KR-20260062786-A - CHUCK

KR20260062786AKR 20260062786 AKR20260062786 AKR 20260062786AKR-20260062786-A

Abstract

The present invention discloses a chuck. The chuck comprises a support plate, a support shaft, and an insulating member. The support plate is used to place a test wafer. The support shaft is installed below the support plate and is used to support the support plate. The insulating member is installed between the support plate and the support shaft. The chuck of the present invention can prevent heat from being transferred to the support shaft.

Inventors

로우 춘 렁
천 호 이에
림 반 반

Assignees

뷰에트 피티이. 엘티디.

Dates

Publication Date: 20260507
Application Date: 20250313
Priority Date: 20241029

Claims (10)

In terms of the scale, The above chuck is, A support plate for placing a test wafer; A support shaft installed below the support plate and for supporting the support plate; and It includes an insulating member installed between the support plate and the support shaft, The above-mentioned insulating member is, At least one first insulating member installed below the support plate and adjacent to the support plate; At least one second insulating member installed below the first insulating member and adjacent to the support shaft; and It further comprises at least one chamber that creates at least one fluid passage and is surrounded by the first insulating member and the second insulating member, and Here, the thermal conductivity of the first insulating member is greater than that of the second insulating member; Here, the insulating member creates at least one insulating block between the support plate and the support shaft; Herein, at least some of the support shafts are characterized by supporting the support plate through the insulating member. chuck.
In Article 1, The above-mentioned insulating member is, At least one fluid inlet connected to the chamber and introducing a cooling fluid into the chamber; and Characterized by further including at least one fluid outlet connected to the chamber and drawing a cooling fluid from the chamber. chuck.
In Article 2, Characterized by the fact that the horizontal height of the fluid inlet and the fluid outlet is the same. chuck.
In Article 1, The above-mentioned first insulating member is characterized by having a plurality of pins. chuck.
In terms of the scale, The above chuck is, A support plate for placing a test wafer; A support shaft installed below the support plate and for supporting the support plate; and It includes an insulating member installed between the support plate and the support shaft, The above-mentioned insulating member is, First insulating member; The thermal conductivity of the first insulating member is the same as that of the second insulating member; and It further comprises at least one chamber that creates at least one fluid passage and is surrounded by the first insulating member and the second insulating member, and Herein, the insulating member is characterized by creating at least one insulating block on the support plate and the support shaft. chuck.
In Article 5, The above-mentioned insulating member is, At least one fluid inlet connected to the chamber and introducing a cooling fluid into the chamber; and It further includes a plurality of fluid outlets connected to the chamber and drawing a cooling fluid from the chamber, Here, the fluid inlet is characterized by being located below the fluid outlet. chuck.
In Article 5, The width of the insulation member is characterized as being greater than or equal to the width of the support shaft. chuck.
In Article 5, The above-described insulating member is characterized by having a plurality of pins. chuck.
In Article 5, The first insulating member and the second insulating member are characterized by being of the same material. chuck.
In Article 5, The first insulating member and the second insulating member are characterized as being a single unit. chuck.

Description

Chuck The present invention relates to a chuck, and more particularly to a chuck having an insulating member. In the semiconductor manufacturing process, wafer testing is generally required to identify and sort out defective wafers in a timely manner. Wafer testing is performed by connecting to a probe card that creates an interface between the test system and the wafer using contact needles; the wafer is supported beneath the probe card and heated to an appropriate test temperature. Wafer testing is typically conducted within a temperature range between -60°C and 300°C, and even at more extreme temperatures. However, taking high-temperature testing as an example, if the high temperature is transferred to the support axis of the wafer loading unit during the heating process, the support axis expands due to the heat, affecting the alignment of the support axis. Therefore, the transfer of high temperature to the support axis must be prevented. In conventional technology, wafer loading units are generally cooled using cooling liquid via cooling tubes or screw cooling methods; however, cooling liquids are susceptible to environmental influences, difficult to maintain at low temperatures, and lack stability, resulting in poor cooling performance and high costs. The technical problem that the present invention aims to solve is to provide a solution to the shortcomings of the prior art. One technical solution employed in the present invention to solve the aforementioned technical problem is to provide a chuck, wherein the chuck comprises a support plate for placing a test wafer; a support shaft installed below the support plate and for supporting the support plate; and an insulating member installed between the support plate and the support shaft, wherein the insulating member further comprises at least one first insulating member; at least one second insulating member; and at least one chamber formed by the first insulating member and the second insulating member, and the first insulating member is installed above the second insulating member and adjacent to the support plate; wherein the thermal conductivity of the first insulating member is greater than that of the second insulating member; and wherein the insulating member forms at least one insulating block between the support plate and the support shaft. Furthermore, the insulating member is connected to the chamber and has at least one fluid inlet for introducing a cooling fluid into the chamber; and It further includes at least one fluid outlet connected to the chamber and drawing a cooling fluid from the chamber. Furthermore, the horizontal height of the fluid inlet and the fluid outlet is the same. Furthermore, the first insulating member has a plurality of pins. Another technical solution employed in the present invention to solve the aforementioned technical problem is to provide a chuck, said chuck comprising: a support plate for placing a test wafer; a support shaft installed below the support plate and for supporting the support plate; and an insulating member installed between the support plate and the support shaft, said insulating member comprising: a first insulating member; a second insulating member having the same thermal conductivity as the first insulating member; and at least one chamber formed by the first insulating member and the second insulating member, and the insulating member further comprising at least one chamber formed by the first insulating member and the second insulating member, wherein the insulating member forms at least one insulating block on the support plate and the support shaft. Furthermore, the insulating member further comprises at least one fluid inlet connected to the chamber and introducing a cooling fluid into the chamber; and a plurality of fluid outlets connected to the chamber and drawing a cooling fluid out of the chamber, wherein the fluid inlet is located below the fluid outlets. Furthermore, the width of the insulation member is greater than or equal to the width of the support shaft. Furthermore, the above-mentioned insulating member has a plurality of pins. Furthermore, the first insulating member and the second insulating member are made of the same material. Furthermore, the first insulating member and the second insulating member are a single unit. To better understand the features and technical details of the present invention, please refer to the detailed description and drawings below. The provided drawings are for reference and explanation purposes only and are not intended to limit the invention. FIG. 1a is a side schematic diagram of a chuck of a first embodiment of the present invention. FIG. 1b is a side schematic diagram of a modified chuck in the first embodiment of the present invention. FIG. 2a is a side schematic diagram of a chuck of a second embodiment of the present invention. FIG. 2b is a side schematic diagram of a modified chuck in the second embodiment of the present invention. F