KR-20260062805-A - INJECTION NOZZLE UNIT AND SUBSTRATE CLEANING DEVICE HAVING THE SAME
Abstract
One embodiment of the present invention provides a spray nozzle and a substrate cleaning device having the same, comprising: an inlet pipe into which a cleaning fluid is introduced; a heat exchange body part having one side coupled to the inlet pipe and having a fluid movement path formed therein for the cleaning fluid supplied from the inlet pipe to move, and controlling the cleaning fluid moving through the fluid movement path to a required temperature; a heat exchange source coupled to the outer surface of the heat exchange body part and heating or cooling the heat exchange body part; and a discharge pipe coupled to the other side of the heat exchange body part and spraying the cleaning fluid, whose temperature is controlled through an indirect heat exchange method from the heat exchange body part, onto a substrate.
Inventors
- 구교욱
- 조미옥
Assignees
- 케이세미 주식회사
Dates
- Publication Date
- 20260507
- Application Date
- 20250626
Claims (7)
- Inlet pipe into which cleaning fluid flows; One side is coupled to the inlet pipe, and a fluid transfer channel is formed inside through which a cleaning fluid supplied from the inlet pipe moves, and a heat exchange body part that controls the cleaning fluid moving through the fluid transfer channel to a required temperature; A heat exchange source coupled to the outer surface of the heat exchange body and heating or cooling the heat exchange body; A spray nozzle part comprising: a discharge pipe coupled to the other side of the heat exchange body part and spraying a cleaning fluid onto a substrate, the temperature of which is controlled through an indirect heat exchange method from the heat exchange body part.
- In paragraph 1, An insulating member disposed on the outer side of the heat exchange body part; and It further includes a nozzle housing in which an internal receiving space is formed to protect the heat exchange body, heat exchange source, and insulation portion from the outside. The nozzle housing is provided with an inlet hollow tube through which the inlet pipe passes and an outlet hollow tube through which the discharge pipe passes, and the cross-sections of the inlet pipe and the inlet hollow tube and the cross-sections of the discharge pipe and the outlet hollow tube are formed as concentric circles. A spray nozzle section characterized by the inlet pipe being equipped with a flow meter and a flow control valve, and the outlet pipe being equipped with a temperature sensor.
- In paragraph 1, The above heat exchange body part is, Upper body part equipped with an upper Euro forming part; A lower body part formed with a lower flow path forming part that is coupled to the upper body part and forms the fluid movement path together with the upper flow path forming part; and A seal inserted into a sealing insertion groove formed on the edge of the upper body portion and the lower body portion; comprising A spray nozzle part characterized by having a fluid inlet filling part formed on one side of the interior where the upper body part and the lower body part are joined, so that a cleaning fluid supplied from the inlet pipe is uniformly supplied to the fluid movement path, and a fluid discharge filling part formed on the other side of the interior where the upper body part and the lower body part are joined, so that a cleaning fluid discharged from the fluid movement path is uniformly discharged to the discharge pipe.
- In paragraph 3, A spray nozzle section characterized in that the first width of the fluid inlet filling section and the fluid discharge filling section is formed to be equal to or wider than the second width of the fluid flow path, and the first height of the fluid inlet filling section and the fluid discharge filling section is formed to be equal to or higher than the second height of the fluid flow path, so that the area of the fluid inlet filling section and the fluid discharge filling section is formed to be wider than the area of the fluid flow path based on the longitudinal section.
- In paragraph 2, The above heat exchange source is equipped with one or more of a heater and a cooling plate, and A motor is coupled to the above-mentioned inlet hollow tube so that the discharge tube can move from the center to the edge of the substrate, and A spray nozzle part characterized in that the fluid passage gap of the above fluid passage is 0.1 to 3 mm, and based on the longitudinal section, the fluid passage is formed as one of a meandering trapezoidal shape, a meandering curved shape, a straight shape, and a circular shape.
- Inlet pipe into which cleaning fluid flows; A heat exchange body part having an insertion fastening hole formed inside and a spiral groove formed along the longitudinal direction on the outer surface; One side is connected to the inlet pipe and is a connecting pipe inserted and coupled into the spiral groove; A heat exchange source inserted into the above-mentioned insertion fastening hole, which heats or cools the heat exchange body and controls a cleaning fluid moving along the connecting pipe through the heat exchange body to a required temperature; A discharge pipe coupled to the other side of the above-mentioned connecting pipe and spraying a cleaning fluid onto a substrate, the temperature of which is controlled through an indirect heat exchange method from the heat exchange body; and It includes a nozzle housing disposed on the outer side of the above-mentioned connecting pipe and having a vacuum insulation space formed inside, The injection nozzle section in which the inlet pipe, connecting pipe, and discharge pipe are formed as a single pipe.
- A substrate cleaning device equipped with one or more spray nozzle sections according to paragraph 1 or 6.
Description
Injection nozzle unit and substrate cleaning device having the same The present invention relates to a spray nozzle unit and a substrate cleaning device having the same, and more specifically, to a spray nozzle unit having a heat exchanger for heating or cooling the cleaning fluid to a required temperature within the spray nozzle unit that sprays the cleaning fluid onto a substrate, and a substrate cleaning device having the same. In general, during the substrate manufacturing process, the cleaning process to remove foreign substances from the substrate surface is an essential step to increase yield. Specifically, various impurities may remain on the substrate surface after processes such as the deposition of insulating films and metallic materials, etching, and the application of photoresists are performed. Since these impurities are a critical factor determining substrate performance and yield, the substrate cleaning process is very important. This substrate cleaning process is performed by spraying cleaning fluid from the top and bottom of the substrate towards the center while the substrate is rotating. In other words, the cleaning fluid sprayed onto the substrate moves from the center to the edges due to the centrifugal force of the rotating substrate, allowing for a complete cleaning of both the upper and lower surfaces. In such substrate cleaning operations, the temperature, concentration, and flow rate of the cleaning fluid used to clean the substrate must be precisely controlled. In particular, precise flow rate control of the cleaning fluid is required in miniaturizing semiconductor processes. However, conventional substrate cleaning devices have problems such as different heating methods depending on the type of cleaning fluid, complex structures, and occupying a large amount of installation space during the substrate cleaning process. In addition, conventional substrate cleaning devices spray cleaning fluid onto a substrate through a spray nozzle, and since the temperature of the cleaning fluid within the spray nozzle decreases while waiting for the next substrate cleaning operation, the cleaning fluid within the spray nozzle must be discharged through a pre-dispense process, and then a newly supplied cleaning fluid must be sprayed onto the substrate. This process has the problem of increasing the consumption of cleaning fluid. Furthermore , conventional substrate cleaning devices are not equipped with a separate flow control valve and flow meter to supply the required amount of cleaning fluid to the spray nozzle section. For example, cleaning fluids such as sulfuric acid ( H₂SO₄ ) or phosphoric acid ( H₃PO₄ ) are heated to a high temperature of 180°C or higher and then sprayed onto the substrate through the spray nozzle section. Generally, the substrate cleaning device is equipped with an inline heater to heat the cleaning fluid to the required temperature and then supply the heated cleaning fluid to the spray nozzle section. Such an inline heater has a problem in that the temperature of the cleaning fluid changes depending on the flow rate of the cleaning fluid. Consequently, there is a problem in that the temperature of the cleaning fluid supplied to the spray nozzle section cannot be supplied at the required temperature. Furthermore, since heat loss may occur as the cleaning fluid heated by the inline heater moves to the spray nozzle, there is a problem where the temperature of the cleaning fluid actually sprayed from the nozzle is lower than the required temperature. Consequently, if the cleaning fluid sprayed onto the substrate through the nozzle fails to maintain the required temperature, the substrate cleaning process cannot be properly performed. Accordingly, various research and developments are being conducted on a spray nozzle section configured to spray a cleaning fluid at a required temperature through the spray nozzle section, and on a substrate cleaning device equipped with the same. FIG. 1 is an exemplary diagram of a substrate cleaning device according to a first embodiment of the present invention. FIG. 2 is a perspective view of a spray nozzle part according to a first embodiment of the present invention. FIG. 3 is an exploded perspective view of a spray nozzle part according to a first embodiment of the present invention, viewed from above. FIG. 4 is an exploded perspective view of a spray nozzle part according to a first embodiment of the present invention, viewed from below. Figure 5 is a cross-sectional example of II in Figure 2. Figure 6 is an example cross-sectional view of line II-II of Figure 2. FIG. 7 is an exemplary diagram showing various fluid movement paths of the present invention. Figure 8 is a simulation showing the temperature change of the cleaning fluid according to the flow gap of the fluid movement path of the present invention. FIG. 9 is a cutaway perspective view of a spray nozzle portion according to a second embodiment of the present invention. FIG. 1