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KR-20260062919-A - Non-substrate differential tape and method therefor

KR20260062919AKR 20260062919 AKR20260062919 AKR 20260062919AKR-20260062919-A

Abstract

The present invention discloses a substrate-free differential tape and a method thereof. The invention includes a substrate-free differential tape comprising: a first silicone adhesive layer having a first surface and a second surface facing each other; a second silicone adhesive layer having a third surface and a fourth surface facing each other, wherein the third surface is in contact with the second surface; a first film bonded to the first surface; and a second film bonded to the fourth surface, wherein the first silicone adhesive layer has a first adhesive force and the second silicone adhesive layer has a second adhesive force smaller than the first adhesive force.

Inventors

  • 이상국

Assignees

  • 주식회사 나우인더스

Dates

Publication Date
20260507
Application Date
20260424

Claims (5)

  1. A step of coating a silicone adhesive on a first film to produce a first adhesive-coated film comprising a first free silicone adhesive layer; A step of drying the first adhesive coating film to produce a first adhesive drying film comprising a first silicone adhesive layer having a first adhesive strength; A step of producing a first semi-film by laminating a temporary film onto the first adhesive drying film; A step of coating a second film with a silicone adhesive to produce a second adhesive-coated film comprising a second free silicone adhesive layer; A step of drying the second adhesive coating film to produce a second adhesive drying film comprising a second silicone adhesive layer having a second adhesive strength weaker than the first adhesive strength; and The method includes the step of laminating the first semi-film from which the above temporary film has been removed and the second adhesive drying film, and The above temporary film is, It is provided with an untreated film and includes a bubble prevention pattern formed in a hole pattern, The above bubble prevention pattern is, Includes a first hole pattern and a second hole pattern, The first hole pattern and the second hole pattern are formed such that the hole sizes are different from each other and the shape of the patterns is different from each other. Method for manufacturing a differential tape without materials.
  2. In paragraph 1, The step of coating the first film above is, Performed by any one of comma coating equipment, gravure coating equipment, micro gravure coating equipment and slot die coating equipment, Method for manufacturing a differential tape without materials.
  3. In paragraph 1, The first silicone adhesive layer above is, Comprising at least one of polydimethylsiloxane gum, polydimethylsiloxane resin, polysiloxane, a reactive metal complex dispersed in polysiloxane, a hydrogen silicone oil, and a film adhesion enhancer, Method for manufacturing a differential tape without materials.
  4. In paragraph 1, The step of producing the first adhesive coating film is, The method includes the step of including a first amount of polydimethylsiloxane gum in the first silicone adhesive layer, The step of producing the second adhesive coating film is, The method includes the step of including a second amount of polydimethylsiloxane gum in the second silicone adhesive layer, The above second content is lower than the above first content, Method for manufacturing a differential tape without materials.
  5. In paragraph 1, The step of producing the first adhesive coating film is, The step of including a first type of polydimethylsiloxane gum, The step of producing the second adhesive coating film is, The step of including a second type of polydimethylsiloxane gum, The above-mentioned second type of polydimethylsiloxane gum has a weaker adhesive strength than the above-mentioned first type of polydimethylsiloxane gum, Method for manufacturing a differential tape without materials.

Description

Non-substrate differential tape and method therefor The present invention relates to a differential tape without a substrate and a method for manufacturing the same. Specifically, the present invention relates to a differential tape having different adhesive forces on both sides and a method for manufacturing the same. Double-sided tape can be utilized in various ways across multiple industrial sectors. For example, during the soldering process for Flexible Printed Circuit Boards (FPCBs), the FPCB is secured to a surface using double-sided tape before soldering. After the soldering is complete, a picking operation is required to detach the FPCB secured by the double-sided tape. In this process, when securing the FPCB to the surface, the adhesive strength on the side in contact with the surface must be strong, while the adhesive strength on the side in contact with the FPCB must be weak enough to allow for easy detachment. Similarly, tapes with different adhesive strengths were required for each stage during the processing of LED chips and semiconductor chips. In the conventional double-sided tape manufacturing process, adhesive is coated onto both sides of a single base material and then dried. Specifically, the existing double-sided tape manufacturing method sequentially passes through the base material production, coating, drying, cutting, and winding stages to produce the final double-sided tape. During this process, it is common practice to insert a substrate layer and a primer layer to enhance adhesion and durability. However, when such a substrate layer and primer layer were inserted into the tape, there was a disadvantage in that the manufacturing time was long and the manufacturing cost was high due to the increased complexity of the process steps. In addition, the presence of the substrate layer could make it difficult to miniaturize the tape. FIG. 1 is a perspective view illustrating a substrate-free differential tape according to some embodiments of the present invention. Figure 2 is a cross-sectional view taken along A-A' of Figure 1. FIG. 3 is a flowchart for explaining in detail a method for manufacturing a material-free differential tape according to some embodiments of the present invention. FIG. 4 is a perspective view for explaining the first adhesive coating film of FIG. 3. FIG. 5 is a perspective view illustrating the first adhesive drying film of FIG. 3. FIG. 6 is a perspective view illustrating the first semi-film of FIG. 3. FIG. 7 is a perspective view illustrating the second adhesive coating film of FIG. 3. FIG. 8 is a perspective view illustrating the second adhesive drying film of FIG. 3. FIG. 9 is a perspective view illustrating the process of removing a temporary film from the first semi-film of FIG. 3. FIG. 10 is a perspective view illustrating the process of removing the temporary film from the first semi-film and laminating it with the second adhesive drying film. Terms and words used in this specification and claims shall not be interpreted as being limited to their general or dictionary meanings. In accordance with the principle that an inventor may define the concept of a term or word to best describe their invention, they shall be interpreted in a meaning and concept consistent with the technical spirit of the invention. Furthermore, since the embodiments described in this specification and the configurations illustrated in the drawings are merely one embodiment of the invention and do not represent the entire technical spirit of the invention, it should be understood that various equivalents, modifications, and applicable examples capable of replacing them may exist at the time of filing this application. The terms first, second, A, B, etc., as used in this specification and claims may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and/or" includes a combination of a plurality of related described items or any of a plurality of related described items. The terms used in this specification and claims are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" should be understood as not precluding the existence or addition of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which this invention pertains. Terms s