and the atomic percentage of the first metal element contained in the first metal oxide may be higher than the atomic percentage of the second metal element contained in the second metal oxide.

Inventors

  • 김범수
  • 지재훈
  • 이은영
  • 강승훈
  • 김도훈
  • 이경렬

Assignees

  • 삼성전기주식회사

Dates

Publication Date
20260507
Application Date
20241029

Claims (11)

  1. A body comprising a dielectric layer having as its main component one of SrTiO3 and TiO2 , wherein at least one of the elemental sites excluding the oxygen element (O) is substituted with a donor element, and internal electrodes alternately arranged with the dielectric layer in a first direction; and Includes an external electrode disposed on the above body; and The dielectric layer comprises a plurality of dielectric grains, grain boundaries disposed between adjacent dielectric grains, an n-midpoint disposed at a point where three or more grain boundaries meet, a first metal oxide disposed at the n-midpoint, and a second metal oxide disposed at the grain boundaries. The atomic percentage of the first metal element contained in the first metal oxide is higher than the atomic percentage of the second metal element contained in the second metal oxide. Stacked electronic components.
  2. In paragraph 1, The above donor element comprises at least one of Nb, Ta, Sb, Mo, and V. Stacked electronic components.
  3. In paragraph 1, The content of the above-mentioned substituted donor element is greater than 0 mol% and less than or equal to 2 mol% Stacked electronic components.
  4. In paragraph 1, At least one of the above SrTiO3 and TiO2 is further substituted with an acceptor element at at least one of the elemental sites excluding the oxygen element (O). Stacked electronic components.
  5. In paragraph 4, The above acceptor element comprises at least one of Al, Ga, Mg, Zn, Sc, In, Yb, Er, and Eu. Stacked electronic components.
  6. In paragraph 4, The content of the above-mentioned substituted acceptor element is greater than 0 mol% and less than or equal to 1 mol% Stacked electronic components.
  7. In paragraph 4, The total content of the above-mentioned substituted donor and acceptor elements is greater than 0 mol% and less than or equal to 2 mol% Stacked electronic components.
  8. In paragraph 4, The ratio of the substituted donor element to the acceptor element is 1:1 to 2:1. Stacked electronic components.
  9. In paragraph 1, The difference between the atomic percentage of the first metal element contained in the first metal oxide and the atomic percentage of the second metal element contained in the second metal oxide is 10 at% or more. Stacked electronic components.
  10. In paragraph 1, The atomic percentage of the first metal element contained in the first metal oxide is 70 at% or more, and the atomic percentage of the second metal element contained in the second metal oxide is less than 30 at%. Stacked electronic components.
  11. In paragraph 1, The first metal element included in the first metal oxide and the second metal element included in the second metal oxide comprise at least one selected from the group consisting of Si, Al, Nb, Ta, Mo, V, Mg, In, Sn, Cu, Ni, Cr, Mn, Sb, Ga, and Ti. Stacked electronic components.

Description

Multilayer Electronic Components The present invention relates to a stacked electronic component. A Multi-Layered Ceramic Capacitor (MLCC), a type of multilayer electronic component, is a chip-shaped capacitor mounted on the printed circuit boards of various electronic products—such as video devices like Liquid Crystal Displays (LCDs) and Plasma Display Panels (PDPs), computers, smartphones, and mobile phones—that serves to charge or discharge electricity. These multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being compact, guaranteeing high capacitance, and being easy to mount. As various electronic devices, such as computers and mobile devices, become smaller and more powerful, the demand for miniaturization and high capacitance in multilayer ceramic capacitors is increasing. Research on new high-dielectric constant materials is being conducted due to the limitations of dielectric constant and thinning of currently commercialized barium titanate ( BaTiO3 ) dielectric materials. As candidates for such new high dielectric constant materials, examples include materials in which donor elements or acceptor elements are doped, dissolved, or substituted into strontium titanate ( SrTiO3 ) or titanium dioxide ( TiO2 ), but there are problems such as defects such as high dielectric loss and low resistivity due to doping. FIG. 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. Figure 2 schematically illustrates an exploded view showing the stacked structure of the internal electrode. Figure 3 schematically illustrates a cross-sectional view along I-I' of Figure 1. Figure 4 schematically illustrates a cross-sectional view according to II-II' of Figure 1. FIG. 5 schematically illustrates a cross-sectional view according to II-II' of FIG. 1 according to another embodiment of the present invention. Figure 6 schematically illustrates an enlarged view of the P area of Figure 3. Embodiments of the present invention will be described below with reference to specific embodiments and the attached drawings. However, embodiments of the present invention may be modified in various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements. Furthermore, in order to clearly explain the invention in the drawings, parts unrelated to the explanation are omitted, and the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation; thus, the invention is not necessarily limited to what is illustrated. Additionally, components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. In the drawing, the first direction may be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction. Stacked typeelectronic components FIG. 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. Figure 2 schematically illustrates an exploded view showing the stacked structure of the internal electrode. Figure 3 schematically illustrates a cross-sectional view along I-I' of Figure 1. Figure 4 schematically illustrates a cross-sectional view according to II-II' of Figure 1. FIG. 5 schematically illustrates a cross-sectional view according to II-II’ of FIG. 1 according to another embodiment of the present invention. Figure 6 schematically illustrates an enlarged view of the P area of Figure 3. Hereinafter, a stacked electronic component according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 6. However, although a stacked ceramic capacitor is described as an example of a stacked electronic component, the present invention may also be applied to various electronic products using dielectric compositions, such as inductors, piezoelectric elements, varistors, or thermistors. A stacked electronic component (100) according to one embodiment of the present invention comprises: a body (110) comprising a dielectric layer (111) having one of SrTiO3 and TiO2 as a main component, wherein a donor element is substituted in at least one of the elemental sites excluding an oxygen element (O), and internal