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KR-20260062779-A - Multilayer circuit board and manufacturing method thereof, and electronic apparatus including the same

KR20260062779AKR 20260062779 AKR20260062779 AKR 20260062779AKR-20260062779-A

Abstract

The present invention provides a multilayer circuit board capable of reducing the number of processes and manufacturing costs by using single-sided FCCL and RCC, a method for manufacturing the same, and an electronic device including the multilayer circuit board. The multilayer circuit board comprises: a core layer; a second circuit layer formed on a first surface of the core layer; a first interlayer insulating layer covering the second circuit layer; a first circuit layer formed on the first interlayer insulating layer; a second interlayer insulating layer formed on a second surface of the core layer; and a third circuit layer formed on the second interlayer insulating layer.

Inventors

  • 손동은
  • 박효진
  • 이정식

Assignees

  • 스템코 주식회사

Dates

Publication Date
20260507
Application Date
20250131
Priority Date
20241029

Claims (20)

  1. Core layer; A second circuit layer formed on the first surface of the core layer; A first interlayer insulating layer covering the second circuit layer; A first circuit layer formed on the first interlayer insulating layer; A second interlayer insulating layer formed on the second surface of the core layer; and A multilayer circuit board comprising a third circuit layer formed on the second interlayer insulating layer.
  2. In Article 1, A multilayer circuit board further comprising an insulating portion provided between the first interlayer insulating layer and the first circuit layer, or between the second interlayer insulating layer and the third circuit layer.
  3. In Article 1, A multilayer circuit board further comprising a fourth circuit layer formed on the second surface of the core layer.
  4. In Article 1, A multilayer circuit board further comprising a seed layer provided between the first interlayer insulating layer and the first circuit layer, or between the second interlayer insulating layer and the third circuit layer.
  5. In Article 1, A multilayer circuit board in which at least one of the first interlayer insulating layer and the second interlayer insulating layer is made of a material of a different type from the core layer.
  6. In Article 1, A multilayer circuit board in which the thickness of the second interlayer insulating layer is equal to or thicker than the spacing distance between the first circuit layer and the second circuit layer.
  7. In Article 6, A multilayer circuit board in which the thickness of the second interlayer insulating layer is formed to be 100% to 150% of the thickness compared to the spacing distance.
  8. In Article 1, A first via hole connecting the first circuit layer and the second circuit layer; and A multilayer circuit board further comprising a first circuit connection layer formed within the first via hole.
  9. In Article 1, A second via hole connecting the second circuit layer and the third circuit layer; and A multilayer circuit board further comprising a second circuit connection layer formed within the second via hole.
  10. In Paragraph 3, A through hole connecting the second circuit layer and the fourth circuit layer; and A multilayer circuit board further comprising a conductive electrode formed within the through hole.
  11. In Paragraph 3, A third via hole connecting the fourth circuit layer and the third circuit layer; and A multilayer circuit board further comprising a third circuit connection layer formed within the third via hole.
  12. In Article 8, The above first circuit connection layer is, First partial metal layer; and A multilayer circuit board comprising a second partial metal layer surrounding the first partial metal layer.
  13. In Article 12, The above-mentioned first partial metal layer is a multilayer circuit board composed of one or more metals selected from conductive metals including nickel (Ni), chromium (Cr), copper (Cu), gold (Au), aluminum (Al) and palladium (Pd).
  14. In Article 12, A multilayer circuit board formed such that the first partial metal layer has a thickness of 10 nm or more and 200 nm or less.
  15. In Article 12, The second partial metal layer is composed of one or more metals selected from conductive metals including copper (Cu), gold (Au), and aluminum (Al), or a multilayer circuit board having at least one metal component identical to the second circuit layer.
  16. In Article 12, A multilayer circuit board formed such that the second partial metal layer is formed to fill the space surrounded by the first partial metal layer.
  17. In Article 12, The above second partial metal layer is a multilayer circuit board formed integrally with the above first circuit layer.
  18. In Article 8, The second circuit layer above includes a groove, and The above first circuit connection layer is a multilayer circuit board that extends to fill the groove.
  19. In Article 18, The above groove is a multilayer circuit board formed when removing a conductive layer formed on the surface of the second circuit layer.
  20. In Article 2, A multilayer circuit board in which the insulating portion and the first metal layer serving as a base for forming the first circuit layer are integrally provided.

Description

Multilayer circuit board and manufacturing method thereof, and electronic apparatus including the same The present invention relates to a manufacturing method for efficiently producing a multilayer circuit board, a multilayer circuit board produced according to the manufacturing method, and an electronic device including the multilayer circuit board. In the case of manufacturing a three-layer circuit board, conventionally, a second circuit layer and a third circuit layer are formed on both sides of a base film, respectively, and then a first circuit layer is formed on the second circuit layer. However, according to this method, a through hole for electrically connecting the second circuit layer and the third circuit layer is formed first, and then a via hole for electrically connecting the first circuit layer and the second circuit layer is formed. Additionally, a protective film is attached to the third circuit layer before forming the first circuit layer, and the protective film is removed from the third circuit layer after forming the first circuit layer. As such, according to the conventional method, multiple processes must be performed to manufacture a three-layer circuit board, and the associated costs may increase. FIG. 1 is a first flowchart for explaining, step by step, a method for manufacturing a multilayer circuit board according to some embodiments of the present invention. FIG. 2 is a first example diagram for explaining the product structure at step S110 of the manufacturing method of a multilayer circuit board. Figure 3 is a second example diagram for explaining the product structure at step S110 of the manufacturing method of a multilayer circuit board. FIG. 4 is a first example diagram for explaining the product structure at step S120 of the manufacturing method of a multilayer circuit board. FIG. 5 is a second example diagram for explaining the product structure at step S120 of the manufacturing method of a multilayer circuit board. FIG. 6 is a first example diagram for explaining the product production method in step S120 of the manufacturing method of a multilayer circuit board. FIG. 7 is a second example diagram illustrating a product production method in step S120 of a method for manufacturing a multilayer circuit board. FIG. 8 is a third example diagram illustrating a product production method in step S120 of a method for manufacturing a multilayer circuit board. FIG. 9 is a third example diagram illustrating the product structure at step S120 of the manufacturing method of a multilayer circuit board. FIG. 10 is a fourth example diagram illustrating the product structure at step S120 of the manufacturing method of a multilayer circuit board. Figure 11 is an example diagram illustrating the product structure at step S130 of the manufacturing method of a multilayer circuit board. FIG. 12 is a first example diagram for explaining the product structure at step S140 of the manufacturing method of a multilayer circuit board. FIG. 13 is a second example diagram for explaining the product structure at step S140 of the manufacturing method of a multilayer circuit board. FIG. 14 is a third example diagram illustrating the product structure at step S140 of the manufacturing method of a multilayer circuit board. FIG. 15 is a fourth example diagram illustrating the product structure at step S140 of the manufacturing method of a multilayer circuit board. FIG. 16 is a first example diagram for explaining the product structure at step S150 of the manufacturing method of a multilayer circuit board. FIG. 17 is a second example diagram for explaining the product structure at step S150 of the manufacturing method of a multilayer circuit board. FIG. 18 is an example diagram illustrating the product structure at step S160 of the manufacturing method of a multilayer circuit board. FIG. 19 is a second flowchart for explaining, step by step, a method for manufacturing a multilayer circuit board according to some embodiments of the present invention. FIG. 20 is an example diagram illustrating a product production method in step S125 of a method for manufacturing a multilayer circuit board. FIG. 21 is a third flowchart for explaining, step by step, a method for manufacturing a multilayer circuit board according to some embodiments of the present invention. FIG. 22 is an example diagram illustrating the product structure at step S155 of the manufacturing method of a multilayer circuit board. Embodiments of the present invention will be described in detail below with reference to the attached drawings. Identical components in the drawings are denoted by the same reference numerals, and redundant descriptions thereof are omitted. The first direction (D1) and the second direction (D2) can form a two-dimensional plane. The first direction (D1) may be the X-axis direction and the second direction (D2) may be the Y-axis direction. The first direction (D1) may be the left-right direction and the second direction (D2)