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KR-20260062728-A - PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME, DISPLAY DEVICE AND MANUFACTURING METHOD OF PHOTOSENSITIVE RESIN LAYER

KR20260062728AKR 20260062728 AKR20260062728 AKR 20260062728AKR-20260062728-A

Abstract

(A) a polymer resin comprising repeating units represented by the following chemical formula 1; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; and (D) a solvent; a photosensitive resin film prepared using the same; a display device comprising the photosensitive resin film; and a method for manufacturing the photosensitive resin film are provided. [Chemical Formula 1] (In the above Chemical Formula 1, each substituent is as defined in the specification.)

Inventors

  • 문희조
  • 서광원
  • 박백성
  • 박수빈
  • 김익진

Assignees

  • 삼성에스디아이 주식회사

Dates

Publication Date
20260507
Application Date
20241029

Claims (14)

  1. (A) A polymer resin comprising repeating units represented by the following chemical formula 1; (B) Photopolymerizable monomer; (C) Photopolymerization initiator; and (D) Solvent A photosensitive resin composition comprising: [Chemical Formula 1] In the above chemical formula 1, R a is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C6 to C20 aryl group, Se, a substituted or unsubstituted amine group, a substituted or unsubstituted sulfide group, or a combination thereof, and L a , L b, and L e are each independently NH, S, or Se, and L c and L d are each independently substituted or unsubstituted C6 to C20 arylene groups.
  2. In paragraph 1, The repeating unit represented by the above Chemical Formula 1 is a photosensitive resin composition represented by the following Chemical Formula 2 or Chemical Formula 3: [Chemical Formula 2] [Chemical Formula 3] In the above chemical formulas 2 and 3, L1 and L2 are each independently NH, S, or Se, and L 5 and L 8 are independently NH or S, respectively, and L3 , L4 , L6 , L7 , and L9 are each independently substituted or unsubstituted C6 to C20 arylene groups, and R1 and R2 are each independently a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C6 to C20 aryl group.
  3. In paragraph 2, The above L1 and L2 are different photosensitive resin compositions.
  4. In paragraph 2, The above L3 , L4 , L6 , L7 , and L9 are identical photosensitive resin compositions.
  5. In paragraph 2, A photosensitive resin composition in which the repeating unit represented by Chemical Formula 2 above is represented by Chemical Formula 2-1 or Chemical Formula 2-2 below, and the repeating unit represented by Chemical Formula 3 above is represented by Chemical Formula 3-1 below. [Chemical Formula 2-1] [Chemical Formula 2-2] [Chemical Formula 3-1]
  6. In paragraph 1, The above polymer resin is a photosensitive resin composition comprising 10% to 30% by weight based on the total amount of the photosensitive resin composition.
  7. In paragraph 1, The above polymer resin is a photosensitive resin composition having a weight-average molecular weight of 2,000 g/mol to 30,000 g/mol.
  8. In paragraph 1, The above photosensitive resin composition is, with respect to the total amount of the above photosensitive resin composition 10% to 30% by weight of the above (A) polymer resin; 3% to 15% by weight of the above (B) photopolymerizable monomer; 0.1% to 5% by weight of the above (C) photopolymerization initiator; and Residual amount of the above (D) solvent A photosensitive resin composition comprising
  9. In paragraph 1, The above polymer resin is a photosensitive resin composition having a refractive index of 1.75 or higher.
  10. In paragraph 1, The above polymer resin is a photosensitive resin composition having a transmittance of 90% or more at 400 nm to 700 nm.
  11. A photosensitive resin film manufactured using a photosensitive resin composition of any one of claims 1 to 10.
  12. A display device comprising the photosensitive resin film of claim 11.
  13. In Paragraph 12, The above display device includes an OLED substrate deposited on a silicon wafer and a color filter layer located on the OLED substrate that converts white light generated from the OLED substrate into a plurality of color lights. A photosensitive resin film of claim 13 is positioned on the above-mentioned OLED substrate and color filter layer, and The above color filter layer is a micro OLED display device comprising a red color filter, a green color filter, and a blue color filter.
  14. A step of applying a photosensitive resin composition according to any one of claims 1 to 10; A step of pre-baking at a temperature of 100℃ or lower after the above application; The step of exposing to an i-line after the above prebaking and developing stage A method for manufacturing a photosensitive resin film including

Description

Photosensitive resin composition, photosensitive resin layer using the same, display device and method of manufacturing a photosensitive resin layer The present invention relates to a photosensitive resin composition, a photosensitive resin film using the same, a display device, and a method for manufacturing the photosensitive resin film. Recently, interest in self-emissive micro OLED display panels, which emit light on their own, is growing as a display panel applied to VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality) devices. In the case of micro OLED display panels, which have pixel sizes about 10 times smaller than those of standard OLED display panels, it is difficult to precisely form red (R), green (G), and blue (B) light-emitting layers using existing FMM (Fine Metal Mask) technology. In other words, it is difficult to increase the resolution when applying conventional liquid crystal displays to devices such as VR and AR because the pattern size of the color filter is too large. Consequently, OLEDos (OLED on Silicon) technology is being introduced recently to achieve high resolutions of over 4,000 ppi. This technology utilizes OLEDs deposited on a silicon wafer as a backlight to pattern color filters on top. While color filters used in conventional liquid crystal displays involve patterns of approximately 100 µm deposited on glass and undergo curing processes involving photolithography and post-baking at temperatures exceeding 230°C, color filters placed on OLEDos cannot undergo high-temperature processing due to the presence of OLEDs. Therefore, low-temperature curing is essential, and fine patterning is crucial for increasing resolution. Given the small size of VR and AR devices, fine patterning is indispensable for achieving the desired resolution within such confined spaces. However, since curing proceeds only at low temperatures (below 100℃), color filters made from existing materials have the problem of lacking developability and patternability. Therefore, research is continuing on transparent materials capable of low-temperature curing that possess excellent developability and fine patternability, as well as color filter adhesion. FIG. 1 is a schematic diagram showing the structure of a micro OLED display device according to one embodiment. Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples and are not intended to limit the present invention, and the present invention is defined only by the scope of the claims set forth below. Unless otherwise specifically stated in this specification, "alkyl group" means a C1 to C20 alkyl group, "alkenyl group" means a C2 to C20 alkenyl group, "cycloalkenyl group" means a C3 to C20 cycloalkenyl group, "heterocycloalkenyl group" means a C3 to C20 heterocycloalkenyl group, "aryl group" means a C6 to C20 aryl group, "arylalkyl group" means a C6 to C20 arylalkyl group, "alkylene group" means a C1 to C20 alkylene group, "arylene group" means a C6 to C20 arylene group, "alkylarylene group" means a C6 to C20 alkylarylene group, "heteroarylene group" means a C3 to C20 heteroarylene group, and "alkoxylene group" means a C1 to It refers to the C20 alkoxylene group. Unless specifically stated in this specification, "substitution" means that at least one hydrogen atom is a halogen atom (F, Cl, Br, I), a hydroxyl group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkinyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, C2 to It means substituted with a C20 heterocycloalkynyl group, a C3 to C20 heteroaryl group, or a combination thereof. Additionally, unless otherwise specifically stated in this specification, "hetero" means that the chemical formula contains at least one heteroatom among N, O, S, and P. Additionally, unless otherwise specifically stated in this specification, "(meth)acrylate" means that both "acrylate" and "methacrylate" are possible, and "(meth)acrylic acid" means that both "acrylic acid" and "methacrylic acid" are possible. Unless otherwise defined in this specification, "combination" means mixing or copolymerization. Additionally, "copolymerization" means block copolymerization to random copolymerization, and "copolymer" means block copolymerization to random copolymerization. Unless otherwise defined in the chemical formulas within this specification, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means t