KR-20260062759-A - CIRCUIT BOARD AND ELETRONIC DEVICE INCLUDING STRUCTURE FOR SHARING POWER MODULATOR

Abstract

An electronic device is disclosed comprising at least one communication circuit including a first transmission path and a second transmission path, a transceiver electrically connected to the at least one communication circuit, at least one processor electrically connected to the transceiver, and a power modulator configured to supply power to a first power amplifier (PA) of the first transmission path or a second PA of the second transmission path. The power modulator may be electrically connected to the first PA through a first feed path connected between a first point and the first PA. The power modulator may be electrically connected to the second PA through a second feed path branched from the first point and connected to the second PA. The first feed path may include a first inductor connected between the first point and the first PA. The second feed path may include a second inductor connected between the second point and the second PA.

Inventors

• 이유성
• 양동일
• 문요한
• 나효석

Assignees

• 삼성전자주식회사

Dates

Publication Date

20260507

Application Date

20241122

Priority Date

20241029

Claims (20)

1. In an electronic device (10; 900), At least one communication circuit (190a, 190b) including a first transmission path (501) and a second transmission path (502); A transceiver (190c) electrically connected to at least one communication circuit; At least one processor (120; 910) electrically connected to the above transceiver; and It includes a power modulator (520) configured to supply power to the first PA (power amplifier, 511) of the first transmission path or the second PA (512) of the second transmission path, and The above power modulator is electrically connected to the first PA through a first power supply path (521) connected between the first point (P1) and the first PA, and The power modulator is electrically connected to the second PA through a second power supply path (522) that branches off from the first point and is connected to the second PA, and The first power supply path includes a first inductor (601) connected between the first point and the first PA, and The electronic device, wherein the second power supply path includes a second inductor (602) connected between the second point and the second PA.
2. In Article 1, The first power supply path (521) is shorter than the second power supply path (522), and An electronic device in which the second inductance of the second inductor (602) is lower than the first inductance of the first inductor (601).
3. In Article 2, An electronic device in which the second inductance is set based on an inductance component associated with the length of the second feed path.
4. In Article 1, The above power modulator is: A first feedback path (541) branched from a second point (P2) between the first inductor and the first PA, or An electronic device connected to a second feedback path (542) branched from a third point (P3) between the second inductor and the second PA.
5. In Article 4, An electronic device further comprising a switch (750b) configured to selectively connect the first feedback path or the second feedback path to the power modulator.
6. In Article 4, The electronic device comprising a switching circuit (750a) configured to selectively connect the first feedback path or the second feedback path to the power modulator.
7. In Article 4, The above power modulator is: The first power supplied to the first PA through the first feedback path, or An electronic device configured to monitor the second power supplied to the second PA through the second feedback path.
8. In Article 4, The above power modulator is an electronic device configured to supply power to the first PA or the second PA based on APT (average power tracking).
9. In Article 8, The above power modulator is an electronic device comprising a DCDC (direct current-direct current) switching-based buck-boost converter.
10. In Article 1, It further includes a printed circuit board, The first power supply path comprises at least one first conductive pattern formed on the printed circuit board (at), and The electronic device, wherein the second power supply path comprises at least one second conductive pattern formed on the printed circuit board.
11. In circuit boards, At least one communication circuit (190a, 190b) including a first transmission path (501) and a second transmission path (502); and It includes a power modulator (520) configured to supply power to the first PA (power amplifier, 511) of the first transmission path or the second PA (512) of the second transmission path, and The above power modulator is electrically connected to the first PA through a first power supply path (521) connected between the first point (P1) and the first PA, and The power modulator is electrically connected to the second PA through a second power supply path (522) that branches off from the first point and is connected to the second PA, and The first power supply path includes a first inductor (601) connected between the first point and the first PA, and The above second power supply path is a circuit board including a second inductor (602) connected between the second point and the second PA.
12. In Article 11, The first power supply path (521) is shorter than the second power supply path (522), and A circuit board in which the second inductance of the second inductor (602) is lower than the first inductance of the first inductor (601).
13. In Article 12, A circuit board in which the second inductance is set based on an inductance component associated with the length of the second feed path.
14. In Article 11, The above power modulator is: A first feedback path (541) branched from a second point (P2) between the first inductor and the first PA, or A circuit board connected to a second feedback path (542) branched from a third point (P3) between the second inductor and the second PA.
15. In Article 14, A circuit board further comprising a switch (750b) configured to selectively connect the first feedback path or the second feedback path to the power modulator.
16. In Article 14, A circuit board comprising a switching circuit (750a) configured to selectively connect the first feedback path or the second feedback path to the power modulator.
17. In Article 14, The above power modulator is: The first power supplied to the first PA through the first feedback path, or A circuit board configured to monitor the second power supplied to the second PA through the second feedback path.
18. In Article 14, A circuit board configured such that the power modulator is configured to supply power to the first PA or the second PA based on APT (average power tracking).
19. In Article 18, The above power modulator is a circuit board comprising a DCDC (direct current-direct current) switching-based buck-boost converter.
20. In Article 11, The above first power supply path includes at least one first conductive pattern formed on the circuit board (at), and The circuit board, wherein the second power supply path comprises at least one second conductive pattern formed on the circuit board.

Description

Circuit board and electronic device including structure for sharing power modulator The embodiments disclosed in this document relate to a power modulator sharing structure and a circuit board and an electronic device including the power modulator sharing structure. The electronic device may support various wireless communications (e.g., cellular communications such as LTE (long-term evolution) and/or NR (new radio)). The electronic device may include a wireless communication circuit (e.g., a transmission module) for transmitting wireless signals. For example, the wireless communication circuit may include a radio frequency (RF) component, such as a power amplifier (PA), for amplifying the signal to be transmitted. The electronic device may be configured to control the transmission power of the wireless signal by controlling the driving voltage of the power amplifier. To control the transmission power of the wireless signal, the electronic device may track the transmission power based on various methods. For example, the electronic device may control the driving voltage of the power amplifier based on envelope tracking (ET) or average power tracking (APT). With the development of radio access technology (RAT), electronic devices may include multiple radio communication circuits to support multiple frequency bands. For example, an electronic device may include multiple radio frequency integrated circuits (RFICs). To control the power of the power amplifiers of the multiple radio communication circuits, the electronic device may include multiple power modulators. If the electronic device supports dual connectivity, the number of power modulators required may increase in order to simultaneously supply power to the multiple radio communication circuits. For example, according to the 3GPP (3rd generation partnership project) 5th generation mobile communication NSA (non-standalone) method, simultaneous support for 4th generation mobile communication RAT and 5th generation mobile communication RAT may be required. Electronic devices can be connected to a network according to the EN-DC (E-UTRAN NR (new radio)-dual connectivity) method. Here, E-UTRAN refers to evolved-UTRAN, and UTRAN may refer to the UMTS (universal mobile telecommunication system) radio access network. In the case of EN-DC, an LTE (long term evolution) base station with an EPC (evolved packet core) as the core network can operate as the master base station (e.g., master eNB (eNodeB)) of the electronic device. In this case, the LTE base station can anchor the signaling of the control plane to the electronic device. A 5th generation NR (new radio) base station can operate as a secondary base station (e.g., secondary gNB (gNodeB)) for an electronic device. The NR base station can transmit and receive user plane data to and from the electronic device through a secondary cell group (SCG). As another example, the electronic device can be connected to a network according to the NE-DC (NR E-UTRAN dual connectivity) method. In this case, the NR base station can operate as a master gNB, and the LTE base station can operate as a secondary eNB. The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure. FIG. 1 illustrates a network environment of an electronic device according to one embodiment. FIG. 2 illustrates a block diagram of an electronic device according to one embodiment. FIG. 3 illustrates the antenna structure of an electronic device according to one embodiment. FIG. 4 illustrates the structure of a communication circuit of an electronic device according to one embodiment. FIG. 5 illustrates a power supply structure of an electronic device according to one embodiment. FIG. 6 illustrates a power supply structure including inductors of an electronic device according to one embodiment. FIGS. 7A and 7B illustrate power supply structures including feedback paths of an electronic device according to one embodiment. FIG. 8 illustrates a supply voltage according to a power supply structure according to one embodiment. FIG. 9 is a block diagram of an exemplary electronic device capable of performing the operations described in this document. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments and should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present invention. FIG. 1 illustrates a network environment of an electronic device according to one embodiment. Referring to FIG. 1, according to one embodiment, the e