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KR-20260062846-A - COMPOSITION FOR ADHESIVE LAYER, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PROCESSING LAYERED PRODUCT

KR20260062846AKR 20260062846 AKR20260062846 AKR 20260062846AKR-20260062846-A

Abstract

(Problem) To provide a composition for forming an adhesive layer that exhibits excellent degradability upon light irradiation and can reduce residue upon degradation, a method for manufacturing a laminate using the said composition for forming an adhesive layer in the adhesive layer, and a method for processing the laminate. (Solution) A laminate having an adhesive layer between a light-transmitting support and a substrate, wherein the support and the substrate can be separated from the laminate by irradiating light from the support side. The adhesive layer forming composition comprises (A) a polymerizable resin containing unsaturated groups and (E) a solvent. The absorbance of light at a wavelength of 266 nm of the cured film obtained under predetermined conditions is 0.50 or higher. The weight loss rate of component (A) obtained under predetermined conditions is 50 mass% or higher.

Inventors

  • 우치다 가즈유키

Assignees

  • 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤

Dates

Publication Date
20260507
Application Date
20251021
Priority Date
20241029

Claims (7)

  1. In a laminate having an adhesive layer between a light-transmitting support and a substrate, A composition for forming an adhesive layer that enables the separation of the support and the adherend from the laminate by irradiating light from the support side, The above adhesive layer forming composition is, (A) Polymerizable resin containing unsaturated groups, and, (E) Solvent Includes, A solution of component (A) is applied to a substrate such that the film thickness after curing is 1.0 μm, and a cured film is formed by heat treatment at 100°C for 5 minutes followed by heat treatment at 230°C for 30 minutes, wherein the absorbance of light at a wavelength of 266 nm is 0.50 or higher, and A cured product obtained by applying a solution of component (A) above to a substrate, heat-treating at 100°C for 5 minutes, and then heat-treating at 230°C for 30 minutes, wherein the weight loss rate when heated from 30°C to 400°C under a nitrogen atmosphere is 50 mass% or more, Composition for forming an adhesive layer.
  2. In Article 1, The above component (A) is an unsaturated group-containing polymerizable resin obtained by reacting a diol compound (a-1) represented by the following general formula (1) with a tetrabasic acid or its dianhydride (a-2). Composition for forming an adhesive layer. (In general formula (1), R1 is independently a monovalent hydrocarbon group having 1 to 20 carbon atoms that may include an oxygen atom, or a substituent of the following general formula (2). R2 is independently a substituent represented by the following general formula (3) or general formula (4). X is a tetravalent carboxylic acid residue.) (In general formula (2), R3 is a hydrogen atom or a methyl group. R4 is a divalent hydrocarbon group having 1 to 20 carbon atoms that may include an oxygen atom, and p is a number from 0 to 10. In general formulas (3) and (4), R5 is independently a monovalent hydrocarbon group having 1 to 20 carbon atoms that may include an oxygen atom, a substituent of the following general formula (5), or a hydrogen atom. * indicates a bonding site with the structure represented by general formula (1). However, in general formula (4), R5 indicates that it is bonded to any carbon atom on the ring.) (In general formula (5), R3 is a hydrogen atom or a methyl group. R4 is a divalent hydrocarbon group having 1 to 20 carbon atoms that may include an oxygen atom, and q is a number from 0 to 10. * indicates a bonding site with a structure represented by general formula (3) or general formula (4).)
  3. In Article 1, (B) comprising an epoxy compound having at least two epoxy groups, The content of the above component (B) is 10 mass% to 70 mass% with respect to the total mass of the above component (A). Composition for forming an adhesive layer.
  4. In Article 1, (B) comprising an epoxy compound having at least two epoxy groups, The above component (B) is such that, using an ultraviolet-visible-infrared spectrophotometer, the absorbance of an acetonitrile solution at a concentration of 0.001 wt% is measured in a quartz cell with a path length of 1 cm, and the absorbance of light at a wavelength of 266 nm is 0.10 or higher. Composition for forming an adhesive layer.
  5. In Article 1, (C) containing a photopolymerization initiator, Composition for forming an adhesive layer.
  6. A process of forming an adhesive layer on the surface of either or both of a support and a substrate using an adhesive layer forming composition described in any one of claims 1 to 5, and A process of bonding the support and the adherend by interposing the adhesive layer formed above. A method for manufacturing a laminate comprising
  7. A process for preparing a laminate manufactured by the method described in claim 6, and A process of separating the support and the adherend by irradiating light. A method for processing a laminate having, The above support transmits light with a wavelength of 10 nm to 400 nm, and A method for processing a laminate in which the above laminate is separable from the support and the adherend by irradiation of light onto the adhesive layer.

Description

Composition for forming an adhesive layer, method for producing a laminate, and method for processing a laminate The present invention relates to a composition for forming an adhesive layer, a method for manufacturing a laminate, and a method for processing a laminate. Recently, with the increase in functionality of digital devices, the installed flexible displays and semiconductor chips have become thinner, and it has been difficult to transport these flexible displays and semiconductor chips, whose strength has been reduced due to thinning, using conventional automated transport systems. Therefore, methods for easily transporting thin flexible displays, semiconductor chips, etc., are being considered. In this method, for example, a laminate is formed in which multiple devices, such as semiconductor wafers, are fixed by interposing an adhesive layer on a support, and this laminate is transported. Subsequently, light is irradiated from the support side toward the adhesive layer to alter or decompose the adhesive layer, thereby reducing the adhesive strength, peeling the devices from the support, and transferring the devices to another substrate. Patent Document 1 describes a laminate having a photothermal conversion layer formed between a substrate and a support member that supports the substrate, the photothermal conversion layer which decomposes upon light irradiation. According to Patent Document 1, the separation layer deteriorates and loses its adhesiveness when irradiated with light, so the supporting substrate and the supported substrate can be easily separated. FIG. 1A is a schematic diagram illustrating a process of irradiating a laminate in which a support and a substrate are bonded together via an adhesive layer with light (or a laser) to peel off the substrate from the adhesive layer and transfer the substrate from the support onto another substrate. FIG. 1B is a schematic diagram illustrating a process of catching the substrate peeled off from the support on a catch layer applied to the surface of another substrate. FIG. 2A is a schematic diagram illustrating a process of transferring a substrate from a transfer source substrate onto a support by degrading and decomposing a resin that has a substrate attached to it by irradiation with light. FIG. 2B is a schematic diagram illustrating a process of obtaining a laminate comprising an adhesive layer that has bonded a plurality of substrates, by catching a substrate peeled from a transfer source substrate in an adhesive layer applied to the surface of a support. Embodiments of the present invention are described below, but the present invention is not limited to the following embodiments. Furthermore, in this specification, when the first decimal place of the content of each component is 0, the notation after the decimal point may be omitted. Also, regarding the compounds, functional groups, or structures exemplified below, unless specifically mentioned otherwise, only one type of the examples provided may be used, or multiple types may be used in combination. Additionally, in this specification, "(meth)acrylic" is a general term for acrylic and methacrylic, and "(meth)acryloyl group" is a general term for acryloyl group and methacryloyl group, and means one or both of these. 1. Composition for forming an adhesive layer The adhesive layer forming composition related to the present embodiment is, In a laminate having an adhesive layer between a light-transmitting support and a substrate, It is a composition for forming an adhesive layer that enables the separation of the support and the adherend from the laminate by irradiating light from the support side. In addition, the adhesive layer forming composition related to the present embodiment is, (A) a polymerizable resin containing unsaturated groups (hereinafter also simply referred to as “Component (A)”) and, (E) Solvent (hereinafter also simply referred to as “(E) component”) It includes, and component (A) satisfies the following two requirements. (Requirement 1) A solution of component (A) is applied to a substrate such that the film thickness after curing is 1.0 μm, and then heat-treated at 100°C for 5 minutes followed by heat-treated at 230°C for 30 minutes. The absorbance of the cured film formed is 0.50 or higher for a wavelength of 266 nm. (Requirement 2) A solution of component (A) is applied to a substrate, and a cured product obtained by heat treatment at 100°C for 5 minutes followed by heat treatment at 230°C for 30 minutes is heated from 30°C to 400°C under a nitrogen atmosphere, and the weight loss rate is 50 mass% or more. 1-1. (A) Polymerizable resin containing unsaturated groups As described above, the component (A) related to the present embodiment is not particularly limited as long as it is an unsaturated group-containing polymerizable resin satisfying the above (requirement 1) and (requirement 2). (Requirement 1) specifies the absorbance for light of a predetermined wavelength,