KR-20260063019-A - Method for manufacturing a smart device flexiblesupport and a flexible smart device support manufactured using the same
Abstract
A method for manufacturing a flexible support for a smart device and a flexible support for a smart device manufactured using the same are provided. A method for manufacturing a flexible support for a smart device according to an embodiment of the present invention, in a method for manufacturing a flexible support for a smart device using a device capable of performing an injection molding process, comprises: a step of creating a wick by performing an aluminum pretreatment process; a step of creating a flexible member by performing PPSU insert injection molding on the wick; and a step of creating a support member by performing silicone insert injection molding on the flexible member.
Inventors
- 추승영
Assignees
- (주)킨폴크
Dates
- Publication Date
- 20260507
- Application Date
- 20241030
Claims (6)
- A method for manufacturing a flexible support for a smart device using a device capable of performing an injection molding process, A step of producing a wick by performing an aluminum pretreatment process; A step of creating the flexible member by performing PPSU insert injection on the above wick; and A method for manufacturing a flexible support for a smart device, comprising the step of creating a support member by performing silicone insert injection on the flexible member.
- In Article 1, The step of creating the above wick is, Step of cutting an aluminum rod to a preset length; Step of straightening the above-mentioned cut aluminum rod; A step of cleaning the surface of the above aluminum rod; A step of performing sandblasting on the cleaned aluminum rod; A step of applying a primer to the aluminum rod after the sandblasting is completed; and A method for manufacturing a flexible support for a smart device, comprising the step of drying an aluminum rod coated with the above primer.
- In Paragraph 2, The step of creating the above flexible member is, Step of performing the above PPSU drying; A step of setting the above-mentioned dried wick inside the first mold; A step of preheating the first mold to a preset temperature; Step of injecting the above PPSU; A step of cooling the above-mentioned injected PPSU for a preset time; and A method for manufacturing a smart device flexible support, comprising the step of discharging the flexible member and performing a quality inspection.
- In Paragraph 3, The step of creating the above-mentioned support member is, A step of setting the above flexible member in a second mold; A step of preheating the second mold; A step of injecting silicone into one end of the above flexible member; A step of cooling the above silicon for a preset time; and A method for manufacturing a flexible support for a smart device, comprising the step of performing a final inspection on the above silicon.
- In Paragraph 4, The step of performing the above sandblasting is, Using 180 to 240 grits, The step of performing the above PPSU drying is, Drying is performed for 4 hours in the range of 160℃ to 170℃, and A method for manufacturing a flexible support for a smart device, wherein the PPSU injection temperature is in the range of 340℃ to 370℃.
- The flexible member manufactured using the method for manufacturing a smart device flexible support according to any one of claims 1 to 5; and A smart device flexible support comprising the above support member provided with a magnetic body.
Description
Method for manufacturing a smart device flexible support and a flexible smart device support manufactured using the same The present invention relates to a method for manufacturing a flexible support for a smart device and a flexible support for a smart device manufactured using the same. In particular, the invention relates to a method for manufacturing a flexible support for a smart device and a flexible support for a smart device manufactured using the same, which can be fixed with sufficient support force on various surfaces using a MagSafe function using magnets, and can also be supported in various places by forming the support flexibly so that it has a sufficient bending angle even in a small pie. Supports with flexible arms are recently being used to mount various smartphones, action cams, smart pads, etc. In particular, as personal shooting devices increase, flexible arms with multiple joint structures are designed to simply mount action cams or wrap around fixed objects such as pillars, and height/angle adjustment can be made more easily than with conventional tripods by bending the joints at desired positions. Because of their high portability, sales and usage have recently increased. However, despite the aforementioned advantages, this flexible arm has the problem that flexibility in the joint area may be reduced and the joint part may break because it is composed of multiple joints. In addition, because it is formed in a joint shape, the bending angle of the joint itself is limited by design, and as a result, there is a problem that it is difficult to fix it to a column with a small diameter. FIG. 1 is a flowchart of a method for manufacturing a smart device flexible support according to an embodiment of the present invention. Figure 2 is a flowchart of step S11 of Figure 1. Figure 3 is a flowchart of step S13 of Figure 1. Figure 4 is a flowchart of step S15 of Figure 1. Figure 5 is a cross-sectional view of a smart device flexible support manufactured using the manufacturing method of Figure 1. FIG. 6 is a cross-sectional view of a support member among the smart device flexible support of FIG. 5. FIG. 7 is a graph showing the ratio of good products by injection temperature in the good product step S153 according to one embodiment of the present invention. FIG. 8 is a graph showing the ratio of good products by injection time according to one embodiment of the present invention. Hereinafter, some embodiments of the present disclosure will be described in detail with reference to the exemplary drawings. In assigning reference numerals to the components of each drawing, the same components may have the same reference numeral as much as possible, even if they are shown in different drawings. Furthermore, in describing the embodiments, if it is determined that a detailed description of related known components or functions may obscure the essence of the technical concept, such detailed description may be omitted. Where terms such as "comprising," "having," or "consisting of" are used in this specification, other parts may be added unless "only" is used. Where a component is expressed in the singular, it may include a plural unless otherwise specified. Additionally, terms such as first, second, A, B, (a), (b), etc., may be used to describe the components of the present disclosure. These terms are used merely to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by such terms. In describing the positional relationship of components, where it is stated that two or more components are "connected," "combined," or "joined," it should be understood that while the two or more components may be directly "connected," "combined," or "joined," they may also be "connected," "combined," or "joined" with other components "intervened." Here, the other components may be included in one or more of the two or more components that are "connected," "combined," or "joined" with one another. In describing the temporal flow relationship regarding components, methods of operation, or methods of production, for example, when the temporal or sequential relationship is described using "after," "following," "next," or "before," it may include cases where the relationship is not continuous unless "immediately" or "directly" is used. Meanwhile, where numerical values or corresponding information regarding a component (e.g., levels, etc.) are mentioned, even without separate explicit notation, the numerical values or corresponding information may be interpreted as including a range of error that may occur due to various factors (e.g., process factors, internal or external shocks, noise, etc.). FIGS. 1 to 4 illustrate an embodiment of a method for manufacturing a flexible support for a smart device according to the present invention. FIG. 1 is a flowchart of a method for manufacturing a flexible support for a smart device according to an embodiment of the