KR-20260062922-A - Display panel

KR20260062922AKR 20260062922 AKR20260062922 AKR 20260062922AKR-20260062922-A

Abstract

One embodiment of the present invention discloses a display panel comprising: a substrate including an opening; a plurality of light-emitting diodes arranged in a display area surrounding the opening; an encapsulation layer disposed on the plurality of light-emitting diodes and comprising at least one inorganic encapsulation layer and an organic encapsulation layer; a first partition and a second partition located in a non-display area between the opening and the display area and arranged along the direction from the display area toward the opening; and a plurality of grooves located on at least one inorganic insulating layer on the substrate and disposed in the non-display area, wherein at least one of the plurality of grooves is located between the first partition and the second partition and is covered by an organic encapsulation layer.

Inventors

이정호
문유한
김훈
김쇄현

Assignees

삼성디스플레이 주식회사

Dates

Publication Date: 20260507
Application Date: 20260427

Claims (20)

A substrate with an internally defined opening; A plurality of thin-film transistors disposed on the substrate, wherein the display area surrounding the opening of the substrate on a flat plane is disposed therein; A plurality of light-emitting diodes disposed in the above-mentioned display area and electrically connected to the plurality of thin-film transistors - any one of the plurality of light-emitting diodes comprises a first electrode, a second electrode, and a light-emitting layer between the first electrode and the second electrode -; An encapsulation layer disposed on the plurality of light-emitting diodes in the above display area - the encapsulation layer comprises at least one inorganic encapsulation layer and an organic encapsulation layer -; At least one inorganic insulating layer disposed on the substrate in a non-display area between the opening of the substrate and the display area; A first organic insulating layer disposed on the thin-film transistors in the display area and disposed on the at least one inorganic insulating layer in the non-display area; A plurality of grooves defined in the first organic insulating layer in the above non-display area; A first metal pattern layer comprising a first tip protruding over a first groove, which is one of the plurality of grooves, disposed directly above the first organic insulating layer in the above non-display area; and At least one organic layer disposed between the first electrode and the second electrode in the above display area; comprising, The above at least one organic layer extends to the above non-display area and is separated into a plurality of parts by the first tip, and The first tip of the first metal pattern layer has a structure in which a titanium layer, an aluminum layer, and another titanium layer are laminated, forming a display panel.
In paragraph 1, A display panel further comprising a data line electrically connected to any one of the plurality of thin-film transistors, wherein the data line has the same stacked structure as the first tip.
In paragraph 1, The above first tip is, A display panel having an eaves shape protruding toward the first groove, passing through a first point where the upper surface of the first organic insulating layer and the first side of the first organic insulating layer facing one side of the first groove meet.
In paragraph 1, A first partition wall disposed in the above-mentioned non-display area; and It further includes a second partition wall disposed in the above-mentioned non-display area and located between the first partition wall and the opening of the substrate, and Each of the first partition and the second partition comprises a stacked structure of sub-organic insulating layers, and The first groove is a display panel located between the first partition and the display area or between the first partition and the second partition.
In paragraph 3, It further includes a second metal pattern layer comprising a second tip that is directly disposed on the upper surface of the first organic insulating layer and protrudes over the first groove, and The second tip of the second metal pattern layer has a structure in which a titanium layer, an aluminum layer, and another titanium layer are laminated, forming a display panel.
In paragraph 5, The plurality of parts of the above at least one organic layer are: A first part disposed on the first tip above; A second part disposed on the second tip and separated from the first part; and A display panel comprising a third part disposed within the first groove and separated from the first part and the second part.
In paragraph 5, The above second tip is, It has an eaves shape protruding toward the first groove, passing through a second point where the upper surface of the first organic insulating layer and the second side of the first organic insulating layer facing the other side of the first groove meet. A display panel in which the first tip and the second tip are located opposite to a virtual vertical line passing through the center of the first groove.
In paragraph 5, A display panel in which, on a flat plane, the organic encapsulation layer overlaps with the first groove.
A substrate with an internally defined opening; A plurality of thin-film transistors disposed on the substrate, wherein the display area surrounding the opening of the substrate on a flat plane is disposed therein; A plurality of light-emitting diodes disposed in the above-mentioned display area and electrically connected to the plurality of thin-film transistors—one of the plurality of light-emitting diodes comprises a first electrode, a second electrode, and a light-emitting layer between the first electrode and the second electrode—; A sealing layer disposed on the plurality of light-emitting diodes in the above display area, wherein the sealing layer comprises at least one inorganic sealing layer and an organic sealing layer; At least one inorganic insulating layer disposed on the substrate in a non-display area between the opening of the substrate and the display area; A first partition wall disposed in the above non-display area; A second partition disposed in the above-mentioned non-display area and located between the first partition and the opening of the substrate—each of the first partition and the second partition comprises a stacked structure of sub-organic insulating layers—; A first organic insulating layer disposed on the plurality of thin-film transistors in the display area and disposed on the at least one inorganic insulating layer in the non-display area; A data line electrically connected to any one of the plurality of thin-film transistors and disposed on the first organic insulating layer in the display area; A plurality of grooves defined in the first organic insulating layer and arranged in the non-display area—the plurality of grooves includes a first groove located between the first partition and the second partition—; A plurality of metal pattern layers disposed immediately above the first organic insulating layer in the above non-display area - the plurality of metal pattern layers include a first metal pattern layer including a first tip, wherein the first tip of the first metal pattern layer protrudes onto the first groove by passing through a first side of the first organic insulating layer toward the first groove -; and It includes at least one organic layer disposed between the first electrode and the second electrode in the above display area, and The above at least one organic layer extends to the above non-display area and is separated into a plurality of parts by the first tip, and The above organic bag layer overlaps with the first groove and the first tip, and A display panel in which the first tip and the data line of the first metal pattern layer each have a laminated structure of a titanium layer, an aluminum layer, and another titanium layer.
In Paragraph 9, The above first tip is, A display panel having an eaves shape protruding toward the first groove, passing through a first point where the upper surface of the first organic insulating layer and the first side of the first organic insulating layer facing the first groove meet.
In Paragraph 9, It further includes protrusions disposed on the laminated structure of the sub-organic insulating layers of the first partition and spaced apart from each other. A display panel having a recess between two adjacent protrusions among the above protrusions.
In Paragraph 11, A portion of the above organic encapsulation layer is a display panel located within the above recess.
In Paragraph 11, The above at least one inorganic encapsulation layer is: A first inorganic bag layer below the above organic bag layer; and It includes a second inorganic bag layer on the above organic bag layer, A display panel in which, in the above non-display area, a portion of the second inorganic sealing layer and a portion of the first inorganic sealing layer are in direct contact with each other on any one of the protrusions.
As an electronic device, A display panel comprising an opening area, a display area surrounding the opening area on a plane, and a non-display area between the opening area and the display area; and A component that overlaps with the opening area of the display panel and includes a sensor or a camera; and The above display panel is: A substrate having an internally defined opening - the opening of the substrate corresponds to the opening area of the display panel -; A plurality of thin-film transistors arranged on the substrate corresponding to the display area; A plurality of light-emitting diodes disposed in the above-mentioned display area and electrically connected to the plurality of thin-film transistors - any one of the plurality of light-emitting diodes comprises a first electrode, a second electrode, and a light-emitting layer between the first electrode and the second electrode -; An encapsulation layer disposed on the plurality of light-emitting diodes in the above display area - the encapsulation layer comprises a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer -; At least one inorganic insulating layer corresponding to the non-display area on the substrate; A first organic insulating layer disposed on the thin-film transistors in the display area and disposed on the at least one inorganic insulating layer in the non-display area; A plurality of grooves defined in the first organic insulating layer in the above non-display area; A first metal pattern layer comprising a first tip disposed directly above the first organic insulating layer in the above non-display area and protruding onto a first groove which is any one of the plurality of grooves; and It includes at least one organic layer disposed between the first electrode and the second electrode in the display area - the at least one organic layer extends into the non-display area and is separated into a plurality of parts by the first tip - and The first tip of the first metal pattern layer has a laminated structure of a titanium layer, an aluminum layer, and another titanium layer, in an electronic device.
In Paragraph 14, The above display panel further includes a data line electrically connected to any one of the plurality of thin-film transistors, and the data line has the same stacked structure as the first tip, an electronic device.
In Paragraph 14, The above first tip is, An electronic device having an eaves shape protruding toward the first groove, passing through a first point where the upper surface of the first organic insulating layer and the first side of the first organic insulating layer facing one side of the first groove meet.
In Paragraph 16, The above display panel is, It further includes a second metal pattern layer disposed directly above the first organic insulating layer in the above non-display area and comprising a second tip protruding onto the first groove, The above second tip is, Having an eaves shape protruding toward the first groove, passing through a second point where the upper surface of the first organic insulating layer and the second side of the first organic insulating layer facing the other side of the first groove meet. The second tip of the second metal pattern layer has a laminated structure of a titanium layer, an aluminum layer, and another titanium layer, in an electronic device.
In Paragraph 17, The plurality of parts of the above at least one organic layer are: A first part disposed on the first tip above; A second part disposed on the second tip and separated from the first part; and An electronic device comprising a third part disposed within the first groove and separated from the first part and the second part.
In Paragraph 14, An electronic device, wherein, on the above plane, the organic encapsulation layer overlaps with the first groove.
In Paragraph 19, The above display panel is: A first partition wall disposed in the above non-display area; It further includes a second partition wall disposed in the above-mentioned non-display area and located between the first partition wall and the opening of the substrate, and Each of the first partition and the second partition comprises a stacked structure of sub-organic insulating layers, and The first groove is located between the first partition and the display area or between the first partition and the second partition, and The above display panel further includes protrusions arranged spaced apart from each other and disposed on the laminated structure of the sub-organic insulating layers of the first partition wall, There is a recess between two adjacent protrusions among the above protrusions, and a part of the organic encapsulation layer is within the recess, and An electronic device in which, in the above non-display area, a portion of the second inorganic sealing layer and a portion of the first inorganic sealing layer are in direct contact with each other on any one of the protrusions.

Description

Display panel {Display panel} Embodiments of the present invention relate to a display panel having an opening area inside a display area. Recently, display devices have become more diverse in their applications. In addition, there is a trend of display devices becoming thinner and lighter, expanding their range of use. As the area occupied by the display area of a display device is expanded, various functions that are integrated or linked to the display device are being added. As a means to expand the area and add various functions, research is being conducted on display devices that can accommodate various components within the display area. FIG. 1 is a schematic perspective view of an electronic device according to one embodiment of the present invention. FIG. 2 is a simplified cross-sectional view of a display panel according to one embodiment, and is a cross-sectional view along the line I-I' of FIG. 1. FIG. 3 is a schematic plan view of a display panel according to one embodiment of the present invention. FIG. 4 is an equivalent circuit diagram schematically showing a light-emitting diode and a circuit connected to the light-emitting diode according to one embodiment of the present invention. FIG. 5 is a plan view showing a part of a display panel according to an embodiment of the present invention. FIG. 6 is a cross-sectional view of a display panel according to one embodiment of the present invention, corresponding to the cross-section along the line VI-VI' of FIG. 5. FIG. 7 is a cross-sectional view of a display panel according to one embodiment of the present invention, corresponding to the cross-section along the line VII-VII' of FIG. 5. FIGS. 8 to 11 are cross-sectional views according to the manufacturing process of a display panel according to one embodiment of the present invention. FIG. 12 is a cross-sectional view showing an inner non-display area and an opening area of a display panel according to another embodiment of the present invention. FIG. 13 is a cross-sectional view showing an inner non-display area and an opening area of a display panel according to another embodiment of the present invention. FIG. 14 is a cross-sectional view showing an inner non-display area and an opening area of a display panel according to another embodiment of the present invention. FIG. 15 is a plan view showing a part of a display panel according to one embodiment of the present invention. FIG. 16 is a cross-sectional view showing an inner non-display area and an opening area of a display panel according to another embodiment of the present invention. The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted. In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component. In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise. In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added. In the following embodiments, when a part such as a film, region, or component is described as being on or above another part, it includes not only cases where it is directly on top of another part, but also cases where another film, region, or component is interposed in between. In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated. Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description. In this specification, "A and/or B" indicates the case where it is A, B, or both A and B. And, "at least one of A and B" indicates the case where it is A, B, or both A and B. In t