KR-20260062671-A - POLISHING APPARATUS INCLUDING A MOVABLE DAMPER

KR20260062671AKR 20260062671 AKR20260062671 AKR 20260062671AKR-20260062671-A

Abstract

A grinding device comprising a spindle having a grinder wheel at its lower end; a housing surrounding the spindle; and a movable damper; wherein the movable damper comprises a lower bracket provided between the circumference of the spindle and the inner circumference of the housing through which the spindle passes, an upper bracket provided above the lower bracket and spaced vertically from the lower bracket, and a first damper structure provided between the upper bracket and the lower bracket and between the spindle and the housing, configured to move along the lower bracket, wherein the first damper structure comprises a damper plate including an inner plate adjacent to the spindle and an outer plate adjacent to the inner circumference of the housing, an elastic part provided between the inner plate and the outer plate, and a variable part provided between the inner plate and the outer plate, wherein the variable part is configured to expand or contract.

Inventors

김경열
김좌현
조봉수
김현태

Assignees

삼성전자주식회사

Dates

Publication Date: 20260507
Application Date: 20241029

Claims (20)

A spindle equipped with a grinder wheel at the bottom; A housing surrounding the spindle; and Includes a movable damper; and The above-mentioned movable damper is, A lower bracket provided between the circumference of the spindle and the inner circumference of the housing, through which the spindle passes. An upper bracket spaced vertically apart from the lower bracket and provided above the lower bracket, and It includes a first damper structure provided between the upper bracket and the lower bracket and between the spindle and the housing, and configured to move along the lower bracket, The first damper structure comprises a damper plate including an inner plate adjacent to the spindle and an outer plate adjacent to the inner perimeter of the housing, an elastic member provided between the inner plate and the outer plate, and a variable member provided between the inner plate and the outer plate. A grinding device comprising a movable damper characterized in that the above-mentioned variable part is configured to expand or contract.
In Article 1, A grinding device comprising a movable damper, characterized in that when the variable part expands, the damper plate contacts the spindle and the housing, and when the variable part contracts, the damper plate is spaced apart from the spindle and the housing.
In Article 1, A grinding device comprising a movable damper characterized in that the first damper structure moves together with the upper bracket between the spindle and the housing according to the rotation of the upper bracket.
In Article 1, A grinding device comprising a movable damper, characterized in that when the variable part expands, the variable part provides a grounding force between the inner plate and the spindle and a grounding force between the outer plate and the housing, and the elastic part provides a restoring force between the inner plate and the outer plate to restore the distance separated between the inner plate and the outer plate.
In Article 1, A grinding device including a movable damper, characterized in that when the variable part expands and the damper plate contacts the spindle and the housing, the expansion force applied by the variable part between the inner plate and the outer plate is greater than the contraction force applied by the elastic part between the inner plate and the outer plate.
In Article 1, The first damper structure includes an upper linear movement device, a lower linear movement device, and a guide rail, and The guide rail is provided on the lower bracket so that the first damper structure moves along the lower bracket relative to the lower bracket, and A grinding device comprising a movable damper, wherein the upper linear moving device and the lower linear moving device are respectively provided at the upper and lower portions of the inner plate and the outer plate so as to allow the inner plate and the outer plate to move between the spindle and the housing.
In Article 6, A grinding device comprising a movable damper, characterized in that a lower linear moving device provided at the lower portion of the inner plate and the outer plate is provided on the guide rail.
In Article 1, A grinding device comprising a movable damper characterized by having a plurality of first damper structures symmetrically arranged with respect to the center of the spindle between the upper bracket and the lower bracket.
In Article 1, A fluid line connected to the above variable part is provided on the upper bracket, and the fluid supplied to the above variable part is a gas, and A grinding device comprising a movable damper characterized in that the above variable part expands by being pressurized by the fluid line or contracts by being depressurized by the fluid line.
In Article 1, It further includes a driving device and a rotary joint, The driving device is configured to provide power to the upper bracket so that the upper bracket rotates relative to the lower bracket, and The above rotary joint is provided between the driving device and the upper bracket, and A grinding device including a movable damper characterized in that a fluid line is extended through the above-mentioned rotary joint and the fluid line is connected to the above-mentioned variable part.
In Article 10, At least one vibration sensor provided in the housing or a separate outer wall for measuring the vibration of the spindle; and A control unit that receives vibration measurement results from the vibration sensor and controls the driving device and the variable part; further comprising A grinding device including a movable damper, characterized in that the control unit controls the driving device to move the first damper structure based on the vibration measurement results of the vibration sensor.
In Article 1, It further includes a second damper structure spaced apart from the first damper structure, which is provided between the upper bracket and the lower bracket and between the spindle and the housing, configured to move along the lower bracket, and A grinding device comprising a movable damper characterized in that the second damper structure moves separately from the first damper structure.
In Article 1, The inner plate above matches a part of the shape of the circumference of the spindle, and A grinding device comprising a movable damper characterized in that the outer plate matches a part of the shape of the inner perimeter of the housing.
In Article 1, Both ends of the above variable part are provided at the center of the inner plate and the center of the outer plate, respectively, and The above elastic part is spaced apart from the above variable part, and A grinding device comprising a movable damper characterized in that the elastic part is symmetrically arranged between the inner plate and the outer plate with respect to the variable part.
An upper bracket provided above a spindle equipped with a grinder wheel at the bottom, It includes a first damper structure provided between the spindle and the housing surrounding the spindle, and provided on the lower surface of the upper bracket. The first damper structure comprises a damper plate including an inner plate adjacent to the spindle and an outer plate adjacent to the inner perimeter of the housing, A variable portion provided between the inner plate and the outer plate, and It includes an elastic member spaced apart from the variable part and provided between the inner plate and the outer plate, The planar shape of the above spindle is a circle, and The first damper structure moves between the spindle and the housing according to the rotation of the upper bracket, and The above variable part is configured to expand or contract, and A grinding device comprising a movable damper characterized in that when the variable part expands, the inner plate and the outer plate of the variable part contact the spindle and the housing, respectively.
In Article 15, A grinding device comprising a movable damper, characterized in that when the variable part expands and the inner plate and the outer plate each come into contact with the spindle and the housing, the expansion force applied by the variable part between the inner plate and the outer plate is greater than the contraction force applied by the elastic part between the inner plate and the outer plate.
In Article 15, The above-mentioned first damper structure is provided in multiple numbers, and A grinding device comprising a movable damper characterized in that the first damper structure is arranged at equal intervals based on the first center of the planar shape of the spindle.
In Article 15, It further includes a driving device and a rotary joint, The driving device is configured to provide power to the upper bracket so that the upper bracket rotates relative to the housing, and The above rotary joint is provided between the driving device and the upper bracket, and A grinding device including a movable damper, characterized in that the rotary joint is configured so as not to be affected by the rotational movement of the upper bracket by the driving device, and a fluid line extends through the rotary joint and is connected to the variable part.
In Article 15, The inner plate above matches a part of the circumferential shape of the spindle, and A grinding device comprising a movable damper characterized in that the outer plate matches a part of the shape of the inner perimeter of the housing.
A spindle equipped with a grinder at the bottom; A housing surrounding the spindle; and Includes a movable damper; and The above-mentioned movable damper is, A lower bracket through which the spindle passes, and which is provided between the circumference of the spindle and the inner circumference of the housing, An upper bracket spaced vertically from the lower bracket and provided above the lower bracket, A first damper structure provided between the upper bracket and the lower bracket and between the spindle and the housing, configured to move along the planar shape of the lower bracket, A driving device that provides power to the upper bracket to provide rotation so that the upper bracket rotates relative to the lower bracket, and Provided between the above driving device and the above upper bracket, and further includes a rotational joint, The first damper structure comprises a damper plate including an inner plate adjacent to the spindle and an outer plate adjacent to the inner perimeter of the housing, a variable part provided between the inner plate and the outer plate, an elastic part provided between the inner plate and the outer plate, an upper linear movement device, a lower linear movement device, a guide rail, and a fluid line connected to the variable part. The first damper structure is configured to move together with the upper bracket between the spindle and the housing according to the rotation of the upper bracket, and The above variable part is configured to expand or contract, and The guide rail is provided on the lower bracket so that the first damper structure moves along the shape of the lower bracket with respect to the lower bracket, and The upper linear movement device and the lower linear movement device are respectively provided on the upper and lower portions of the inner plate and the outer plate so that the inner plate and the outer plate move between the spindle and the housing, and the lower linear movement device is provided on the guide rail. The above fluid line is connected to the above variable part via the above rotary joint, and The inner plate corresponds to a part of the circumferential shape of the spindle, and the outer plate corresponds to a part of the inner circumferential shape of the housing. The two ends of the variable part are respectively provided at the center of the inner plate and the center of the outer plate, and the elastic part is spaced apart from the variable part and arranged symmetrically with respect to the variable part. When the variable part expands, the damper plate contacts the spindle and the housing, and when the variable part contracts, the damper plate is separated from the spindle and the housing. When the above variable part expands, the above variable part provides a contact force between the inner plate and the spindle, and between the outer plate and the housing, and When the variable part expands and the damper plate comes into contact with the spindle and the housing, the expansion force applied by the variable part between the damper plates is greater than the contraction force applied by the elastic part between the damper plates, and A grinding device comprising a movable damper characterized in that the variable part and the elastic part dampen the relative movement of the outer plate and the inner plate.

Description

Polishing apparatus including a movable damper The technical concept of the present invention relates to a grinding device including a movable damper. Chemical Mechanical Polishing (CMP) is a process of polishing the surface of a substrate by rotating it relative to a grinding wheel between the substrate, such as a wafer for semiconductor fabrication, which is equipped with a polishing layer. The chemical mechanical polishing process is a process of flattening the polished surface of a substrate by pressing the substrate to be polished against a rotating chuck, rotating the substrate while applying pressure, and simultaneously supplying a slurry that induces chemical polishing to the substrate. During chemical mechanical polishing, the grinding wheel located at the bottom of the spindle rotates while the substrate comes into continuous contact with it; consequently, vibrations caused by the polishing process may occur in the spindle. These spindle vibrations can affect the polishing quality of the substrate being polished. For example, spindle vibrations may cause variations in substrate thickness at specific locations after the polishing process. FIG. 1 is a simplified perspective view of a grinding device including a movable damper according to exemplary embodiments of the present invention. FIG. 2a is a cross-sectional view showing a grinding device including a movable damper according to exemplary embodiments of the present invention. FIG. 2b is a cross-sectional view showing the AA' portion of a grinding device including a movable damper according to exemplary embodiments of the present invention of FIG. 2a. FIG. 3a is a cross-sectional view showing a grinding device including a movable damper according to exemplary embodiments of the present invention. FIG. 3b is a cross-sectional view showing the BB' portion of a grinding device including a movable damper according to exemplary embodiments of the present invention of FIG. 3a. FIGS. 4a to 4c are cross-sectional views illustrating the operation of a grinding device including a movable damper according to exemplary embodiments of the present invention. FIG. 5 is a cross-sectional view showing a section like the AA' portion of FIG. 2a cut from a grinding device including a movable damper according to exemplary embodiments of the present invention. FIG. 6a is a cross-sectional view showing a grinding device including a movable damper according to exemplary embodiments of the present invention. FIG. 6b is a top view of a grinding device including a movable damper according to exemplary embodiments of the present invention. FIG. 6c is a plan view illustrating the operation of a grinding device including a movable damper according to exemplary embodiments of the present invention. FIG. 7 is a cross-sectional view showing a grinding device including a movable damper according to exemplary embodiments of the present invention. Hereinafter, embodiments of the technical concept of the present disclosure will be described in detail with reference to the attached drawings. Embodiments of the technical concept of the present invention are provided to more completely explain the technical concept of the present invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the technical concept of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to make the present disclosure more faithful and complete and to fully convey the technical concept of the present invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of explanation. In this specification, the first direction refers to the X direction and the second direction refers to the Y direction, and the first direction and the second direction may be perpendicular. The third direction is the Z direction, and the third direction may be perpendicular to the first direction and the second direction, respectively. The horizontal plane or plane refers to the X-Y plane. The upper surface of a specific object refers to a surface located in the positive third direction relative to the specific object, and the lower surface of a specific object refers to a surface located in the negative third direction relative to the specific object. FIG. 1 is a simplified perspective view of a polishing device (1) including a movable damper according to exemplary embodiments of the present invention. FIG. 2a is a cross-sectional view of a polishing device (1) including a movable damper according to exemplary embodiments of the present invention. FIG. 2b is a cross-sectional view taken along the A-A' portion of the polishing device (1) including a movable damper according to exemplary embodiments of the present invention shown in FIG. 2a. FIG. 3a is a cross-sectional view of a polishing device (1) including a movable damper ac